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Discusses the presentations and papers in the International Electron Devices Meeting in San Francisco, California, on December, 2000. Sessions that shed light or progress and future challenges for a variety of semiconductor technologies; Developments in the high-speed analog and mixed signal arena; Use of gallium-arsenide heterojunction bipolar transistor as power amplifiers.

Information about several papers discussed at the International Symposium on Physical Design held in April 2006 in San Jose, California is presented. New chip design at 65 nanometers where temperature, voltage and process variations have dramatic impact on chip timing, manufacturability and yield were offered during the symposium. It also featured several authors from the University of California in Los Angeles and International Business Machine Research who received ISPD 2006 Best Paper Award.

Information about several papers discussed at LSI Logic conference sponsored by LSI Corp. on the firm's role in the global industry held in Mountainview, California in 2010 is presented. Topics include the corporate history of LSI Logic, the recognition of the firm as the first fabless semiconductor firms, and the absorption of Toshiba's complementary metal oxide semiconductors (CMOS) process technology lock. The conference featured several LSI Corp.'s employees including Ven Lee.

The article provides information on the 2009 Fortune Brainstorm Tech meeting on July 2009 in Pasadena, California. The meeting featured many magnates from marketing, advertising, and entertainment industry. The former U.S. presidential candidate, Howard Dean was the speaker at the meeting while, the inventor Ray Kurzweil delivered his paper regarding the exponential advancement and impact of semiconductor technologies.

Information about several papers discussed at the Globalpress Summit Conference in 2008 in San Francisco, California is presented. The event highlighted problems affecting the semiconductor industry. Chief executive officer (CEO) Moshe Gavrielov of Xilinx Inc. said that there was a 40 percent decrease in design starts for application-specified standard product/application-specified integrated circuits. CEO Ronnie Vashita of eASIC Corp. blamed it to the increasing costs and risk.