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Focuses on San Jose, California-based MCU supplier Renesas Technology America Inc. Joint venture between Hitachi Ltd. and Mitsubishi Electric Corp.; Product introductions; Competitors' plans.

Presents information on fiber-optic connector manufacturers' offerings that accommodate complex networks with greater fiber density and higher transmission speeds. FCI Electronics' offering; Product from Molex Fiber Optics; Stratos Lightwave's offering.

Presents information on some white light-emitting-diode (LED) offerings. Features of Linear Technology's LTC3200 charge pump; Description on National Semiconductor's LM2791/92 devices; Advantages of white LED over electroluminescent backlights and cold cathode fluorescent tubes.

Offers a look at the Class D amplifiers introduced in the market. Applications of Class D amplifiers; Class D amplifiers released by Texas Instruments Inc.; MAX4295 and MAX4297 from Maxim Integrated Products.

Reports on some of the products that will be shown at the Wescon 2000 and the boom of the electronic components industry. Reason for the strength of the market for electronic components; Comments from Crystal Manufacturing Co.'s Mark Handley on oscillator market; Offering of OKW Enclosures at the Wescon 2000.

Focuses on the challenges faced by manufacturers on the increasing complexity of dynamic random access memory (DRAM) modules. Investment of Smart Modular Technologies Inc. in test systems and handling equipment for DRAM; Synchronous DRAM sampling of Micron Technology Inc.; Double data rate DRAM from Wintec Industries Inc.

Features several data acquisition systems in a single-chip design. ADuC812 from Analog Devices Inc.; SPT7935 from Signal Processing Technologies Inc.; Chip sets from National Semiconductor.

Introduces rail-to-rail optical amplifier devices from Analog Devices Inc., Intersil Corp.'s Elantec Product Group, Linear Technology Corp. and Texas Instruments Inc.'s Burr-Brown. Design features and capabilities; Applications and uses; Pricing.

Reveals that manufacturers of analog integrated circuits for radio frequency (RF) and other wireless applications are turning to new architectures in June 2002. Illustration of Analog Devices' frequency synthesizer; Information on the direct-conversion RF chip from Texas Instruments.

Introduces several flash memory devices from electronic vendors. Wireless flash memory from Intel Corp.; Flash device from Fujitsu Microelectronics Inc.; Four-chip memory devices from Toshiba America Electronics Components Inc.

Focuses on the release of products by optical integrated circuit (IC) vendors aimed at leveraging the long-haul fiber links in metro-area network aggregation centers. Goal of IC vendors; List of companies offering optical IC products for transmission over shorter distances; Description of various products offered by such vendors; Role of process development in IC evolution.

Presents information on amplifier integrated circuits boosted by bipolar process technology. Amplifier chips from Linear Technology Corp.; Amplifiers from Maxim Integrated Products; Amplifier chips from M/A-COM.

Reports on the efforts of interface chip makers to develop low-voltage differential-signaling (LVDS) interface protocol in the U.S. as of March 2002. Advantages of LVDS; Facts on the collaboration between National Semiconductor Corp. and Texas Instruments Inc. on multipoint LVDS bus transcievers; Views of National Semiconductor executive Guy Nicholson on the standardization of multiple LVDS.

Reports on the venture of chip makers in cellular telephone markets worldwide as of March 2002. Information on the integrated circuits manufactured by National Semiconductor Corp.; Products of the company Linear Technology for cellular telephones; Features of the chip sets of the company Maxim Integrated Products.

Lists semiconductor companies that are offering low-cost controllers and integrated circuits for liquid crystal display panels. Genesis Microchip Inc.; Analog Devices Inc.; National Semiconductor Corp.; Pixelworks Inc.; STMicroelectronics Inc.

Reports on the shift of vendors in developing faster analog-to-digital converters in complementary metal oxide semiconductor. AD9235 chips from Analog Devices Inc.; TSA1204 from STMicroelectronics Inc. SPT8000 from Signal Processing Technologies Inc.

