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This paper proposes a model of a coupled inductor which takes into account the influence of frequency, temperature, and a constant component, IDC, of currents in the windings on the parameters of the considered element. A description of the model and methods of measuring parameters of the inductor using an impedance analyzer and a chamber for thermal measurements is given. The obtained results of measurements are compared with the results of calculations proving a satisfactory match.

The thermal management of magnetic components for power electronics is crucial to ensure their reliability. However, conventional thermal models for magnetic components are known to have either poor accuracy or excessive complexity. Contrary to these models, the use of Thermal Resistance Matrices is proposed in this paper instead, which combine both accuracy and simplicity. They are usually used to characterize semiconductor devices, but not for magnetic components. The guidelines to apply Thermal Resistance Matrices for magnetic components are discussed in detail. The accuracy of this model is validated by 3D FEA simulations and experimental results, showing an absolute error lower than 5 ∘C and a relative error between −6.4% and 3.9%, which is outstanding compared to the carried-out literature review.

In this paper, a new thermal model of the inductor is proposed. This model takes into account self-heating in the core and in the winding, and mutual thermal couplings between the mentioned components of the inductor. The form of the elaborated thermal model is presented. In this model, the influence of power dissipated in the core and in the winding of the inductor on the efficiency of heat removal is taken into account. Correctness of the model is verified experimentally for inductors containing ferrite cores of different shapes and dimensions. The good agreement between the results of calculations and measurements is obtained. On the basis of the obtained findings, the influence of volume and the shape of the core on thermal resistances and thermal capacitances occurring in this model is discussed.