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This paper presents a vacuum encapsulation technique and stability characterization for MEMS resonator. Sn-rich Au-Sn solder bonding is used to achieve reliable hermetic packaging with high shear strength. Simple planar feedthrough structure is utilized to achieve electrical interconnection and low cost of packaging. The stabilities of the encapsulated resonator are systematically studied, including frequency stability, temperature stability, long-term hermeticity, and mechanical reliability. The short-term and medium-term frequency stability are ± 0.4 and ± 3 ppm, respectively. The temperature cycle test is introduced between − 20 and 80 °C, and the resonant-frequency drift of the packaged resonator is within ± 4 ppm between 40 temperature cycles. Furthermore, the packaged resonator is temperature compensated by micro-oven, which obtained a frequency stability range of ± 13 ppm between 20 and 100 °C. The packaged resonator shows favorable long-term stability of the Q-factor over 200 days and average shear strength of 43.93 MPa among 12 samples. [ABSTRACT FROM AUTHOR]

This paper presents a novel digitally tunable micro-electro-mechanical systems disk resonator with multiple split electrodes. Multiple whispering gallery modes (WGM) can be excited with various electrode combinations and different frequencies output are obtained by this simple digital-tuning scheme with one resonator. For a disk resonator of 32 μm in radius with 12 electrodes, resonance frequencies of 71-171 MHz are obtained by changing the electrode connections. An 12th WGM's has been achieved in the paper with a frequency of 313 MHz. This digitally tunable resonator device could simplify the frequency switching unit of a system clock, and dramatically reduce the power consumption of a digital system. [ABSTRACT FROM AUTHOR]