13 results on '"Choe, Chanyang"'
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2. Low temperature low pressure solid-state porous Ag bonding for large area and its high-reliability design in die-attached power modules
3. Improvement of the Bond Strength of Ag Sinter-Joining on Electroless Ni/Au Plated Substrate by a One-Step Preheating Treatment
4. Printed wire interconnection using Ag sinter paste for wide band gap power semiconductors
5. Low-stress design of bonding structure and its thermal shock performance (− 50 to 250 °C) in SiC/DBC power die-attached modules
6. Real-Time Acoustic Emission Monitoring of Wear-Out Failure in SiC Power Electronic Devices During Power Cycling Tests
7. Effect of oxygen on microstructural coarsening behaviors and mechanical properties of Ag sinter paste during high-temperature storage from macro to micro
8. Lifetime Prediction of a SiC Power Module by Micron/Submicron Ag Sinter Joining Based on Fatigue, Creep and Thermal Properties from Room Temperature to High Temperature
9. Necking growth and mechanical properties of sintered Ag particles with different shapes under air and N2 atmosphere
10. Improvement of the Bond Strength of Ag Sinter-Joining on Electroless Ni/Au Plated Substrate by a One-Step Preheating Treatment
11. Thermal Shock Performance of DBA/AMB Substrates Plated by Ni and Ni–P Layers for High-Temperature Applications of Power Device Modules
12. Necking growth and mechanical properties of sintered Ag particles with different shapes under air and N2 atmosphere.
13. Thermal Shock Performance of DBA/AMB Substrates Plated by Ni and Ni⁻P Layers for High-Temperature Applications of Power Device Modules.
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