1. Design, Simulation, Fabrication, and Preliminary Tests of 3D CMS Pixel Detectors for the Super-LHC
- Author
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Thor-Erik Hansen, Daniela Bortoletto, Geir Uri Jensen, Nicolas Lietaer, Trond Andreas Hansen, Gino Bolla, O. Koybasi, Simon Kwan, Anand Summanwar, and Angela Kok
- Subjects
010302 applied physics ,Physics ,Nuclear and High Energy Physics ,Fabrication ,Large Hadron Collider ,Pixel ,Physics::Instrumentation and Detectors ,010308 nuclear & particles physics ,business.industry ,Detector ,01 natural sciences ,Upgrade ,Planar ,Nuclear Energy and Engineering ,0103 physical sciences ,Optoelectronics ,Wafer ,Electrical and Electronic Engineering ,business ,Radiation hardening - Abstract
The Super-LHC upgrade puts strong demands on the radiation hardness of the innermost tracking detectors of the CMS, which cannot be fulfilled with any conventional planar detector design. The so-called 3D detector architectures, which feature columnar electrodes passing through the substrate thickness, are under investigation as a potential solution for the closest operation points to the beams, where the radiation fluence is estimated to reach 10(16) n(eq)/Tcm(2). Two different 3D detector designs with CMS pixel readout electronics are being developed and evaluated for their advantages and drawbacks. The fabrication of full-3D active edge CMS pixel devices with p-type substrate has been successfully completed at SINTEF. In this paper, we study the expected post-irradiation behaviors of these devices with simulations and, after a brief description of their fabrication, we report the first leakage current measurement results as performed on wafer.
- Published
- 2010