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Ultra-narrow linewidth tunable hybrid integrated lasers are built from a combination of indium phosphide (InP) and silicon nitride-based TriPleX™. By combining the active functionality of InP with the ultra-low loss properties of the TriPleX™ platform narrow linewidth lasers in the C-band are realized. The InP platform is used for light generation and the TriPleX™ platform is used to define a long cavity with a wavelength-selective tunable filter. The TriPleX™ platform has the ability to adapt mode profiles over the chip and is extremely suitable for mode matching to the other platforms for hybrid integration. The tunable filter is based on a Vernier of micro-ring resonators to allow for single-mode operation, tunable by thermo-optic or stress-induced tuning. This work will show the operational principle and benefits of the hybrid lasers and the state of the art developments in the realization of these lasers. High optical powers ( >100 mW) are combined with narrow linewidth (< 1 kHz) spectral responses with tunability over a large (>100 nm) wavelength range and a low relative intensity (< -160 dB/Hz).Ultra-narrow linewidth tunable hybrid integrated lasers are built from a combination of indium phosphide (InP) and silicon nitride-based TriPleX™. By combining the active functionality of InP with the ultra-low loss properties of the TriPleX™ platform narrow linewidth lasers in the C-band are realized. The InP platform is used for light generation and the TriPleX™ platform is used to define a long cavity with a wavelength-selective tunable filter. The TriPleX™ platform has the ability to adapt mode profiles over the chip and is extremely suitable for mode matching to the other platforms for hybrid integration. The tunable filter is based on a Vernier of micro-ring resonators to allow for single-mode operation, tunable by thermo-optic or stress-induced tuning. This work will show the operational principle and benefits of the hybrid lasers and the state of the art developments in the realization of these lasers. High optical powers ( >100 mW) are combined with narrow linewidth (< 1 kHz) spectral responses with tunability over a large (>100 nm) wavelength range and a low relative intensity (< -160 dB/Hz).

Photonic Integrated Circuit (PIC) technology is becoming more and more mature and the three main platforms that offer Multi Project Wafer runs (Indium Phosphide (InP), Silicon on Insulator (SOI) and the silicon nitride based TriPleX platform) each have their own unique selling points. New disruptive PIC based modules are enabled by combinations of the different platforms complementing each other in performance. In particular the InP-TriPleX combination are two very complementary technologies. Combining them together yields for instance tunable ultra-narrow linewidth lasers extremely suitable for telecom and sensing applications. Also microwave photonics modules for Optical Beam Forming Networks and 5G communication can, and have been realized with this combination. Important part of this combination is the integration of the different platforms in modules via cost effective assembly techniques. This talk will present the combination of both technologies, the interconnection issues faced in the assembly process and latest measurement results on these hybrid integrated devices.

Over the past few years considerable attention has been focussed on the inclusion of flexibility in communication satellite payloads. The purpose of this flexibility is to enable a given satellite on command to support different frequency plans, re-configure coverage in response to changing traffic demands and re-configure interconnectivity between coverages.

In this article a selection of highlights of the TriPleX™ technology of LioniX is given. The basic waveguide technology is explained with recent benchmark measurements done by University California Santa Barbara (UCSB) and University Twente (UT-TE). In order to show the low loss transparency over a wide wavelength range three examples of applications in different wavelength regimes are described in more detail. These are the Integrated Laser Beam Combiner (ILBC) of XiO Photonics in the visible light, a ringresonator sensing platform of LioniX around 850 nm and a phased array antenna with an Optical Beam Forming Network in the 1550 nm band. Furthermore it is shown that the technology is easily accessible via Multi Project Wafer Runs for which the infrastructure and design libraries are also set up.