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The 9th edition of the Workshop on Metallization and Interconnection for Crystalline Silicon Solar Cells was held as an online event but nevertheless reached the workshop goals of knowledge sharing and networking. The technology of screen-printed contacts of high temperature pastes continues its fast progress enabled by better understanding of the phenomena taking place during printing and firing, and progress in materials. Great improvements were also achieved in low temperature paste printing and plated metallization. In the field of interconnection, progress was reported on multiwire approaches, electrically conductive adhesives and on foil-based approaches. Common to many contributions at the workshop was the use of advanced laser processes to improve performance or throughput.

The 6 th Metallization Workshop took place in Constance, Germany on 2 and 3 May 2016. At the workshop the latest progress in the understanding and application of metallization and interconnection was presented. Screen printed metallization continues to dominate. Material and application technologies are constantly further improved, with sub-40 μm fingers with high cell performance and low Ag consumption demonstrated. Cu plating technology is further perfected in anticipation of large scale industrial implementation, with improvements on adhesion and long term reliability. In interconnection, alternatives to the traditional ribbon soldering technology are proposed. Among them, the multi-wires interconnection schemes are shown to have a dramatic impact on metallization design and technology.

This article gives a summary of the 8th Metallization and Interconnection workshop and attempts to place each contribution in the appropriate context. The field of metallization and interconnection continues to progress at a very fast pace. Several printing techniques can now achieve linewidths below 20 µm. Screen printing is more than ever the dominating metallization technology in the industry, with finger widths of 45 µm in routine mass production and values below 20 µm in the lab. Plating technology is also being improved, particularly through the development of lower cost patterning techniques. Interconnection technology is changing fast, with introduction in mass production of multiwire and shingled cells technologies. New models and characterization techniques are being introduced to study and understand in detail these new interconnection technologies.

This paper summarizes the trends in metallization and interconnection technology in the eyes of the participants of the 8th Metallization and Interconnection Workshop. Participants were asked in a questionnaire to share their view on the future development of metallization technology, the kind of metal used for front side metallization and the future development of interconnection technology. The continuous improvement of the screen-printing technology is reflected in the high expected percentage share decreasing from 88% in three years to still 70% in ten years. The dominating front side metal in the view of the participants will be silver with an expected percentage share of nearly 70% in 2029. Regarding interconnection technologies, the experts of the workshop expect new technologies to gain significant technology shares faster. Whereas in three years soldering on busbars is expected to dominate with a percentage share of 71% it will drop in ten years to 35% in the eyes of the participants. Multiwire and shingling technologies are seen to have the highest potential with expected percentage shares of 33% (multiwire) and 16% (shingling) in ten years.

The 4th Metallization Workshop held in May 2013 in Constance, Germany, enabled experts in metallization for crystalline silicon solar cells to obtain a clear view on the status of the technology, as well as to exchange and generate new ideas and insights. From the contributions on the workshop, it was clear that the traditional metallization technique of screenprinting Ag paste has been improved in a dramatic way over the last two years, accelerating the decrease of Ag consumption per cell while improving solar cell efficiency. This was achieved through enhanced understanding of screenprinted contacts, improving Ag pastes and evolutionary modifications to the screenprinting technique. Alternatives to screenprinting, including electroplating of Ni and Cu contacts, also continue to progress, though not quite at the same impressive rate of improvement as Ag printing.

The participants of the 4th metallization workshop 2013 in Konstanz were asked to share their opinion on the future of metallization for crystalline silicon solar cells like during the previous three metallization workshop in Utrecht (2008), Konstanz (2010) and Charleroi (2011). The question “What is the future of metallization?” is one of the most important questions for the success of crystalline silicon solar cells in future. During the consecutive workshops between 71% and 75% of in average 170 participants have responded to the questionnaires. The participants represent the institutes/universities, material and equipment manufacturers and cell manufacturers. The results are presented in this document.

We present work on the impact of surface contamination before phosphorus diffusion on solar cells and life-time samples. Metal surface contamination on KOH/IPA textured Cz wafers was measured by the Sandwich-Etch ICP-MS technique. High surface contamination, especially of Cu, was found directly after texturing, which is attributed to low solubility of metals in diluted, non-oxidizing alkaline solution. Different contamination levels were reached by applying standard cleaning procedures such as HCl/HF dip sequences and the piranha etch. The emitter profiles that were tested ranged from heavy diffusions of 45 Ω/sq to shallow diffusions of 120 Ω/sq. It was found that threshold values which obviously impact life-times and solar cell performance (Voc) were much higher than expected.

