12 results on '"Cui, Yinhua"'
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2. Low-Temperature Transient Liquid Phase Bonding Technology via Cu Porous-Sn58Bi Solid–Liquid System under Formic Acid Atmosphere
3. Fabrication of Ultra-Fine Micro-Vias in Non-Photosensitive Polyimide for High-Density Vertical Interconnects
4. Selectivities of an all-wet-processed electrode film on ITO, ZnO, SiNx and doped Si for solar cell applications
5. Determination of the characteristics of the metallic bonding interface and the bonding strength of a Cu interlayer by using atomic force microscopy
6. Variationally stable dynamic systems on time scales
7. Effect of Contact Plug Deposition Conditions on Junction Leakage and Contact Resistance in Multilevel CMOS Logic Interconnection Device
8. Process Optimization of Via Plug Multilevel Interconnections in CMOS Logic Devices
9. Quadratic rho-functional inequalities in beta-homogeneous normed spaces
10. Impulsive Stabilization of Dynamic Equations on Time Scales
11. Process Optimization of Via Plug Multilevel Interconnections in CMOS Logic Devices.
12. Application of valencene and prospects for its production in engineered microorganisms.
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