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21 results on '"Kuroda, Tadahiro"'

9. A 6800-μm2 Resistor-Based Temperature Sensor in 180-nm CMOS

Author

Angevare, J., Makinwa, K.A.A., and Kuroda, Tadahiro

Subjects
Materials science, business.industry, Temperature sensor, Track (disk drive), 020208 electrical & electronic engineering, Resolution (electron density), Thermal Sensing, Hardware_PERFORMANCEANDRELIABILITY, 02 engineering and technology, Atmospheric temperature range, Wien-Bridge, Temperature measurement, Trim, law.invention, Voltage-controlled oscillator, CMOS, law, Hardware_INTEGRATEDCIRCUITS, 0202 electrical engineering, electronic engineering, information engineering, Optoelectronics, Resistor, business
Abstract

A resistor-based temperature sensor has been realized in 180 nm CMOS for SoC thermal management applications. Occupying only 6800 μm2, it is the smallest resistor-based temperature sensor ever reported. This is achieved by employing a compact highly-digital VCO-based ADC. After a 2-point trim, the sensor achieves an inaccuracy of ±0.35 °C (3σ) in a temperature range from-35 °C to 125 °C. By achieving a resolution of 0.12 °C (rms) at 2.8kSa/s, it can track the fast thermal-transients in SoCs.

Published
2018

10. 誘導結合を用いたビルディングブロック型計算システムの研究

Author

慶應義塾大学・理工学部・教授, 東京農工大学・工学研究科・教授, 東京大学・大学院情報理工学系研究科・教授, 芝浦工業大学・工学部・教授, 東京大学・大学院情報理工学系研究科・准教授, アマノ, ヒデハル, ナミキ, ミタロウ, ナカムラ, ヒロシ, ウサミ, キミヨシ, コンドウ, マサアキ, クロダ, タダヒロ, マツタニ, ヒロキ, Amano, Hideharu, Namiki, Mitaro, Nakamura, Hiroshi, Usami, Kimiyoshi, Kondo, Masaaki, Kuroda, Tadahiro, Matsutani, Hiroki, 天野, 英晴, 並木, 美太郎, 中村, 宏, 宇佐美, 公良, 近藤, 正章, 黒田, 忠広, 松谷, 宏紀, 慶應義塾大学・理工学部・教授, 東京農工大学・工学研究科・教授, 東京大学・大学院情報理工学系研究科・教授, 芝浦工業大学・工学部・教授, 東京大学・大学院情報理工学系研究科・准教授, アマノ, ヒデハル, ナミキ, ミタロウ, ナカムラ, ヒロシ, ウサミ, キミヨシ, コンドウ, マサアキ, クロダ, タダヒロ, マツタニ, ヒロキ, Amano, Hideharu, Namiki, Mitaro, Nakamura, Hiroshi, Usami, Kimiyoshi, Kondo, Masaaki, Kuroda, Tadahiro, Matsutani, Hiroki, 天野, 英晴, 並木, 美太郎, 中村, 宏, 宇佐美, 公良, 近藤, 正章, 黒田, 忠広, and 松谷, 宏紀

Abstract

Research team head, Research team member, Publisher, 誘導結合チップ間無線インタフェース(TCI)を用いて, 様々なチップを組み合わせて柔軟にシステムを構築する手法の基本的な技術を確立した。TCIを持つチップを簡単に設計, 実装するために物理層からルータ層までのIP(Intellectual Property)を構築して公開した。IPを用いて様々なプロトタイプを構築した。積層するチップの省電力化技術を提案し, 性能と消費電力を自動調節する機構を開発した。TCIによる積層チップの熱解析システムを構築した。バスを含めた積層用ネットワーク技術を確立した。多数のアクセラレータを効率良く制御し, 性能と電力のバランスを取るための制御ソフトウェアを構築した。 We established fundamental techniques to build various types of chip combination using inductive coupling through chip interface (TCI). In order to build chips with TCI easily, IPs (Intellectual Properties) from the physical layer to the router layer were developed and openly distributed. Several prototype chips including CPU, accelerators and memory were designed and implemented. Performance and power optimization and adaptation techniques for stacking multiple chips have been investigated. The thermal analysis has been done for chip stack with TCI. The shared buses and point-to-point networks with TCI were investigated. Finally, control software for a system with heterogeneous accelerators were developed., 研究種目 : 基盤研究(S) 研究期間 : 2013～2017 課題番号 : 25220002 研究分野 : コンピュータアーキテクチャ