We study recombination properties and the formation of base contacts, which are realized by local laser ablation of a dielectric stack and the subsequent full-area screen printing of an Al paste. Based on charge-carrier lifetime measurements using the camera-based calibration-free dynamic infrared lifetime mapping technique, we determine contact reverse saturation current densities as low as J0, cont = 9 X102 fA/cm2 on 1.5-Ωcmp-type float-zone silicon (FZ-Si) and J0, cont = 2X104 fA/cm2 on 200- Ωcmp-type FZ-Si. Scanning electron microscopy images reveal that the thickness of the highly Al-doped (Al-p+) layer considerably depends on the contact size and the contact layout (e.g., point or line contacts). Based on this finding, we show that Al-p+ layer thickness WAl-p+ significantly affects the contact recombination. As a result, we show which local contact geometry is most appropriate for the lowest contact recombination employing local Al-alloyed contacts.

Solar cell concepts with passivated, locally contacted rear side have gained much interest over the last years due to the development of advanced passivation techniques. However, there are still open questions regarding the understanding of the local Al-Si contact formation and its influence on the local back-surface-field formation for industrial screen-printed aluminum pastes. In this work we show that the geometry of the rear pattern (contact size and contact spacing) strongly influences the Al-Si interaction in the local contact openings: Si diffuses in Al through narrow dielectric barrier openings and spreads laterally to a determined limit determined by the firing temperature. We found that the contact spacing can affect the tendency for formation of Kirkendall voids below the Al-Si contacts instead of an eutectic layer. When decreasing the contact spacing and therefore the overlap of Al on each side of the local opening, the melt saturates faster and the formation of a deep (high-quality) local back-surface-field is increased. This may minimize the presence of voids. This physical observation helps on the design of the rear pattern for rear passivated solar cells and gives further understanding of the Al-Si interaction during the firing process.

The 5th Metallization Workshop took place in Constance, Germany on 20 and 21 October 2014 and provided an overview of research and development in the field of solar cell metallization. Enhanced understanding of contact structure and formation was obtained thanks to new characterization techniques. Great progress in metallization technologies was also reported. Screen printing technology is continuing its trajectory of continuous improvement, notably with fine-line screen printing (linewidth < 50μm) becoming a reality. Ni/Cu plating technology is also progressing fast, with many of the technical barriers to adoption being successfully removed. Finally, the workshop also highlighted the move towards a module-centric design of solar cell metallization, targeting high performance and low cost at module level.

The Third Workshop on Metallization for Crystalline Silicon Solar Cells was held in Charleroi, Belgium on 25 and 26 October 2011. This paper reports on the different contributions and discussions that took place. Great progress has recently been achieved in paste development, which yet again has stretched the lifetime of screen-printed metallization technology. Nevertheless, a transition towards Cu plating-based metallization is anticipated, and solutions to the different challenges were presented and discussed.

The potential of contact passivation for increasing cell performance is indicated by several results reported in the literature. However, scant characterization of the tunneling layers used for that purpose has been reported. In this paper, contact passivation is investigated by insertion of an ultra-thin AlOx layer between an n-type emitter and a Ti/Pd/Ag contact. By using a 1.5nm thick layer, an increase of the minority carrier lifetime by a factor of 2.7 is achieved. Since current-voltage measurements indicate that an ohmic behavior is conserved for AlOx layers as thick as 1.5nm, a 1.5nm AlOx layer is found to be a candidate of choice for contact passivation.

