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• Gallium-based liquid metal-copper foam TIM is prepared by galvanic corrosion. • The thermal conductivity of the TIM is 51.58±0.01 W/(m·K). • Under the pressure of 0.35 MPa, the TIM does not overflow. • With the increase in wettability, the thermal contact resistance decreased by 58.28%. As a promising thermal interface material (TIM), gallium-based liquid metal (GBLM) could significantly reduce the thermal contact resistance (TCR) at the solid-solid interfaces, while the leakage of GBLM and the wettability between liquid metal and solid surface restrict further application. In this study, the GBLM was wrapped with a copper foam (CF) skeleton, which prevents leakage and improves the thermal conductivity of the GBLM. Gallium-based liquid metal-copper foam (GBLM-CF) TIM was prepared by the self-wetting of the CF surface through the galvanic corrosion of GBLM. As the concentration of HCl increases from 0 to 5 M, the interfacial tension (IFT) in the HCl solution decreases from 536.80±1.00 mN/m to 481.52±0.49 mN/m, demonstrating that the IFT of the GBLM is inversely proportional to the concentration of HCl. Meanwhile, the decrease of contact angle (CA) by 8° indicates that the presence of CuGa 2 on the surface promotes the wettability of GBLM. With the increase of external pressure and the improvement of wettability, the TCR between the GBLM and the copper sheet decreased by 58.28%. The TCR of the sample using GBLM-CF as TIM is 83% lower than that of thermal grease. Moreover, the thermal conductivity of GBLM-CF TIM (51.58±0.01 W/(m·K)) is 212.6% higher than that of GBLM (16.50±0.02 W/(mK)). The GBLM-CF TIM presented in this study can be used for the efficient thermal management of electronic equipment. [ABSTRACT FROM AUTHOR]