Presents information on several sensing integrated circuits that measure microprocessor temperature in personal computers. Sensors from the National Semiconductor Corp.; NE1617 from Philips Semiconductors; MAX6629 from Maxim Integrated Products.

Features several new products which showed the migration trend from mask Read Only Memory to flash memory embedded into microcontroller integrated circuits. Information on the plan of Texas Instruments to unveil members of its 16-bit MSP430F4xx series; Features of COP8 from National Semiconductor Corp.; Details on Mitsubishi Electronics America Inc.'s M37641.

Focuses on the decision of several companies to adopt complementary medal oxide semiconductors (CMOS) process technology for analog-to-digital converters. Converter makers which benefit from the adoption of the process; Details on the AD977 device of Analog Devices Inc.

Focuses on the chip products to be exhibited by vendors in the Embedded Systems 2001 Conference. System-on-chip to be launched by Atmel Corp. and Sharp Microelectronics of the Americas; Design of the ST7-FLite0 microcontrollers of Sharp; Memories introduced by Microchip Technology.

Reports on the products presented by makers of chips and modules at the 2001 Optical Fibers Conference. Optical transceiver from Alvesta Corp.; Complementary metal oxide semiconductor quad gigabit copper transceiver from Broadcom Corp.; Transceiver introduced by Infineon Technologies Inc.

Offers a look at several digital potentiometers released by vendors in the market. AD5232 from Analog Devices Inc.; DS1847 and DS1848 from Dallas Semiconductor; Applications.

Reports on the options of flash memory device makers to address the flash data market with NAND components. Leading NAND vendors; Factor that drives the market explosion; Incentive for developing flash memory devices.

Reports on the development of mixed-signal circuit designs for wireless communication and network applications. Benefits of mixed-signal circuits; Application of the C8051F001 chip from Cygnal Integrated Products Inc.; Mixed-signal circuits from Texas Instruments Inc.

Focuses on the increasing demand for operational amplifier (Op amps) integrated circuits in portable electronic apparatus. Op amps manufactured by ON Semiconductor; Other vendors that introduced rail-to-rail op amps.

Focuses on the effects of the development of switches to the business strategy of vendors. Switch types that showed fastest growing sales in North America; Predicted sales of switches in North America in 2000; Percent increase of unit sales. INSET: ITT-C&K deal means one-stop switch shopping.

The article focuses on the need of collaboration among different product development processes for better productivity, cost maintenance and efficiency. Product development teams should be supported by faster hardware and software so that they can integrate various product development processes. Multiple software products are needed for integrating design data.

Discusses the classifications of hazardous areas according to the International Electrotechnical Commission. Barrier to globalization of hazardous-location electrical equipment; Hazardous location protection methods which are most commonly used in North America; How the intrinsic safety concept, used in North America and in Europe limits the energy available for igniting flammable gases.

Focuses on high-speed static random access memories. Descriptions of devices from Quad Data Rate Consortium members; Delay-locked feature that allows memory output to be synchronized; Use of a krypton fluoride laser lithography process. INSETS: What's Happening;Company Contacts.

Reports on the companies that offer analog-to-digital converters that tout signal quality. Customers' demand for reduced board space requirements and improved performance; Functions of the chips offered by the companies.

Reports on developments related to the field of electronic engineering in the U.S., as of June 11, 2003. Issues of interest to the electronic engineer; Implications of the issues on the electronic engineering industry.

Reports that ten-gigabit integrated circuit vendors are offering application-specific products conforming to the IEEE 802.3ak draft standard that sell for far less than the devices they are replacing. Effort by some chip developers to develop 10GBase-T devices that will operate over twisted-pair cabling; Key features of the application-specific devices.

Reports that makers of IEEE 1394 or Firewire interconnect devices have been readying a generation of chips based on the 1394b technology which doubles operating speed. ASC Corp.'s development of a 1,600-megabit 1394b physical-layer device; Agere Systems Inc.'s supply of 1394b link-layer chips; Texas Instruments and Oxford's chip designs.

