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This paper presents a novel approach for removing out-of-plane deformation in stretched metal interconnects by adding a fractal structure to the original meander shape and using an optimized fabrication stack. In thermoformed electronics, in cases where copper is used as conductor, the twisting of meander-shaped structures caused by excessive mechanical stress can cause a non-uniform surface, delamination of the metal interconnect from the substrate, and in some cases, a short circuit to the adjacent tracks. Typically, designers of stretchable electronics use various shapes and widths of the copper interconnect to tackle this issue. Using conventional meander shapes such as horseshoes and U-shapes is not universally practical, especially when stretching is higher than 30 percent leading to significant out-of-plane buckling. Limiting this out-of-plane buckling by reducing the track width is not always applicable, as a minimum width is needed from a technology and conductivity perspective. The presented approach is inspired by computational and experimental studies of multiple meander shapes and fabrication methods. A geometry- and fabrication-based approach is presented, reducing the mechanical stress of almost all possible meander shapes by increasing the meander's path length to accommodate the metal track's produced torque during stretching. An analytical approach is provided for calculating the optimal meander parameters and the optimal fabrication stack is achieved based on simulation results. Experiments and finite element modeling for a case study show the improvement in the stress distribution and reduction of out-of-plane buckling. [ABSTRACT FROM AUTHOR]

Objectives: In this paper, the effect of the position of the inlet and outlet microchannels on the flow profile and the geometry of the recognition chamber for sample pre-treatment in an electrochemical biosensor to be used in osteoporosis management were investigated. Methods: All numerical computation presented in this work were performed using COMSOL Multiphysics and Fluent. Simulation was performed for a three-dimensional, incompressible Navier–Stokes flow and so explicit biphasic volume of fluid (VOF) equations were used. Results: In the designed microfluidic system, a pressure-driven laminar flow with no-slip boundary condition was responsible for fluid actuation through microchannels in a reproducible approach. Based on the simulation results, the number of outlets was increased and the angel through which the inlets and outlets were attached to the microchamber was changed so that the dead volume would be eliminated and the fluid flow trajectory, the velocity field and pressure were evenly distributed across the chamber. The Re number in the inlets was equal to 4.41, suggesting a laminar flow at this site. Conclusion: The simulation results along with the fact that the design change was tested using laser ablated tape and a color dye at different steps provided the researchers with the opportunity to study the changes in a fast and accurate but cheap method. The absence of backflow helps with the cross-talk concern in the channels and the lack of bubbles and complete coverage of the chamber helps with a better surface modification and thus better sensing performance. [ABSTRACT FROM AUTHOR]

Conventional electronic circuits are made up of electronic components assembled on either rigid substrates like FR4 and ceramic or on flexible substrates based on polymers such as polyimide, PET and PEN foils. The latter type of substrates offers considerable improvements in freedom of motion over its rigid complement although the deformations are still pretty limited due to the inability of common electronic materials, such as metals, to cope with the corresponding deformation. Moreover, the assembly of rigid electronic components can often reduce the circuit’s ability to bend. The current trend towards increased component density on substrates makes the final assembly even less flexible. However, electronic circuits which can fully conform and easily fit in the arbitrary curved surface topologies are of keen interest in various areas of applications. Aside from flexibility, a certain degree of stretching is required for the three-dimensional shaping of electronic systems. Hence, deformability will offer electronics a number of additional features like bendability, conformability shaping and lightweight. Three-dimensional shaped electronics can be obtained either by multi-time (dynamic or elastic) or one time (static, permanent) stretching. In this paper an introduction on deformable and conformable electronics is outlined highlighting the different existing approaches. Some examples of flexible and stretchable electronic applications will be provided in various fields. [ABSTRACT FROM AUTHOR]

This article explains a step-wise protocol to develop an electrochemical sensor to quantify serum levels of C-telopeptide (CTX) crosslinks also known as crosslaps in a matter of minutes and with high level of accuracy. The technique needs only one-step (incubation) and can thus be used for point of care screening. Due to the excellent electrical properties of the as-prepared immunosensor, CTX levels were successfully measured from 1 to 1000 pg/mL. This is while the normal reference of the marker is 50-450 pg/mL, suggesting that the sensor can acceptably detect CTX. The results also showed a good correlation with ECLIA in measuring serum levels of CTX. [ABSTRACT FROM AUTHOR]

