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Graph Neural Network (GNN) is a variant of Deep Neural Networks (DNNs) operating on graphs. However, GNNs are more complex compared to traditional DNNs as they simultaneously exhibit features of both DNN and graph applications. As a result, architectures specifically optimized for either DNNs or graph applications are not suited for GNN training. In this work, we propose a 3D heterogeneous manycore architecture for on-chip GNN training to address this problem. The proposed architecture, ReGraphX, involves heterogeneous ReRAM crossbars to fulfill the disparate requirements of both DNN and graph computations simultaneously. The ReRAM-based architecture is complemented with a multicast-enabled 3D NoC to improve the overall achievable performance. We demonstrate that ReGraphX outperforms conventional GPUs by up to 3.5X (on an average 3X) in terms of execution time, while reducing energy consumption by as much as 11X., Comment: This paper has been accepted and presented at Design Automation and Test in Europe (DATE) 2021

Heterogeneous manycore architectures are the key to efficiently execute compute- and data-intensive applications. Through silicon via (TSV)-based 3D manycore system is a promising solution in this direction as it enables integration of disparate computing cores on a single system. However, the achievable performance of conventional through-silicon-via (TSV)-based 3D systems is ultimately bottlenecked by the horizontal wires (wires in each planar die). Moreover, current TSV 3D architectures suffer from thermal limitations. Hence, TSV-based architectures do not realize the full potential of 3D integration. Monolithic 3D (M3D) integration, a breakthrough technology to achieve - More Moore and More Than Moore - and opens up the possibility of designing cores and associated network routers using multiple layers by utilizing monolithic inter-tier vias (MIVs) and hence, reducing the effective wire length. Compared to TSV-based 3D ICs, M3D offers the true benefits of vertical dimension for system integration: the size of a MIV used in M3D is over 100x smaller than a TSV. In this work, we demonstrate how M3D-enabled vertical core and uncore elements offer significant performance and thermal improvements in manycore heterogeneous architectures compared to its TSV-based counterpart. To overcome the difficult optimization challenges due to the large design space and complex interactions among the heterogeneous components (CPU, GPU, Last Level Cache, etc.) in an M3D-based manycore chip, we leverage novel design-space exploration algorithms to trade-off different objectives. The proposed M3D-enabled heterogeneous architecture, called HeM3D, outperforms its state-of-the-art TSV-equivalent counterpart by up to 18.3% in execution time while being up to 19 degrees Celcius cooler., Comment: This work has been accepted in ACM Transactions on Design Automation of Electronic Systems