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Quad-flat no-leads (QFN) is a type of leadframe device in semiconductor industry wherein the silicon chip or die is mounted on leadframe pad through a die attach glue or film.

Assembly manufacturing challenges are inevitable during package development of an advanced substrate-based semiconductor package

Package design is one of the key steps prior fabrication and assembly of semiconductor electronic devices. This paper presents the advantage of securing a robust design architecture for specailized electronic devices to minimize the potential show stopper in the realization of high-end technology during assembly manufacturing.

This active balun is comprised of 2 amplifiers namely common-gate amplifier (with transistor M1) in the 1st stage and common-source amplifier (with transistor M2) in the 2nd stage

Common-source/drain active balun circuit is composed of just single transistor M1 as shown in Fig. 1, designed in complementary metal-oxide semiconductor (CMOS) technology.

In semiconductor assembly manufacturing wherein the competition is tough among all the semiconductor industries, one main factor to consider is the cost of a material. This paper discussed how the product was managed to be competitive in terms of manufacturing cost. The components were critically analyzed to eventually achieve the project goal and identify ways in reducing package cost that impacts the company’s profit.

Driven by the direction for smaller devices, the development of thinner version of leadframe become one of the key contributor for miniaturization.

Miniaturization and densification is the current roadmap of all semiconductor devices. Downsizing or decreasing the size of a semiconductor integrated circuit (IC) as depicted

Today more than ever, cost reductions push the industry towards larger strip formats and thin substrate in manufacturing for efficiencies at high-cost processes

A ball grid array or BGA semiconductor device is a type of surface mount packaging used in integrated circuit (IC) with the silicon die wired/connected to the bond fingers and metallic inter-layers of the substrate.

A balun (balanced-unbalanced) transformer circuit converts signals that are single-ended or unbalanced with respect to ground into signals that are differential or balanced with respect to ground, and vice versa.

This active balun is comprised of 2 amplifiers namely common-gate (CG) amplifier (M1) in the 1st stage and common-source (CS) amplifier (M2) in the 2nd stage

A balun (balanced-unbalanced) circuit converts signals that are single-ended or unbalanced with respect to ground into signals that are differential or balanced with respect to ground, and/or vice versa. An ideal balun generates a pair of differential output signals of balanced amplitudes (0 dB gain difference) and phases (180° phase difference) from a single-ended input signal source.

A balun (balanced-unbalanced) circuit converts signals that are single-ended or unbalanced with respect to ground into signals that are differential or balanced with respect to ground, and/or vice versa. An ideal balun generates a pair of differential output signals of balanced amplitudes (0 dB gain difference) and phases (180° phase shift) from a single-ended input signal source.

The differential active balun shown in Fig. 1 is composed of 3 transistors namely M1 and M2 for the differential output, and M3 for the tail current.

Nowadays, new technologies are getting augmented and improved in the semiconductor industry, and one of which is the development in die attach materials particularly the conductive die attach film material. Conductive die attach film, also known as cDAF, is mounted below the silicon die and is also used to connect into the circuit boards.

A balun (balanced-unbalanced) circuit is a type of transformer that converts signals that are single-ended or unbalanced with respect to ground into signals that are differential or balanced with respect to ground, and vice versa.

An active balun (balanced-unbalanced) circuit is a type of transformer that converts signals that are single-ended or unbalanced with respect to ground into signals that are differential or balanced with respect to ground.

Surface mount technology (SMT) includes a solder paste printing process wherein the solder paste material is applied below the semiconductor device using stencil printing

Die attach process or diebonding is the process of “picking and attaching” of silicon die to a carrier either by die attach film (DAF) or glue adhesives

One of the critical issues during assembly manufacturing process of semiconductor quad flat no-leads (QFN) leadframe package or device is the warpage illustrated in Fig. 1

This active balun is comprised of 2 amplifiers namely common-gate (CG) amplifier (M1) in the 1st stage and common-source (CS) amplifier (M2) in the 2nd stage

The miniaturization of integrated circuit (IC) becomes the common direction for semiconductor electronic industries, converting the electronic devices to get smaller in size yet with increased number of functional components. Aligned with this common goal is to continuously improve the manufacturing and assembly side of semiconductor devices as well to be able to adapt to the fast changing requirement of technological breakthrough. Through integrating an interposer in the current design of substrate-based electronic product, the assembly limitations and capability can be significantly improved, thus devices with tight clearance requirement or devices with gross assembly rejection related to tight clearances can be provided with reliable alternative solution and process improvement.

The common-source/drain active balun is composed of just single transistor M1 as shown in Fig. 1 and is considered as the simplest topology amongst other active balun configurations.