Silver nanowires (AgNWs) have emerged as a promising nanomaterial for next generation stretchable electronics. However, until now, the fabrication of AgNWbased components has been hampered by complex and time-consuming steps. Here, we introduce a facile, fast, and one-step methodology for the fabrication of highly conductive and stretchable AgNW/polyurethane (PU) composite electrodes based on a high-intensity pulsed light (HIPL) technique. HIPL simultaneously improved wire-wire junction conductivity and wire-substrate adhesion at room temperature and in air within 50 μs, omitting the complex transfer-curing-implanting process. Owing to the localized deformation of PU at interfaces with AgNWs, embedding of the nanowires was rapidly carried out without substantial substrate damage. The resulting electrode retained a low sheet resistance (high electrical conductivity) of <10 Ω/sq even under 100% strain, or after 1,000 continuous stretching-relaxation cycles, with a peak strain of 60%. The fabricated electrode has found immediate application as a sensor for motion detection. Furthermore, based on our electrode, a light emitting diode (LED) driven by integrated stretchable AgNW conductors has been fabricated. In conclusion, our present fabrication approach is fast, simple, scalable, and costefficient, making it a good candidate for a future roll-to-roll process. [Figure not available: see fulltext.] [ABSTRACT FROM AUTHOR]

Wireless sensor networks have found their way to countless applications in many different fields. Due to the restricted power availability these systems are faced with, custom wireless protocols have been designed. Many different protocols have already been conceived, yet each application will impose different requirements. In inertial motion tracking, sensor nodes are applied on the body allowing full body posture reconstruction. These nodes must not hinder or restrict the movements of the user in any way, meaning that a wireless approach is desirable. A suiting protocol that insures robust simultaneous functionality of at least 15 nodes at a rate of 100Hz is required. A TDMA based protocol with master/slave hierarchy is presented for the application at hand. Nodes dynamically decide on their role within the network at startup and reassess the network state regularly. Conflicting situations are handled whenever they arise and nodes react accordingly creating a fully plug-and-play system. Careful implementation of the protocol in embedded software allows data transmission of 19 nodes while each of them consumes an average current of only 3mA. [ABSTRACT FROM AUTHOR]

In in-vivo microsystems, one of the components is a biocompatible micropump in order to produce the necessary force to deliver the fluid from the inlet to the outlet. In this contribution, a flexible micropump is fabricated which is aimed to be suitable in drug delivery applications. It provides high degree of biocompatibility, since the only employed materials are implantation grade polydimethylsiloxane elastomer and gold for the electrical interconnects. The working principle of the micropump is based on transverse DC electroosmosis which is a new variant of conventionally applied high voltage DC electroosmosis. This new technique is based on topography irregularities introduced in the channel resulting in a non-uniform charge distribution. The advantage is to drive the micropump using a relatively low DC voltage of 10 V while getting an effective flow speed of 60 μm/s. In order to characterize the flow speed, dyed 3 μm beads are dispersed in the working fluid and their speed is measured by the line scanning technique using a confocal microscope. It is also observed that the flow has a helical profile which is an attractive feature for an efficient micro-mixer in active microfluidics and μ-TAS applications. [ABSTRACT FROM AUTHOR]

Electronic devices capable of performing in extreme mechanical conditions such as stretching, bending, or twisting will improve biomedical and wearable systems. The required capabilities cannot be achieved with conventional building geometries, because of structural rigidity and lack of mechanical stretchability. In this article, a zigzag-patterned structure representing a stretchable interconnect is presented as a promising type of building block. In situ experimental observations on the deformed interconnect are correlated with numerical analysis, providing an understanding of the deformation and failure mechanisms. The experimental results demonstrate that the zigzag-patterned interconnect enables stretchability up to 60% without rupture. This stretchability is accommodated by in-plane rotation of arms and out-of-plane deformation of crests. Numerical analysis shows that the dominating failure cause is interfacial in-plane shear stress. The plastic strain concentration at the arms close to the crests, obtained by numerical simulation, agrees well with the failure location observed in the experiment. [ABSTRACT FROM AUTHOR]