1. A novel approach to dissimilar joining of AA7075 to AZ31B by friction stir soldering using Sn intermediate layer.
- Author
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Karimi-Dermani, Omid, Abbasi, Alireza, Azimi Roeen, Ghasem, and Nayyeri, Mohammad Javad
- Subjects
SOLDER & soldering ,TIN ,FRICTION ,SOLID solutions ,SHEAR strength ,COPPER-tin alloys - Abstract
The dissimilar joining of 7075 to AZ31 by the friction stir soldering (FSS) process using a Sn interlayer was performed for the first time. The most appropriate microstructure with the highest shear strength was obtained by the one-pass FSS process via a 120 μm-thick intermediate layer. In the optimum situation, the 7075/solder interface was covered with an uninterrupted wavy layer of Sn solid solution, whereas the AZ31/Solder interface was covered with a thin intermetallic region (IMC) consisting of fine-Mg
2 Sn intermetallics distributed in an Mg2 Sn + βSn eutectic matrix. The thickness of the IMC region increased with the decreasing thickness of the intermediate layer and/or the increasing FSS passes, leading to the deterioration of the joint strength. No Al-Mg intermetallics were detected on either the retreated or the advanced side of the one-pass joints; however, isolated Islands and a continuous network of Al-Mg intermetallics were identified at the advanced and retreated sides of the three-pass joints, respectively. In comparison with the advanced side, the retreated side contained a thinner tin-rich solid solution and a thicker IMC region. Moreover, the probability of crack formation or creation of brittle Al-Mg intermetallics on the retreated side was more than those on the advanced side. [ABSTRACT FROM AUTHOR]- Published
- 2022
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