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4. Superluminal Geometrodynamics of Braneworld Hyperdrive via Brane-Bulk Interaction

Author

Alias, Anuar and Jalar, Azman

Subjects
Physics - General Physics
Abstract

Alcubierre warp-drive was first to introduce superluminal travel from different approach. Instead of creating short cut through spacetime via a wormhole, geometrodynamics of simultaneously contract and expand spacetime were conjectured. However, both methods require exotic matter that violate energy condition. In this paper we employ the concept of braneworld that naturally influence spacetime geometrodynamics. Start from define and develop the spacetime metric of braneworld warp bubble, the expression for energy densities as function of relevant parameters which contribute to the braneworld approach of superluminal travel by hyperspace-drive were derive, Comment: 15 pages, 9 figures

Published
2022

27. EDS analysis on effect of low dosage gamma radiation and micromechanical properties of SnAg3Cu0.5 solder.

Author

Lehan, Nur Farisa Nadia Mohmad, Yusoff, Wan Yusmawati Wan, Sobri, Normidatul Salwa, Ahmad, Ku Zarina Ku, Abdullah, Mohamad Faizal, Amat, Azuraida, Jalar, Azman, Rahman, Irman Abdul, and Salleh, Emee Marina

Subjects
SOLDER pastes, GAMMA rays, LEAD-free solder, SOLDER joints, SOLDER & soldering, STENCIL printing, RADIATION doses
Abstract

Electronic applications are now driving packaging technology that is equivalent to primary computer packages for the past 25 years. The electronic application currently shows an ascending market demand due to rapid development of smart and wireless component with mixed technologies that include digital microprocessors. In ensuring the quality of the devices, the reliability of the solder joint is very vital. Attributable to their common uses, radiation particles including gamma ray is considered as one of the primary factors that could degrade the performance of the electronic devices. Thus, in this study, both mechanical and microstructure properties of lead-free solder joints radiated with gamma were investigated. Prior to the evaluation, the solder pastes of tin–silver–copper (SnAg3Cu0.5; SAC305) was manually deposited on the printed circuit board using a stencil printing method and reflow soldering process. Subsequently, the solder was exposed to low doses of gamma radiation. The current finding showed that as the radiation dose increased, the solder sample became softer and more plastic. FESEM and EDS analysis signified that intermetallic layer in the tin (Sn) matrix was dominated by Cu6Sn5 and Ag2Sn compound. According to micromechanical investigation, both hardness and reduced modulus of the solder decreased with increasing the radiation dose that was due to microstructure change and the formation of voids. [ABSTRACT FROM AUTHOR]

Published
2022
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30. Horizontal Crack Induced Vertical Crack Formation in Epoxy Mold Compound for Electronic Packaging.

Author

Mardzukey Syed Mohamed Zain, Syed Mohamad, Jalar, Azman, Bakar, Maria Abu, Ani, Fakhrozi Che, and Ramli, Mohamad Riduwan

Subjects
EPOXY resins, TEMPERATURE, MOISTURE, THERMAL expansion, EXPANSION of gases
Abstract

Copyright of Informacije MIDEM: Journal of Microelectronics, Electronic Components & Materials is the property of MIDEM Society and its content may not be copied or emailed to multiple sites or posted to a listserv without the copyright holder's express written permission. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)

Published
2021
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33. Mechanical properties of PE-PET-PS-PP blends produced by high shear mixing.

Author

Rahmat Saat, Mohd Adly, Rasid, Rozaidi, Bakar, Maria Abu, Jalar, Azman, and Salleh, Emee Marina

Subjects
YOUNG'S modulus, YIELD stress, MIXING, POLYETHYLENE terephthalate, STRAIN rate, CRYSTALLIZATION, POLYMER blends
Abstract

Copyright of Polimery is the property of Industrial Chemistry Research Institute and its content may not be copied or emailed to multiple sites or posted to a listserv without the copyright holder's express written permission. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)

Published
2019
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38. Shock Wave Effect on Micromechanics Properties of Sn-Ag-Cu solder (SAC 387) via Nanoindentation

Author

Shafiqa, Nur, Yusmawati, Wan, Yusoff, Wan, Ismail, Ariffin, Ismail, Norliza, Marina, Emee, Abu, Maria, and, Bakar, and Jalar, Azman

Abstract

A variety of Sn-Ag-Cu solder alloys have been proposed and recommended for use in industrial organizations for example Sn-95.5Ag3.8Cu-0.7 (SAC 387) by the European Consortium Brite-Euram in the European Union. In this study an effect of shock wave on micromechanics properties of SAC 387 solder was investigated via nanoindentation approach. Solder joint of SAC 387 on copper substrate was prepared by hand soldering techniques. Then soldered samples were exposed to shock wave at different distance of 1 m, 2 m and 3 m. The shock wave test was conducted using 500 g of trinitrotoluene (TNT). Hardness value of SAC 387 decreased from 300 MPa to 130 MPa as well as reduced modulus drop from 115 GPa to 43 GPa after exposure. However the hardness and reduced modulus increased with increasing distance of the shock wave. The phenomenon revealed that shock wave deteriorated the micromechanics properties of soldered samples.

Published
2018

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