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1. Effect of Potting Encapsulation on Crack Formation and Propagation in Electronic Package

2. Effect of Moisture Content on Crack Formation During Reflow Soldering of Ball Grid Array (BGA) Component

5. Flux Modification for Wettability and Reliability Improvement in Solder Joints

6. The Effect of Isothermal Ageing Treatment on Different PCB Surface Finishes: Simulation and Experimental

7. Solder Paste’s Rheology Data for Stencil Printing Numerical Investigations

8. Surface Modifications on Ceramic Reinforcement for Tin-Based Composite Solders

9. The Effect of Laser Soldering onto Intermetallic Compound Formation, Growth

10. Reliability Analysis on the Flexible Printed Circuit Board After Reflow Soldering

11. Tin Whiskers Growth in Electronic Assemblies

12. Advancement of Printed Circuit Board (PCB) Surface Finishes in Controlling the Intermetallic Compound (IMC) Growth in Solder Joints

13. Development of Geopolymer Ceramic-Reinforced Solder

14. Significance of Intermetallic Compound (IMC) Layer to the Reliability of a Solder Joint, Methods of IMC Layer Thickness Measurements

15. Molecular Dynamic of the Nanoparticle Reinforcement in the Pb-Free Solder During Reflow Soldering Process

16. Recent Studies in the Development of Ceramic-Reinforced Lead-Free Composite Solder

17. Properties of Sn0.7Cu Solder Alloys Bearing Fe and Bi

18. Advanced Assembly of Miniaturized Surface Mount Technology Components Using Nano-reinforced Solder Paste

19. Recent Progress in Transient Liquid Phase (TLP) Solder for Next Generation Power Electronics

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