Jean François Halet, Takao Mori, Cédric Bourgès, Alizée Minard, David Berthebaud, Yuzuru Miyazaki, P. Sauerschnig, Bruno Fontaine, Bhuvanesh Srinivasan, National Institute for Materials Science (NIMS), School of Engineering [Tohoku Univ], Tohoku University [Sendai], International Center for Materials Nanoarchitectonics (WPI-MANA), Laboratory for Innovative Key Materials and Structures (LINK), Saint-Gobain-National Institute of Materials Science-Centre National de la Recherche Scientifique (CNRS), Institut des Sciences Chimiques de Rennes (ISCR), Université de Rennes (UR)-Institut National des Sciences Appliquées - Rennes (INSA Rennes), Institut National des Sciences Appliquées (INSA)-Institut National des Sciences Appliquées (INSA)-Ecole Nationale Supérieure de Chimie de Rennes (ENSCR)-Institut de Chimie du CNRS (INC)-Centre National de la Recherche Scientifique (CNRS), Université de Tsukuba = University of Tsukuba, Japan Society for the Promotion of Science via JSPSMinistry of Education, Culture, Sports, Science and Technology, Japan (MEXT)Japan Society for the Promotion of Science [PE17748, P19720], JSPS KAKENHIMinistry of Education, Culture, Sports, Science and Technology, Japan (MEXT)Japan Society for the Promotion of ScienceGrants-in-Aid for Scientific Research (KAKENHI) [19F19720, JP16H06441], JST-Mirai [JPMJMI19A1], SAINT-GOBAIN-National Institute of Materials Science-Centre National de la Recherche Scientifique (CNRS), Centre National de la Recherche Scientifique (CNRS)-Institut de Chimie du CNRS (INC)-Université de Rennes 1 (UR1), Université de Rennes (UNIV-RENNES)-Université de Rennes (UNIV-RENNES)-Ecole Nationale Supérieure de Chimie de Rennes (ENSCR)-Institut National des Sciences Appliquées - Rennes (INSA Rennes), and Institut National des Sciences Appliquées (INSA)-Université de Rennes (UNIV-RENNES)-Institut National des Sciences Appliquées (INSA)
International audience; We report here a rich variation of the thermoelectric properties of a series of Cu-Sn based thiospinels of composition CuM1+xSn1-xS4 upon partial substitution at the Sn-site with a variety of transition elements (M = Ti, V, Cr, Co). The optimized synthesis and processing conditions we used enabled us to realize highly densified and homogeneous compounds. The V-series was found to exhibit the lowest performing thermoelectric properties, whereas Co and Ti substituted compounds showed moderate thermoelectric properties with a maximum figure of merit (zT(max)) of similar to 0.02 and similar to 0.07 at 673 K, respectively. In contrast, the Cr substituted compounds exhibited better thermoelectric performance with zT similar to 0.2 at 673 K for the composition CuCr1.2Sn0.8S4. Both p- and n-type compounds were obtained; specifically, the Co and Ti series were found to be n-type, and the Cr series was found to be p-type. Besides the suppressed thermal transport, the attractive thermoelectric properties with the Cr-series can be attributed to the simultaneous increase of the Seebeck coefficient and electrical conductivity with increasing temperature, thus resulting in an improved power factor. Experimental and DFT theoretical calculations also predict a considerable interaction between the carriers and magnetic moments, contributing to a higher effective mass, thus leading to higher thermopower and power factor for the Cr-series. Computed electronic density of states and band structures, in agreement with the experimental findings, envisaged n-type half-metallic character for the CuTi1+xSn1-xS4 paramagnetic compounds, n-type conducting behavior for the CuCo1+xSn1-xS4 compounds, p-type weak half-metallic character for the CuV1+xSn1-xS4 compounds, and p-type semiconducting behavior for the CuCr1+xSn1-xS4 ferromagnetic compounds. Computation of the electronic transport coefficients using the Boltzmann transport equation also suggests a better thermoelectric property, especially the thermopower, for the Cr-series when compared to its Ti/V/Co counterparts.