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This paper describes the fabrication, and structural and electrical characterization of a new, aerosol-nanocrystal floating-gate FET, aimed at non-volatile memory (NVM) applications. This aerosol- nanocrystal NVM device features program/erase characteristics comparable to conventional stacked gate NVM devices, excellent endurance (>105 P/E cycles), and long-term non-volatility in spite of a thin bottom oxide (55-60Å). In addition, a very simple fabrication process makes this aerosol-nanocrystal NVM device a potential candidate for low cost NVM applications.

This article reviews technology issues in scaling conventional planar transistors to a physical gate length of 30nm that are expected to produce an effective channel length of 10 nm. Gate fabrication features direct write e-beam lithography to form a ring structure capable of exploring the practical limits of gate processing while requiring only a single level of lithography. Other processing elements include ultra-thin gate dielectric formation (∼ 0.6nm); highly selective transformer coupled plasma (TCP) etching; and low energy ion implantation. DC electrical results obtained for high performance n-MOS and p-MOS type nanotransistors made using this process are discussed as are simulations of sub-threshold currents for n-MOS transistors with physical gate lengths down to 26nm