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This study evaluated the possibility of producing oriented strand boards (OSB) from non-strand chips. Properties of the produced boards were compared with commercially available OSB/3. Research has shown that replacing the strand chips of external layers with smaller chips allowed for the manufacturing of OSB/3 using chips up to four times shorter than standard strand chips. Oriented strand board manufacturers should consider preparing a new standard and introducing the market to a new type of OSB with very good mechanical properties and made of selected strand chips comprising one of the fractions obtained during screening. [ABSTRACT FROM AUTHOR]

Strand substitution was evaluated for the core of OSB with chips produced by grinding of recycled particleboards and wood waste. All the boards manufactured under laboratory conditions having a share of small chips in the core had high mechanical parameters, thus meeting the requirements of the standard for OSB/3. No significant effect was found of the applied modification of the core on bending strength or modulus of elasticity (MOE) determined for the longer axis. In turn, such properties as modulus of rupture (MOR) and MOE, determined for the shorter axis, as well as internal bond (IB) were rapidly reduced. In the case of boards containing 100% recycled chips in the core, a reduction was found in values of MOR, MOE, and IB by 45%, 30%, and 45%, respectively. In turn, the application of small chips, which previously had not been resinated, makes it possible to manufacture boards with internal bond lower by only 30%, even at the 100% substitution. Application of recycled chips produced by grinding of the P2 type particleboard did not make it possible to manufacture boards meeting the requirements of the standard after the boiling test, irrespective of the amount of small chips added to the core. Boards containing in their core small chips, which previously had not been resinated, had much better properties in this respect, since only in case of 100% substitution the manufactured boards exhibited internal bond after the boiling test lower than the requirements of the standard EN 300. [ABSTRACT FROM AUTHOR]