56 results on '"Lee, Hyuck"'
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2. Decision Making for Collision Avoidance Systems Considering a Following Vehicle
3. Intimate atomic Cu-Ag interfaces for high CO2RR selectivity towards CH4 at low over potential
4. Microstructure Modification of Liquid Phase Sintered Fe–Ni–B–C Alloys for Improved Mechanical Properties
5. Accelerated mapping of electronic density of states patterns of metallic nanoparticles via machine-learning
6. Highly active and stable stepped Cu surface for enhanced electrochemical CO2 reduction to C2H4
7. Perovskite-polymer composite cross-linker approach for highly-stable and efficient perovskite solar cells
8. Wireless bioresorbable electronic system enables sustained nonpharmacological neuroregenerative therapy
9. A combinatorial approach for the synthesis and analysis of AlxCryMozNbTiZr high-entropy alloys: Oxidation behavior
10. Design of emergency braking algorithm for pedestrian protection based on multi-sensor fusion
11. Uniform thin film electrode made of low-temperature-sinterable silver nanoparticles: optimized extent of ligand exchange from oleylamine to acrylic acid
12. Predictive risk factors for Listeria monocytogenes meningitis compared to pneumococcal meningitis: a multicenter case–control study
13. Fabrication of sintering-free flexible copper nanowire/polymer composite transparent electrodes with enhanced chemical and mechanical stability
14. Recrystallization as a Growth Mechanism for Whiskers on Plastically Deformed Sn Films
15. Study of Shallow Backside Junctions for Backside Illumination of CMOS Image Sensors
16. Effects of Be and Co addition on the growth of Sn whiskers and the properties of Sn-based Pb-free solders
17. Synthesis and characterization of highly conductive Sn–Ag bimetallic nanoparticles for printed electronics
18. Is adjunctive corticosteroid beneficial in pneumococcal meningitis in a region with high rates of resistance to penicillin and ceftriaxone?
19. A Simple Process for Synthesis of Ag Nanoparticles and Sintering of Conductive Ink for Use in Printed Electronics
20. Crystal orientation of β-Sn grain in Ni(P)/Sn–0.5Cu/Cu and Ni(P)/Sn–1.8Ag/Cu joints
21. Phase Equilibria in the Sn-Ni-Zn Ternary System: Isothermal Sections at 200°C, 500°C, and 800°C
22. Electromigration performance of Pb-free solder joints in terms of solder composition and joining path
23. The Crystal Orientation of β-Sn Grains in Sn-Ag and Sn-Cu Solders Affected by Their Interfacial Reactions with Cu and Ni(P) Under Bump Metallurgy
24. Interfacial Reactions and Microstructures of Sn-0.7Cu-xZn Solders with Ni-P UBM During Thermal Aging
25. Wetting Properties and Interfacial Reactions of Mechanically Alloyed Cu5Zn8-Bearing Pb-Free Solders on a Copper Substrate
26. Effects of under bump metallization and nickel alloying element on the undercooling behavior of Sn-based, Pb-free solders
27. An Investigation of Microstructure and Microhardness of Sn-Cu and Sn-Ag Solders as Functions of Alloy Composition and Cooling Rate
28. Effects of Co Addition on Bulk Properties of Sn-3.5Ag Solder and Interfacial Reactions with Ni-P UBM
29. Undercooling and microhardness of Pb-free solders on various under bump metallurgies
30. Demonstration and Characterization of Sn-3.0Ag-0.5Cu/ Sn-57Bi-1Ag Combination Solder for 3-D Multistack Packaging
31. Effects of Minor Additions of Zn on Interfacial Reactions of Sn-Ag-Cu and Sn-Cu Solders with Various Cu Substrates during Thermal Aging
32. Thermodynamic Assessment of the Ni-Bi Binary System and Phase Equilibria of the Sn-Bi-Ni Ternary System
33. Foreword
34. Phytosphingosine-1-phosphate stimulates chemotactic migration of L2071 mouse fibroblasts via pertussis toxin-sensitive G-proteins
35. Comparison of Sn2.8Ag20In and Sn10Bi10In solders for intermediate-step soldering
36. Foreword
37. Interfacial reaction between 42Sn-58Bi solder and electroless Ni-P/immersion Au under bump metallurgy during aging
38. Foreword
39. Effect of cooling rate on growth of the intermetallic compound and fracture mode of near-eutectic Sn-Ag-Cu/Cu pad: Before and after aging
40. Morphological transition of interfacial Ni3Sn4 grains at the Sn-3.5Ag/Ni joint
41. Molecular dynamics simulation of zigzag single-walled carbon nanotube closing mechanisms
42. Three-dimensional monte-carlo simulation of grain growth in Pt-Co thin film
43. A thermodynamic study of phase equilibria in the Au-Sb-Sn solder system
44. Grain Morphology of Intermetallic Compounds at Solder Joints
45. Interfacial Microstructure and Joint Strength of Sn–3.5Ag–X (X = Cu, In, Ni) Solder Joint
46. Effect of soldering and aging time on interfacial microstructure and growth of intermetallic compounds between Sn-3.5Ag solder alloy and Cu substrate
47. Alloy design of intermetallic dispersion strengthened aluminum systems by mechanical alloying for high temperature applications
48. Relationship between domain structure and film thickness in epitaxial PbTiO3 films deposited on MgO(001) by reactive sputtering
49. Effect of Ni layer thickness and soldering time on intermetallic compound formation at the interface between molten Sn-3.5Ag and Ni/Cu substrate
50. Investigation of the phase equilibria in the Sn-Bi-In alloy system
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