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Your search keyword '"Bernard Previtali"' showing total 6 results
Start Over Author "Bernard Previtali" Publisher the japan society of applied physics
6 results on '"Bernard Previtali"'

1. Integration of Low Temperature 480℃ SiOCN as Offset Spacer in view of 3D Sequential Integration

Author

A. Michallet, C. Bout, J. Fort, T. Skotnicki, V. Beugin, F. Pierre, D. Benoit, L. Brunet, P. Besson, C. Arvet, M.-P. Samson, C. Tabone, N. Rochat, C.-M. V. Lu, V. Loup, Perrine Batude, C. Fenouillet-Beranger, N. Posseme, Bernard Previtali, A. Roule, and M Vinet

Subjects
Offset (computer science), Materials science, business.industry, Optoelectronics, business
Published
2016

2. Influence of Low Thermal Budget Plasma Oxidation and Millisecond Laser Anneal on Gate Stack Reliability in view of 3D Sequential Integration

Author

H. Graoui, C. Guedj, R. Gassilloud, Cédric Leroux, C.-M. V. Lu, S. Sharma, M.-P. Samson, T. Skotnicki, R. Kies, Perrine Batude, N. Rambal, Bernard Previtali, C. Fenouillet-Beranger, L. Brunet, A. Toffoli, Sebastien Kerdiles, Xavier Garros, D. Larmagnac, G. Romano, M. Vinet, and N. Bernier

Subjects
Millisecond, Reliability (semiconductor), Materials science, business.industry, law, Thermal, Gate stack, Optoelectronics, Plasma, business, Laser, law.invention
Published
2016

3. W and Copper Interconnection Stability for 3D VLSI CoolCube Integration

Author

A. Roman, A. Seignard, Perrine Batude, C. Ribiere, O. Pollet, V. Benevent, E. Gourvest, M.-P. Samson, N. Rambal, Lucile Arnaud, L. Brunet, Hervé Denis, Y. Loquet, M. Vinet, V. Lapras, L. Emery, V. Lu, S. Maitrejean, Vincent Jousseaume, P. Besson, C.Fenouillet Beranger, G. Druais, C.Euvrard Colnat, Bernard Previtali, F. Deprat, R. Kachtouli, S. Kerdiles, Y.Le Friec, and F. Aussenac

Subjects
Very-large-scale integration, Interconnection, Materials science, chemistry, Stability (learning theory), Electronic engineering, chemistry.chemical_element, Copper
Published
2015

4. (Invited) Annealing Techniques for Low Temperature Junctions Design in a 3D VLSI Integration

Author

J.P. Barnes, V. Lapras, P. Acosta Alba, N. Rambal, L. Hortemel, F. Piegas Luce, P. Rivallin, Dominique Lafond, Perrine Batude, Pascal Besson, M.-P. Samson, Sebastien Kerdiles, M. Vinet, B. Mathieu, A. Royer, H. Dansas, R. Kachtouli, M. Casse, Shay Reboh, V. Lu, O. Rozeau, L. Pasini, C.Fenouillet Beranger, Bernard Previtali, Laurent Brunet, F. Aussenac, Benoit Sklenard, and F. Deprat

Subjects
Very-large-scale integration, Materials science, Annealing (metallurgy), Engineering physics
Published
2015

6. Planar Double Gate CMOS transistors with 40nm metal gate for multipurpose applications

Author

D. Lafond, A. Roman, V. Carron, Bernard Previtali, François Martin, J.M. Hartmann, P. Besson, Yves Morand, P. Holliger, Mireille Mouis, B. Guillaumot, J. Lolivier, C. Vizioz, T. Poiroux, M. Casse, R. Truche, A. Toffoli, J. Simon, D. Renaud, F. Allain, M. Vinet, Julie Widiez, Simon Deleonibus, S. Maitrejean, B. Biasse, and F. Laugier

Subjects
Materials science, Planar, CMOS, law, business.industry, Transistor, Optoelectronics, Nanotechnology, Double gate, business, Metal gate, law.invention
Published
2004

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