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The recent developments in the field of large area, flexible and printed electronics have fueled substantial advancements in Laser Printing and Laser Sintering, which have been attracting interest over the past decade. Resulting applications, ranging from flexible displays and sensors, to biometric devices and healthcare, have already showcased transformational advantages in terms of form factor, weight and durability. In HiperLAM project, Laser-Induced Forward Transfer (LIFT), combined with high speed laser micro-sintering are employed, as digital microfabrication tools for the demonstration of fully functional RFID antennas and fingerprint sensors based on highly viscous Ag and Cu nanoparticle inks. Having previously successfully demonstrated complex structures, this work's focus is on increasing the process throughput and yield by increasing the laser repetition rate (up to 40 kHz) and scanning speed (up to 2 m/s), without compromising reliability and resolution. In order to gain insight into the effects of the incremented repetition rate on the printing procedure, the latter was monitored in real time via a high-speed camera, able to acquire up to 540.000 fps, coupled to the setup. Examples of resulting structures comprise well-defined interdigitated and spiral micro-electrodes with post-sintering electrical resistivity lower than 5 x bulk Ag and 3 x bulk Cu. The aforementioned results validate the compatibility of laser based processing with the field of flexible RFID tags and OTFT based fingerprint sensors and foster the wider adoption of LIFT and laser micro-sintering technology for laboratory and industrial use.

While much of the OTFT activity has been display-centric there is no doubt that as the OTFT technology matures the number of applications will continue to increase. Using our most recent flexible X-ray detectors we will discuss the prospect and challenges of organic transistors in sensor backplanes. For these application, the current mobility of ~0.1-2 cm2/Vs of OTFTs is currently not a problem. Their low leakage currents give them a distinct advantage over competing technologies, such as amorphous silicon TFT. Yet, challenges remain and these will be discussed.

For decades, the electronics industry has been accurately described by Moore’s Law, where the march towards increasing density and smaller feature sizes has enabled continuous cost reductions and performance improvements. With flexible electronics, this perpetual scaling is not foreseen to occur. Instead, the industry will be dominated by Wright’s Law, first proposed in 1936, where increasing demand for high volumes of product will drive costs down. We have demonstrated thin film based circuitry compatible with flexible substrates with high levels of functionality designed for such a high volume industry. This includes a generic 8-bit microprocessor totaling more than 3.5k TFTs operating at 2.1 kHz. We have also developed a post fabrication programming technique via inkjet printing of conductive spots to form a one-time programmable instruction generator, allowing customization of the processor for a specific task. The combination demonstrates the possibility to achieve the high volume production of identical products necessary to reap the benefits promised by Wright’s Law, while still retaining the individualization necessary for application differentiation. This is of particular importance in the area of item level identification via RFID, where low cost and individualized identification are necessary. Remotely powered RFID tags have been fabricated using an oxide semiconductor based TFT process. This process is compatible with the post-fabrication printing process to detail individual identification codes, with the goal of producing low cost, high volume flexible tags. The goal is to produce tags compatible with existing NFC communication protocols in order to communicate with readers that are already ubiquitous in the market.