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The semiconductor industry is one of the key industries of Korea, which has continued growing at a steady annual growth rate. Important technology for the semiconductor industry is high integration of devices. This is to increase the memory capacity for unit area, of which key is photolithography. The photolithography refers to a technique for printing the shadow of light lit on the mask surface on to wafer, which is the most important process in a semiconductor manufacturing process. In this study, the width and step-height of wafers patterned through this process were measured to ensure uniformity. The widths and inter-plate heights of the specimens patterned using photolithography were measured using transmissive digital holography. A transmissive digital holographic interferometer was configured, and nine arbitrary points were set on the specimens as measured points. The measurement of each point was compared with the measurements performed using a commercial device called scanning electron microscope (SEM) and Alpha Step. Transmission digital holography requires a short measurement time, which is an advantage compared to other techniques. Furthermore, it uses magnification lenses, allowing the flexibility of changing between high and low magnifications. The test results confirmed that transmissive digital holography is a useful technique for measuring patterns printed using photolithography.

In the fabrication of electronic circuits used in electronic products, molybdenum thin films are deposited on semiconductors to prevent oxidation. During the deposition, the presence of a particle or dust at the interface between the thin film and substrate causes the decrease of adhesion, performance, and life cycle. In this study, a damage measurement targeting two kinds of glass substrate, with and without particles, was performed in order to measure the change in the molybdenum thin film deposition area in the presence of a particle. Clean and dirty molybdenum thin film specimens were fabricated and directly deposited on a substrate using the sputtering method, and a reflection-type digital holographic interferometer was configured for measuring the damage. Reflection-type digital holography has several advantages; e.g., the configuration of the interferometer is simple, the measurement range can be varied depending on the magnification of a microscopic lens, and the measuring time is short. The results confirm that reflection-type digital holography is useful for the measurement of the damage and defects of thin films.