4 results on '"Chang, Tao"'
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2. Growth and morphology of the intermetallic compounds formed at the Sn–9Zn–2.5Ag/Cu interface
3. Enhancement of the wettability and solder joint reliability at the Sn–9Zn–0.5Ag lead-free solder alloy–Cu interface by Ag precoating
4. Kinetics of intermetallic compound formation at 91Sn–8.55Zn–0.45Al lead-free solder alloy/Cu interface
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