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A patent application titled "Plasma Guide Wire" by inventors ICHIKAWA, Tomoki; IWATA, Naozumi; OKAMOTO, Shoma, and assigned to Asahi Intecc Co. Ltd., aims to improve the insulation performance of guide wires used in plasma ablation treatments for conditions like arrhythmia and Chronic Total Occlusion. The invention involves a design with multiple insulating tubes and a gas layer to enhance insulation and flexibility, addressing issues of poor insulation and the need for careful handling of guide wires during procedures. This innovation seeks to advance medical technology in the field of hematology and electronics, benefiting patients undergoing plasma ablation treatments. [Extracted from the article]

A patent application has been submitted for a new actuating element, surgical instrument, and method for manufacturing the actuating instrument. The invention aims to enhance medical instruments by combining mechanical support and electrical isolation. The actuating element consists of a rod, electrical insulation, and a sleeve, with the rod transmitting force, the insulation providing electrical separation, and the sleeve engaging with a securing element of a surgical instrument. The patent application also includes information on the design and manufacturing process of the force transmission element. [Extracted from the article]

A patent application by Nexperia B.V. describes a method for improving the creepage distance in integrated circuit packages, particularly for high voltage devices. Creepage and clearance are critical properties for semiconductor packages, and insufficient creepage can lead to voltage breakdown and device failure. The method involves applying a thin layer of insulating material to the conductive contacts of the package, increasing the creepage distance without significantly affecting thermal properties. The insulating material is selected to have both electrical insulation and thermal conductivity. The patent application provides detailed examples and claims for implementing this method. [Extracted from the article]

A patent has been issued to Fujifilm Corporation for a manufacturing method for a thermal conductive layer, a manufacturing method for a laminate, and a manufacturing method for a semiconductor device. The invention addresses the need for effective heat dissipation in three-dimensionally laminated LSI devices, which can experience increased power consumption and heat generation. The patent describes a method for applying a composition for forming a thermal conductive layer onto a support, ensuring proper thermal conductivity and electrical insulation. The method involves discharging the composition onto the support and reducing the solvent amount in the composition. The patent also includes manufacturing methods for a laminate and a semiconductor device using the thermal conductive layer. [Extracted from the article]

A patent has been issued to Biotronik SE & Co. Kg for a sealing ring made of a high-performance thermoplastic material and liquid silicone. The sealing ring is designed for use in the connection head of an implantable device and aims to provide improved sealing elements and manufacturing methods. The outer ring of the sealing ring is made of a high-performance thermoplastic material, such as a polyaryl, while the inner ring is made of liquid silicone or polyurethane. The rings are arranged with a form fit relative to each other. The patent provides detailed claims and descriptions of the design and construction of the sealing ring. [Extracted from the article]

The implantable electrical connecting device of claim 9, wherein the polymer material comprises an elastomer or a memory polymer or consists of the elastomer or the memory polymer. The implantable electrical connecting device of claim 5, wherein the polymer material comprises an elastomer or a memory polymer or consists of the elastomer or the memory polymer. The implantable electrical connecting device of claim 19, wherein the polymer material comprises an elastomer or a memory polymer or consists of the elastomer or the memory polymer.". [Extracted from the article]

The MR-PET apparatus of claim 31, wherein: the insulation component is configured to electrically insulate the RF coil from the signal shielding component, and the signal shielding component is mechanically attached to the PET detection device. The MR-PET apparatus of claim 25, wherein the RF coil includes a first count of coil units, the PET detection device includes a second count of detection units, and the first count is the same as the second count. The MR-PET apparatus of claim 21, wherein: the insulation component is configured to electrically insulate the RF coil from the signal shielding component, and the signal shielding component is mechanically attached to the PET detection device. The MR-PET apparatus of claim 31, wherein the RF coil includes a first count of coil units, the PET detection device includes a second count of detection units, and the first count is the same as the second count. [Extracted from the article]

"Assuming that a light intensity is 1 when light having a wavelength of 350 nm passes through the fused quartz glass, a light intensity at the local minimum value of transmittance through the fused quartz glass may be 0.95 or less. As will be described in detail later, "fused quartz glass having an absorption band" is fused quartz glass having two contact points at which a transmittance curve and a double tangent of the transmittance curve are in contact with each other in a transmission spectrum of the fused quartz glass, and in which, in a wavelength band between the two contact points, the transmittance curve has a transmittance that is lower than a transmittance on the double tangent. "On the other hand, fused quartz glass generally has lower transmittance of short-wavelength ultraviolet light than the synthetic quartz glass, and is inferior in electrical insulation property and chemical stability. [Extracted from the article]

"Another aspect of the present technology relates to a humidifier including a tub adapted to hold a liquid and a heating apparatus including a thermally conductive hot plate, a heating element, a thermally conductive laminate layer between the hot plate and the heating element, and a protective layer to cover at least the heating element. "Another aspect of the present technology relates to a humidifier including a tub adapted to hold a liquid and a heating apparatus including a thermally conductive hot plate, a heating element, a thermally conductive laminate layer between the hot plate and the heating element, and a protective layer to cover at least the heating element. "Another aspect of the present technology relates to a humidifier including a tub adapted to hold a liquid and a heating apparatus including a thermally conductive hot plate, a heating element, a thermally conductive laminate layer between the hot plate and the heating element, and a protective layer to cover at least the heating element. [Extracted from the article]

In addition, it is also possible to provide a photosensitive resin film and a photosensitive resin film for interlayer insulating layer, each of which contains the photosensitive resin composition, and to provide a multilayered printed wiring board and a semiconductor package, each of which includes an interlayer insulating layer formed of the photosensitive resin composition or the photosensitive resin film. "[12] A photosensitive resin composition for photo via formation, containing the photosensitive resin composition according to any one of the above [1] to [11], "[13] A photosensitive resin composition for interlayer insulating layer, including the photosensitive resin composition according to any one of the above [1] to [11], "[14] A photosensitive resin film including the photosensitive resin composition according to any one of the above [1] to [11], "[15] A photosensitive resin film for interlayer insulating layer, including the photosensitive resin composition according to any one of the above [1] to [11], "[16] A multilayered printed wiring board including an interlayer insulating layer formed of the photosensitive resin composition according to any one of the above [1] to [11], "[17] A multilayered printed wiring board including an interlayer insulating layer formed of the photosensitive resin film according to the above [14]. [Extracted from the article]