1. Microstructure Contact Studies for Skutterudite Thermoelectric Devices.
- Author
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Zhao, Degang, Geng, Haoran, and Chen, Lidong
- Subjects
MICROSTRUCTURE ,SKUTTERUDITE ,THERMOELECTRICITY ,JOINTS (Engineering) ,SINTERING ,INTERMETALLIC compounds ,CHEMICAL reactions - Abstract
The skutterudite/electrode thermoelectric joints were fabricated with the insertion of Ti foil by spark plasma sintering. The interfacial microstructure and reliability of joints were studied during thermal duration test. A multilayer structure, which was composed of intermetallic compounds, was observed at the CoSb
3 / Ti interface after thermal aging of 20 days. The interfacial reactions and diffusion path between CoSb3 and Ti were discussed. The contact resistance of CoSb3 /electrode junction was measured through four-probe method and the thermal contact resistance was calculated based on multilayer mode measurement. Effects of the contact resistivity on the performance of CoSb3 -based device were discussed. [ABSTRACT FROM AUTHOR]- Published
- 2012
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