Describes trends in improving application design flexibility in the manufacture of serializer and deserializer devices in the U.S. Field-programmable system-on-chip for storage-area network applications; Use of lower-cost printed-circuit boards, cable and connectors; Options for serializing buses.

Highlights the events in the Optical Fiber Communication conference held in March 2003 in Atlanta, Georgia. Focus on 10-gigabite Ethernet technology; Exhibitors; Presentation of the developed devices by the participants.

Features various delta-sigma analog-to-digital converters. Texas Instruments' ADS1605; Analog Devices' AD7791, AD7789 and AD7788.

Introduces the MAX4297 Class-D audio amplifier from Maxim Integrated Products. Design features and capabilities; Applications and uses; Pricing.

Reports on production plans for chips that will be used in the integration of Bluetooth and Wi-Fi wireless local-area network (WLAN) connectivity. Plans to achieve higher levels of integration; AMD's launching of the AM-1772, an 802.11b WLAN chip consisting of a complementary metal oxide semiconductor radio frequency transceiver, media-access controller and baseband processor in February 2002.

Introduces Maxim Integrated Products' series of silicon germanium chips. Areas of application; Features; Design specification; Ordering information.

Features analog integrated circuits (IC). Analog Devices Inc.'s AD590 IC temperature sensor; TS4040 and TS4041 voltage references from STMicroelectronics NV; Maxim Integrated Products Inc.'s MAX6035 voltage reference.

Focuses on the efforts of microcontroller-chip suppliers on developing flexible microcontrollers with specific applications in Dallas, Texas. Launch of the DS80C400 MCU by Dallas Semiconductor; Move of Texas Instruments Inc. on expanding its 16-bit MSP430; Shift of manufacturers from mask to flash-based MCU.

Presents the NAND flash-memory modules from SanDisk Corp. Functions of the universal serial bus (USB) drive; Creation of family photos, music and other kinds of computer data transportable; Use of the USB flash drives for file transfer via the Internet.

Introduces Motorola Inc.'s Nitron family of eight-bit flash microcontrollers. Retail price; Areas of application; Design specification; Ordering information.

Introduces the Gigabit Ethernet transceiver by National Semiconductor Corp. in Santa Clara, California. Plan of Marvell Semiconductor Inc. for the marketing of the transceivers; Features of the transceivers; Use of the transmitter-receivers in switches and routers.

Introduces the USB 2.0-to-ATA/Atapi bridge integrated circuit from Texas Instruments Inc. Features of the product; Power requirements of the chip; Price of the integrated circuit.

Reports that Analog Devices Inc. has launched a single-chip, fully differential amplifier able to drive 12- to 14-bit A/Ds at 70 MHz, a critical component for next-generation wireless infrastructure equipment. Design features; Power requirements; Applications and uses.

Reports on products launched by manufacturers of integrated circuits specializing in HomePlug-compatible power line networking. Inclusion of Intellon Corp.'s INT51X1 single-chip front-end device; Cogency Semiconductor Inc.'s introduction of CS1102, an Ethernet-to-HomePlug bridge, which integrates Ethernet media access control and HomePlugMAC and physical-layer functions.

Introduces several amplifier lines. TPA2005D1 from Texas Instruments Inc.; LMH6628 and LMH6715 from National Semiconductor Corp.; TS482 stereo headphone amplifiers from STMicroelectronics.

Introduces the fully differential LT6600-10 amplifier from Linear Technology Corp. which allows designers to program differential gain with just two external resistors, one for each input. Key specifications; Integration of a fourth-order, direct current-accurate, 10 Megahertz low-pass filter; Frequency response.

Introduces several analog-to-digital (A/D) converters for medical-imaging applications. ADC12D040 from National Semiconductor Corp.; TSA1204 and TSA1203 from ST Microelectronics Inc.; AD9238 from Analog Devices Inc.