The application of local aluminum (Al)-alloyed contacts to the p-type base of silicon solar cells reduces minority charge carrier recombination due to the formation of a local back surface field (LBSF). We study the recombination properties and formation of base contacts, which are realized by local laser ablation of a dielectric stack (laser contact opening - LCO) and subsequent full area screen printing of Al paste. Based on charge carrier lifetime measurements using the camera-based and calibration-free dynamic infrared lifetime mapping (ILM) technique, we determine contact recombination velocities at the contacts as low as Scont = 65 cm/s on 200 Ωcm float-zone silicon (FZ-Si) and corresponding reverse saturation current densities of J0,cont = 900 fA/cm² on 1.5 Ωcm FZ-Si. As a result we show that local contact geometries with point contact radii r > 100 µm and line contact widths a > 80 µm are appropriate for lowest contact recombination employing local Al alloyed contacts. Furthermore, complete and high quality laser ablation of the dielectric stack is necessary for the formation of a sufficiently thick LBSF. © 2011 Published by Elsevier Ltd. Selection and/or peer-review under responsibility of SiliconPV 2011. local back surface field; carrier lifetime; laser ablation; silicon solar cells

Boron and oxygen contamination in Czochralski-grown (Cz) silicon leads to a degradation of the minority charge carrier lifetime within short times due to the formation of recombination active complexes. The formation of these complexes is investigated for longer times showing a further development of the defect. This development called ‘regeneration’ is triggered by illumination or applied forward voltages and leads to a new state of the defect. This new state of the defect is proven to be less recombination active allowing higher stable minority carrier lifetimes and conversion efficiencies of solar cells. The influences of temperature and light intensity are discussed. Copyright © 2007 John Wiley & Sons, Ltd.

A new reaction model concerning the boron-oxygen related degradation is presented, introducing a third recombination inactive state, that stabilizes the electrical parameters of Cz-Si solar cells, and the transition to this new inactive state is proven by experimental data. Furthermore, the stability under solar cell working conditions and the formation kinetics of this additional state are discussed.

We present the results of a survey on the future of metallization and interconnection. The survey was carried out at the 6 th Metallization Workshop that took place in Constance, Germany in May 2016. Experts were asked to forecast the development of metallization and interconnection technology for crystalline silicon solar cells in the next years. The results are presented and compared to the results of the previous years.

For the fifth time the experts in metallization, participating at the 5 th Metallization Workshop, were asked to forecast the development of metallization and interconnection technology for crystalline silicon solar cells in the next years. Like at the previous four workshops in Utrecht (2008), Constance (2010), Charleroi (2011) and Constance (2013) around 70% of the participants responded to the questionnaires. These experts represent institutes and universities (51%) and industry (49%) with material, equipment and cell manufactures. The results are presented in this paper and compared to the results of the previous years.

Efficiencies of large area n-type silicon solar cells with a screen printed rear side aluminum-alloyed emitter are mainly limited by their front surface recombination velocity. The front surface therefore has to be passivated by an effective passivation layer combined with a front surface field (FSF). In this work we investigate the influence of the front surface passivation quality and the base resistivity for a selective FSF n-type solar cell. The potential of this solar cell concept is assessed by PC1D simulations and QSSPC measurements. Furthermore we present solar cell results of all screen printed large area n-type Cz-Si solar cells with an aluminum rear emitter and a selective etch-back FSF passivated by a PECVD-SiNx or a SiO2/SiNx stack. The applied processing sequence is based on industrially available processing equipment and results in an independently confirmed cell efficiency of 19.4% on a 6” solar cell.

Good progress in the front silver metallization paste development has lead to significant efficiency improvements for standard crystalline silicon solar cells in the past years. In order to gain more insight into the contact mechanism, recent silver pastes capable of contacting higher resistive emitters – without selective emitter and without subsequent plating – were studied in this work. Within solar cell silver thick film contact investigations, two different theories predominate to explain the current transport from the silicon into the silver finger's bulk. The first one establishes that the current mainly flows through the Ag-crystallites grown into the silicon emitter that are either directly connected to the silver bulk or separated from the silver finger by a thin glass layer. The second one suggests that at optimum firing conditions nano-Ag-colloids are formed inside the glass layer allowing the current to flow into the silver finger through multi-step tunnelling. By sequential selective silver and glass etch-back and reconnection via liquid conductive silver, different combinations of conductivity path systems were investigated. On pyramidal textured Si, contacts from recent silver pastes reveal Ag-crystallites at the pyramid tops which are likely directly connected to the body of the Ag-finger. Even on flat Si we observe these likely direct contacts with advanced silver pastes. Our liquid conductive silver experiments indicate that the largest current contribution is flowing through these Ag-crystallites.