54 results on '"Jalar, Azman"'
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2. Effect of Gamma Radiation on Micromechanical Behaviour of SAC305 Solder
3. Effect of Blast Wave on Intermetallics Formation, Hardness and Reduced Modulus Properties of Solder Joints
4. Morphological Effect on the Intermetallic Compound Layer Growth Kinetics of Metallurgical Joining
5. Solderability of Coloured Lead Free Solder Composite
6. Bondability and Strength Evaluation of Gold Ball Bond Using Nanoindentation Approach
7. Surface Roughness and Wettability of SAC/CNT Lead Free Solder
8. Wettability of CNT-Doped Solder under Isothermal Aging
9. Nanoindentation Study on Heat Treated Gold Wire Bonding
10. Nanoindentation of Sn3.0Ag0.5Cu/ENIG Solder Joint after High Temperature Storage
11. Mechanical Interlocking on Leadframe Surface for Bondability of Au Wedge Bond
12. Ultrasonic Vibration in Leadframe for the Bondability for Au Wedge Bond
13. Directional Growth Behaviour of Intermetallic Compound of Sn3.0Ag0.5Cu/ImSn Subjected to Thermal Cycling
14. Electrochemical Migration Behaviours of Low Silver Content Solder Alloy SAC 0307 on Printed Circuit Boards (PCBs) in NaCl Solution
15. Corrosion Behavior of Fe-12Cr-2Mo Stainless Steel in Na2SO4-50%NaCl with Flowing Ar-20%O2 Environments at High Temperature
16. High Temperature Storage and Gamma Radiation Effects on Mechanical Properties of Stacked Die Package
17. Effect of Nanoindentation Loading Rate on Gold Ball Bond
18. Synthesis and Characterization of Nano-Wollastonite from Rice Husk Ash and Limestone
19. Synthesis and Characterization of Grape-Like SnO2 Structures Grown by a Thermal Evaporation Method
20. The Performance of Nanosilicate from Rice Husk Ash as Green Corrosion Inhibitor for Carbon Steel in 0.5M HCl
21. Synthesis of CdS Nanoparticles via AOT-Water-n-Heptane Microemulsion Technique
22. The Effect of PE-g-MAH Plus γ-GPS on Shear Strength of the Aluminium/LLDPE/Aluminium (APEA) Laminate Composite
23. High Temperature Corrosion of Fe-30Cr in Flowing CO2 Gas
24. Surface Morphology of Metal Oxide SnO2 under Different Concentrations of Oxygen by Thermal Evaporation Method
25. Hardness Variation of Ball Bond Wire Bonding
26. Gamma Irradiation Effect on Load-Deflection Curve of Semiconductor Package
27. Morphology and Optical Properties of Nickel Oxide Nanostructure from Aqueous Solution
28. Post-Weld Oxidation Behavior of AA6061 Al Alloy
29. Single Layer Brushite Coating onto Stainless Steel Substrate Using Dip-Coating Technique
30. Oxidation Effect on Welded AA6061 Al Alloy Using ER4043 Filler Metal
31. Synthesis of Porous MgO into Sheet-Like Structure via Solution Routes
32. Effect of Gamma-Irradiation towards Stress-Strain Curve of Single Die QFN Package
33. Oxidation Effect of Welded AA6061 Al Alloy Using ER5356 Filler Metal
34. Sn-Rich Phase Coarsening in Sn-Ag-Cu Solder Joint during Moderate Current Stressing
35. Quantitative Stereology for Roughness Morphology of Aluminum Alloy
36. Research on Effect of High Energy Implant to Resist Thickness
37. Effect of Hook Location for Ultra Fine Pitch Wirebonding Pull Testing Method
38. The Study of Underfill Epoxy Hardness in Reducing Curing Process Time for Flip Chip Packaging
39. Microstructural Behaviour Study and FEA-Based Fatigue Simulation on Parabolic Leaf Spring
40. Effects of Different Fillers on Microstructure and Tensile Properties of Welded AA6061-T6
41. Stress Distribution Effect on a Stacked-Die QFN Package Manufacturing Processes
42. Corrosion Behavior of Fe-Cr Alloys in Ar-10%O2 Atmosphere
43. Hardness Test on an Epoxy Mold Compounds of a Quad Flat No Lead Package Using the Depth Sensing Nanoindentation
44. Effect of Different Filler Towards Welding of AA6061 Al Alloy by X-Ray CT Scan
45. Nanoindentation Test for the Strength Distrubution Analysis of Bonded Au Ball Bonds
46. Nanoindentation Test for the Stiffness Distribution Analysis of Bonded Au Ball Bonds
47. The Effect of Filler ER4043 and ER5356 on Porosity Distribution of Welded AA6061 Aluminum Alloy
48. The Effect of Filler Metals on Mechanical Properties of 6 Mm AA 6061-T6 Welded Joints
49. Three-Point Bending Test Behaviour of a QFN Semiconductor Package
50. Characterization of 0.5 µm BiCMOS Gate Oxide Using Time Dependent Dielectric Breakdown Test
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