Published
2018

17. 大学一年生の自然科学への関心度と知識度2012年度調査 : 10年前, 20年前との比較

Author

Department of Astronomy, Keio University, Department of Physics, Keio University; Research and Education Center for Natural Sciences, Keio University, Department of Electronics and Electrical Engineering, Keio University, 加藤, 万里子, カトウ, マリコ, Kato, Mariko, 小林, 宏充, コバヤシ, ヒロミチ, Kobayashi, Hiromichi, 黒田, 忠広, クロダ, タダヒロ, Kuroda, Tadahiro, 青木, 健一郎, アオキ, ケンイチロウ, Aoki, Kenichiro, 杉本, 憲彦, スギモト, ノリヒコ, Sugimoto, Norihiko, 松浦, 壮, マツウラ, ソウ, Matsuura, So, Department of Astronomy, Keio University, Department of Physics, Keio University; Research and Education Center for Natural Sciences, Keio University, Department of Electronics and Electrical Engineering, Keio University, 加藤, 万里子, カトウ, マリコ, Kato, Mariko, 小林, 宏充, コバヤシ, ヒロミチ, Kobayashi, Hiromichi, 黒田, 忠広, クロダ, タダヒロ, Kuroda, Tadahiro, 青木, 健一郎, アオキ, ケンイチロウ, Aoki, Kenichiro, 杉本, 憲彦, スギモト, ノリヒコ, Sugimoto, Norihiko, 松浦, 壮, マツウラ, ソウ, and Matsuura, So

Abstract

publisher, 横浜, 原著論文, 慶應義塾大学文学部,経済学部, 商学部, 法学部の1, 2年生および理工学部の1年生を対象に, 科学用語のアンケート調査をおこなった。実施時期は2012年4月, 回収数は文系学部409, 理工学部415である。科学用語36の知識と興味度のほか物理・科学コンプレックスの有無などを調査し, 10年前と20年前の調査結果との比較を行った。学生が科学の最新知識を得る情報源はテレビ, インターネット, 新聞の順であり, 10年前と比べて新聞とインターネットの順番が逆転した。文系理系ともに10年前に比べて自然科学, 特に天文学と物理学を中心とする用語の知識度が大幅に上がり, また興味も広く強くなったことがわかる。

Published
2013

20. 3D NoC with Inductive-Coupling Links for Building-Block SiPs.

Author

Take, Yasuhiro, Matsutani, Hiroki, Sasaki, Daisuke, Koibuchi, Michihiro, Kuroda, Tadahiro, and Amano, Hideharu

Subjects
NETWORKS on a chip, COMPUTER input-output equipment, COMPUTER architecture, NETWORK routing protocols, BIDIRECTIONAL associative memories (Computer science), ELECTRIC inductors
Abstract

A wireless 3D NoC architecture is described for building-block SiPs, in which the number of hardware components (or chips) in a package can be changed after chips have been fabricated. The architecture uses inductive-coupling links that can connect more than two examined dies without wire connections. Each chip has data transceivers for the uplink and downlink in order to communicate with its neighboring chips in the package. These chips form a vertical unidirectional ring network so as to fully exploit the flexibility of the wireless approach that enables us to add, remove, and swap the chips in the ring. To avoid protocol and structural deadlocks in the ring, we use bubble flow control, which does not rely on the conventional VC-based deadlock avoidance mechanism. In addition, we propose a bidirectional communication scheme to form a bidirectional ring network by using the inductive-coupling transceivers that can dynamically change the communication modes, such as TX, RX, and Idle modes. This paper illustrates the inductive-coupling transceiver circuits, which can carry high data transfer rates of up to 8 Gbps per channel, for the wireless 3D NoC. It also illustrates an implementation of a wireless 3D NoC that has on-chip routers and transceivers implemented with a 65 nm process in order to show the feasibility of our proposal. The vertical bubble flow control and conventional VC-based approach on the uni- and bidirectional ring networks are compared with the vertical broadcast bus in terms of throughput, hardware amount, and application performance using a full system multiprocessor simulator. The results show that the proposed bidirectional communication scheme efficiently improves application performance without adding any inductive-coupling transceivers. In addition, the proposed vertical bubble flow network outperforms the conventional VC-based approach by 7.9-12.5 percent with a 33.5 percent smaller router area for building-block SiPs connecting up to eight chips. [ABSTRACT FROM PUBLISHER]

Published
2014
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21. A 107-pJ/bit 100-kb/s 0.18-μm Capacitive-Coupling Transceiver With Data Edge Signaling and DC Power-Free Pulse Detector for Printable Communication Sheet.

Author

Lechang Liu, Takamiya, Makoto, Sekitani, Tsuyoshi, Noguchi, Yoshiaki, Nakano, Shintaro, Zaitsu, Koichiro, Kuroda, Tadahiro, Someya, Takao, and Sakurai, Takayasu

Subjects
WIRELESS communications, RADIO frequency modulation, RADIO transmitter-receivers, COMPLEMENTARY metal oxide semiconductors, DIGITAL electronics
Abstract

A novel communication system which simultaneously achieves the mobility of wireless communication and the low-power performance of wireline communication is developed with a printable sheet. By combining meter-scale wireline communication and micrometer-scale wireless capacitive-coupling communication, the proposed communication system enables multiple electronic objects scattered over tables, walls, and ceilings to communicate contactlessly with each other by establishing communication paths without cumbersome physical connections. The transceiver developed for the 20 cm × 20 cm communication sheet features a data-edge-signaling transmitter and a dc power-free pulse detector, thereby achieving the lowest energy of 107 pJ/bit at 100 kb/s in wireless communications at a distance of 60 cm in 0.18-μm CMOS. [ABSTRACT FROM AUTHOR]

Published
2009
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