1. Effect of Potting Encapsulation on Crack Formation and Propagation in Electronic Package
- Author
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Jalar, Azman, Zain, Syed Mohamad Mardzukey Syed Mohamed, Ani, Fakhrozi Che, Ramli, Mohamad Riduwan, Bakar, Maria Abu, Kacprzyk, Janusz, Series Editor, Pal, Nikhil R., Advisory Editor, Bello Perez, Rafael, Advisory Editor, Corchado, Emilio S., Advisory Editor, Hagras, Hani, Advisory Editor, Kóczy, László T., Advisory Editor, Kreinovich, Vladik, Advisory Editor, Lin, Chin-Teng, Advisory Editor, Lu, Jie, Advisory Editor, Melin, Patricia, Advisory Editor, Nedjah, Nadia, Advisory Editor, Nguyen, Ngoc Thanh, Advisory Editor, Wang, Jun, Advisory Editor, Mat Jizat, Jessnor Arif, editor, Khairuddin, Ismail Mohd, editor, Mohd Razman, Mohd Azraai, editor, Ab. Nasir, Ahmad Fakhri, editor, Abdul Karim, Mohamad Shaiful, editor, Jaafar, Abdul Aziz, editor, Hong, Lim Wei, editor, Abdul Majeed, Anwar P. P., editor, Liu, Pengcheng, editor, Myung, Hyun, editor, Choi, Han-Lim, editor, and Susto, Gian-Antonio, editor
- Published
- 2021
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