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Thin‑film silicon solar cells based on hydrogenated amorphous silicon (a‑Si:H) and hydrogenated microcrystalline silicon (μc‑Si:H) absorber layers are typically deposited using static plasma-enhanced chemical vapor deposition (PECVD) processes. It has been found that the use of very‑high frequencies (VHF) is beneficial for the material quality at high deposition rates when compared to radio-frequency (RF) processes. In the present work a dynamic VHF‑PECVD technique using linear plasma sources is developed. The linear plasma sources facilitate the use of very-high excitation frequencies on large electrode areas without compromising on the homogeneity of the deposition process. It is shown that state-of-the-art a‑Si:H and μc‑Si:H single-junction solar cells can be deposited incorporating intrinsic layers grown dynamically by VHF-PECVD at 0.35 nm/s and 0.95 nm/s, respectively.

Hydrogenated microcrystalline silicon has recently emerged as a promising material system for large-area electronic applications such as thin-film transistors and solar cells. In this paper, thin-film transistors based on microcrystalline silicon were realized with charge carrier mobilities exceeding 40 cm(2)/Vs. The electrical characteristics of the microcrystalline silicon thin-film transistors are limited by the influence of contact effects. The influence of the contact effects on the charge carrier mobility was investigated for transistors with different dimensions of the drain and source contacts. The experimental results were compared to an electrical model which describes the influence of the drain and source contact dimension on the transistor parameters. Furthermore, the Transmission Line Method was applied to investigate the contact effects of the thin-film transistors with different drain and source contact dimensions. Finally, optimized device geometries like the channel length of the transistor and dimension of the drain and source contacts were derived for the microcrystalline transistors based on the electrical model.

A novel setup for Raman measurements under small angles of incidence during the parallel plate plasma enhanced chemical vapor deposition of μc-Si:H films is described. The possible influence of disturbances introduced by the setup on growing films is studied. The substrate heating by the probe beam is investigated and reduced as far as possible. It is shown that with optimized experimental parameters the influence of the in-situ measurements on a growing film can be neglected. With optimized settings, in-situ Raman measurements on the intrinsic layer of a microcrystalline silicon solar cell are carried out with a time resolution of about 40 s corresponding to 20 nm of deposited material during each measurement.

We report on a direct comparison of the effect of the atmospheric contaminants on a-Si:H and μc-Si:H p-i-n solar cells deposited by plasma-enhanced chemical vapor deposition (PECVD) at 13.56 MHz. Nitrogen and oxygen were inserted by two types of controllable contamination sources: (i) directly into the plasma through a leak at the deposition chamber wall or (ii) into the process gas supply line. Similar critical concentrations in the range of 4-6×1018 cm-3 for nitrogen and 1.2-5×1019 cm-3 for oxygen were observed for both a-Si:H and μc-Si:H cells for the chamber wall leak. Above these critical concentrations the solar cell efficiency decreases for a-Si:H solar cells due to losses in the fill factor under red light illumination (FFred). For μc-Si:H cells the losses in FFred and in short-circuit current density deteriorate the device performance. Only for a-Si:H the critical oxygen concentration is found to depend on the contamination source. Conductivity measurements suggest that at the critical oxygen concentration the Fermi level is located about 0.05 eV above midgap for both a-Si:H and μc-Si:H.

Microcrystalline silicon (μc-Si:H) thin-film transistors (TFTs) have lately gained much attention due to their high charge carrier mobilities. We report on top-gate μc-Si:H TFTs fabricated by plasma-enhanced chemical vapor deposition at process temperatures below 180 °C with high electron and hole charge carrier mobilities exceeding 50 cm2/Vs and 12 cm2/Vs, respectively. Based on the μc-Si:H TFTs different thin-film inverters were realized including ambipolar and complimentary metal-oxide-semiconductor (CMOS) inverters. Microcrystalline CMOS inverters exhibit high voltage gains exceeding 22, whereas ambipolar inverters show reduced voltage gains of 10 at low operating voltages. The electrical characteristics of the μc-Si:H CMOS and ambipolar thin-film inverters will be discussed in terms of the voltage transfer curve, the voltage gain and the power dissipation.