12 results on '"Niu, Xin-Huan"'
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2. The Study of Stability of Tungsten Plug CMP Slurry for IC Multilevel Interconnect
3. The Application of New Reagent in the Copper Wiring CMP
4. Defectivity Reduction in the Silicon Tough Polishing with Polyamine and Nonions Surfactant Additives
5. A Study of a New Cleaning Agent for Post-CMP Pattern Wafer
6. Effect of FA/O Chelating Agent on Copper Ion Removing on Silicon Surface
7. Chemical Mechanical Planarization of Cu Pattern Wafer Based Alkaline Slurry in GLSI with R(NH2)n as Complexing Agent
8. Ultra Precision Machining Technique of InSb Substrate Material for Detector Devices
9. The Important Role of Oxidant in Copper Interconnection Chemical Mechanical Polishing for GLSI
10. High Precision Finishing Technique of Sapphire Substrate Surface for Photoconducting Device
11. Growth and Fundamental Properties of SiGe Single Crystal
12. Analyses of CMP Mechanism of NiP Substrate of Computer Hard-Disk with Alkali Slurry
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