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With the highly integrated development of electronic components, higher requirements are put forward for heat transfer components, there is an urgent need for high-performance heat transfer components. Oscillating heat pipe (OHP) is novel types of heat pipe with excellent heat transfer capability. However, the heat transfer limit hinders their operation and application. This paper proposes an OHP under trans-critical conditions with the working fluid of R218 and explores its operating characteristics and heat transfer capability. Visualization experiments and pressure monitoring were conducted to analyze the state changes within the OHP under trans-critical conditions. After evaporation section temperature surpassing the critical temperature of R218, the pressure increases with the temperature, once the pressure reached near the critical pressure, OHP can transcend the limitation of the critical temperature and realize efficient oscillating operation under trans-critical conditions. With stable operation, the working fluid velocity can reach up to 1.49 m/s, and the OHP under trans-critical conditions presented excellent heat transfer performance with the thermal resistance of 0.22 °C/W. This paper proves the feasibility of the OHP under trans-critical conditions and provides a basis for further research. [ABSTRACT FROM AUTHOR]

• Gallium-based liquid metal-copper foam TIM is prepared by galvanic corrosion. • The thermal conductivity of the TIM is 51.58±0.01 W/(m·K). • Under the pressure of 0.35 MPa, the TIM does not overflow. • With the increase in wettability, the thermal contact resistance decreased by 58.28%. As a promising thermal interface material (TIM), gallium-based liquid metal (GBLM) could significantly reduce the thermal contact resistance (TCR) at the solid-solid interfaces, while the leakage of GBLM and the wettability between liquid metal and solid surface restrict further application. In this study, the GBLM was wrapped with a copper foam (CF) skeleton, which prevents leakage and improves the thermal conductivity of the GBLM. Gallium-based liquid metal-copper foam (GBLM-CF) TIM was prepared by the self-wetting of the CF surface through the galvanic corrosion of GBLM. As the concentration of HCl increases from 0 to 5 M, the interfacial tension (IFT) in the HCl solution decreases from 536.80±1.00 mN/m to 481.52±0.49 mN/m, demonstrating that the IFT of the GBLM is inversely proportional to the concentration of HCl. Meanwhile, the decrease of contact angle (CA) by 8° indicates that the presence of CuGa 2 on the surface promotes the wettability of GBLM. With the increase of external pressure and the improvement of wettability, the TCR between the GBLM and the copper sheet decreased by 58.28%. The TCR of the sample using GBLM-CF as TIM is 83% lower than that of thermal grease. Moreover, the thermal conductivity of GBLM-CF TIM (51.58±0.01 W/(m·K)) is 212.6% higher than that of GBLM (16.50±0.02 W/(mK)). The GBLM-CF TIM presented in this study can be used for the efficient thermal management of electronic equipment. [ABSTRACT FROM AUTHOR]

• A liquid metal high temperature OHP (LMHOHP) was first developed. • The LMHOHP that can function at a temperature of over 500 °C. • The LMHOHP can transport heat of 3169 W and achieve a thermal resistance of 0.08 °C/W. This paper introduces the development of a liquid metal high-temperature oscillating heat pipe (LMHOHP) that can function under high-temperature conditions (over 500 °C). The LMHOHP has six turns with a total height of 310 mm. The sodium-potassium alloy (potassium 78%) was used as the working fluid, and the 310S stainless steel tube with an inner diameter of 6 mm as the shell tube. The LMHOHP heat transfer performance was investigated experimentally with a filling ratio of 45% at different input powers. Experimental results show that the LMHOHP can effectively generate steady-state oscillating motions at a working temperature of over 500 °C. When the steady-state oscillating motions exist, the temperature difference and thermal resistance between the evaporator and condenser were reduced significantly. At a heat input of 3169 W, the LMHOHP presents a minimum thermal resistance of 0.08 °C/W. This LMHOHP provides a new approach to next-generation high-temperature cooling devices. [ABSTRACT FROM AUTHOR]