1. Modulation of the electromagnetic shielding effectiveness through micro/macrostructure design for electronic packaging.
- Author
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Guan, Lizhi, Fan, Jingbo, Ng, Zhi Kai, Teo, Edwin Hang Tong, and Le Ferrand, Hortense
- Subjects
ELECTRONIC packaging ,PACKAGING design ,ELECTROMAGNETIC shielding ,ELECTRONIC systems ,THREE-dimensional printing ,ELECTROMAGNETIC interference ,PACKAGING materials - Abstract
Lightweight electronic packaging that provides mechanical protection, cooling ability, and customizable electromagnetic interference (EMI) shielding effectiveness (SE) is needed for next-generation electronics. Although electronic packaging solutions with excellent EMI SE exist, there is limited research on how hierarchical design can modulate the EMI SE of an electronic packaging material on demand. In this study, the deliberate precise micro/macrostructure design of graphite-based materials using magnetically assisted 3D printing allows tuning of the EMI SE in the X band (8–12 GHz), leading to a maximum total shielding performance of 90 dB. Aligning high-density graphite microplatelets during 3D printing also remarkably amplified the total SE by 200%. Subsequently, rationally designing the oriented microstructure within a geometrical shape increases the reflection and improves the EMI SE from 40 to 60 dB in a specific direction. Our proof-of-concept samples demonstrate the potential of precise micro/macrostructure design for customizing and enhancing electronic packaging's EMI SE while achieving good heat dissipation and mechanical protection using a versatile 3D printing method. These advances pave the way for more reliable and safer electronic systems. Magnetically assisted 3D printing allows customizable electromagnetic interference (EMI) shielding effectiveness (SE). Aligning high-density graphite microplatelets during the 3D printing parallel or perpendicularly to incident waves leads to their tailored reflection and transmission. Designing the micro/macrostructure of materials allows customization and enhancement of electronic packaging's EMI SE while achieving good heat dissipation and mechanical protection. These advances pave the way for more reliable and safer electronic systems. [ABSTRACT FROM AUTHOR]
- Published
- 2024
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