Tape and reel process is one of the new technologies in semiconductor industry, with one key challenge in die attach process because of the reject hole on the tape

Substrate material plays a vital role in electronic packaging industry, as it represents a great portion of the cost and contributes to the overall package performance in terms of electrical and thermo-mechanical response

Rubbertip or often called pick-up tool (PUT) in Fig. 1 is a material essential for die attach film (DAF) pick and place process wherein it is used to hold the ejected silicon die from the wafer tapes prior transfer to a carrier substrate.

The integration of bridge connection line on an electronic integrated circuit (IC) package construction is an expansion in the packaging design to improve known assembly limitations particularly on some instances that a long wire connection inside the IC device is inevitable. The technicality of the idea is to replace the identified longest wire connection with an alternative wiring technique and incorporating a conductive interconnects in the device layout where it will be a junction for the wiring of silicon die and input/output (I/O) leads. In this case, the length of the wire can be limited and controlled to a certain distance during IC assembly, that which its behavior on the actual device and assembly can be more predictable and manufacturable.

As the die technology becomes smaller, thinner, and faster, silicon die circuit metallization also becomes smaller, thus the electronic devices like that of the quad flat package (QFP) and quad flat no-leads (QFN) semiconductor leadframe package shown in Fig. 1 become more sensitive and susceptible to electrical overstress (EOS) and/or electrostatic discharge (ESD) damages

Emerging technology on semiconductor packaging offers leadframe packages with one connection layer comparable to a substrate, as shown in Fig.1 with a one-panel or one-map strip design

Substrate material or the substrate strip in Fig. 1 played a very important role in packaging industry, not only because it represents a great portion of the cost but also has a great influence on package performance

Die bonding process or die attach process refers to the “pick and bonding” process of silicon die from wafer tapes to a carrier, as shown in Fig. 1

Package singulation is the process of separating molded or encapsulated integrated circuit (IC) device into individual units through mechanical dicing blade

Nowadays, electronic products are becoming influential in our daily activities The transition from bulky and large electronic devices to a miniaturized version enables convenience and extend assistance to circumstances beyond human capability

As the die technology becomes smaller, faster, and thinner, circuit metallization also becomes smaller, thus the semiconductor device like that of the quad flat package (QFP) shown in Fig. 1 becomes more sensitive and susceptible to electrostatic discharge (ESD) damage

Package chip-out in Fig. 1 is a common defect frequently encountered in end-of-line process at the semiconductor assembly manufacturing, and is defined as a region of material missing from a body

Package singulation process is one of the known package sawing techniques on QFN (quad flat no-lead) leadframe semiconductor manufacturing to separate the molded or encapsulated leadframe into individual units

Non-conductive die attach film (DAF) is normally used as adhesive to connect or attach the silicon die into the leads without any electrical connection to its carrier or leadframe

Die attach or die bonding process is one of the key processes in integrated circuit (IC) assembly, responsible in the “picking and bonding” of semiconductor die from the wafer to a carrier

Die attach process is one of the key process steps in semiconductor integrated circuits (IC) assembly that is responsible in picking and bonding of individually sawn die from the wafer tape to a carrier

Package chip-out is a process defect recorded during the singulation stage at the trim and form process in Fig. 1 of semiconductor assembly manufacturing

Substrate material or the substrate stack-up played a very important role in packaging industry, not only because it represents a great portion of the cost but also has a great influence on package performance

Semiconductor packages may have input/output (I/O) signals that are sensitive and critical to electromagnetic interference (EMI), ultimately affecting and degrading the functionality of the signals

Substrate material played a very important role in packaging industry, not only because it represents a great portion of the cost but also has a great influence on package performance

Newer thin packages require very thin layer of glue underneath in order to meet the defined package height requirements However, very thin adhesive layers result to thin bond line thickness (BLT), which may eventually cause the adhesive glue to crack

Leadframe is the common indirect material used in semiconductor quad flat no-leads (QFN) assembly to interconnect the silicon die to board level

Automotive industry dictates the standard for quality excellence for most (if not all) semiconductor packaging and test manufacturing companies

Package costing is becoming critical in today’s business world, with package costing involving both direct and indirect materials One of the typical and essential tooling being used in back-end assembly manufacturing is the process plate Process plates or top plates are used to control the carrier handling and to help transfer heat required during assembly processes, namely diebonding and wirebonding processes

Diebond process plate is used to hold using vacuum the carrier of package, either leadframe or substrate Process plate is replaced on every package conversion and is specifically designed on one package only

Flexibility in any ways during assembly manufacturing has become increasingly recommended as it offers many advantages Wirebond top plate is used to hold the carrier of the package, either lead frame or substrate, using vacuum Top plate or process plate is being replaced on every package conversion and is specifically designed on one package only