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Extreme cooling rates during physical vapor deposition (PVD) allow growth of metastable phases. However, we propose that reactive PVD processes can be described by a gas–solid paraequilibrium defining chemical composition and thus point defect concentration. We show that this notion allows for point defect engineering by controlling deposition conditions. As example we demonstrate that thermal stability of metastable (Ti,Al)Nx, the industrial benchmark coating for wear protection, can be increased from 800°C to unprecedented 1200°C by minimizing the vacancy concentration. The thermodynamic approach formulated here opens a pathway for thermal stability engineering by point defects in reactively deposited thin films. IMPACT STATEMENT A novel thermodynamic methodology to predict stoichiometry of coatings is utilized to increase thermal stability of today’s industrial benchmark hard coating TiAlN from 800°C to 1200°C by point defect engineering. [ABSTRACT FROM PUBLISHER]

A method to model the metastable phase formation in the Cu–W system based on the critical surface diffusion distance has been developed. The driver for the formation of a second phase is the critical diffusion distance which is dependent on the solubility of W in Cu and on the solubility of Cu in W. Based on comparative theoretical and experimental data, we can describe the relationship between the solubilities and the critical diffusion distances in order to model the metastable phase formation. Metastable phase formation diagrams for Cu–W and Cu–V thin films are predicted and validated by combinatorial magnetron sputtering experiments. The correlative experimental and theoretical research strategy adopted here enables us to efficiently describe the relationship between the solubilities and the critical diffusion distances in order to model the metastable phase formation during magnetron sputtering. [ABSTRACT FROM PUBLISHER]