38 results on '"Jalar, Azman"'
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2. Undissolved gold in fine-pitch BGA solder joint under thermal cycling test
3. Titanium dioxide ion-sensitive extended gate field effect transistor (ISEGFET): selective detection of potassium ions in artificial blood serum
4. Superluminal Geometrodynamics of Braneworld Hyperdrive via Brane-Bulk Interaction
5. Effect of deformation temperature on the dynamic recrystallization mechanism and dynamic precipitation behavior of Mg-Gd-Nd-Zr alloy
6. Dynamic precipitation and dynamic recrystallization behaviors of Mg-Gd-Nd-Zr magnesium alloy during thermal compression deformation
7. Effect of Nd on microstructure and mechanical properties of Mg-7Gd-0.5Zr alloy
8. EDS analysis on effect of low dosage gamma radiation and micromechanical properties of SnAg3Cu0.5 solder
9. Magnesium-doped ZnO nanorod electrolyte–insulator–semiconductor (EIS) sensor for detecting calcium ions
10. Effect of heat shield locations on rework-induced thermal management in ball grid array solder joint
11. Calcium ion-selective electrode based on the facile synthesis of CuO over Cu wires
12. Low-cost fabrication of a pH sensor based on writing directly over parchment-type paper with pencil
13. Comparative study of interfacial interaction between aromatic and aliphatic functional group in solder wettability
14. Review on Corrosion in Electronic Packaging Trends of Collaborative between Academia–Industry
15. TEMPERATURE-INDUCED THICKNESS REDUCTION OF MICROMECHANICAL PROPERTIES OF Sn-0.7Cu SOLDER ALLOY
16. In-vitro bioactivity of wollastonite materials derived from limestone and silica sand
17. Low temperature production of wollastonite from limestone and silica sand through solid-state reaction
18. Structural and Optical Properties of a bi-Structured ZnO Film Prepared Via Electrodeposition
19. Nanosilicate Extraction from Rice Husk Ash as Green Corrosion Inhibitor
20. The Influence of Pd-Doped Au Wire Bonding on HAZ Microstructure and Looping Profile in Micro-Electromechanical Systems (MEMS) Packaging
21. Structural phase transformations in radiolytically synthesized Al–Cu bimetallic nanoparticles
22. Effect of 60% thickness reduction of Sn-Cu solder alloy on localized micromechanical properties via nanoindentation approach
23. Effect of Applied Load in the Nanoindentation of Gold Ball Bonds
24. Some thoughts on bondability and strength of gold wire bonding
25. Microhardness and Tensile Properties of a 6XXX Alloy Through Minor Additions of Zr
26. Electrical resistivity of Sn–3.0Ag–0.5Cu solder joint with the incorporation of carbon nanotubes
27. EDS analysis on effect of low dosage gamma radiation and micromechanical properties of SnAg3Cu0.5 solder.
28. Mechanical properties of Sn based lead free solder under different temperature
29. Mechanical properties of PE-PET-PS-PP blends produced by high shear mixing
30. Horizontal Crack Induced Vertical Crack Formation in Epoxy Mold Compound for Electronic Packaging.
31. Relationship of Mechanical and Micromechanical Properties with Microstructural Evolution of Sn-3.0Ag-0.5Cu (SAC305) Solder Wire Under Varied Tensile Strain Rates and Temperatures
32. Shock Wave Effect on Micromechanics Properties of Sn-Ag-Cu solder (SAC 387) via Nanoindentation
33. Mechanical properties of PE-PET-PS-PP blends produced by high shear mixing.
34. Bi - Structure ZnO Prepared via Cathodic Electrodeposition Method
35. High Sensitivity pH Sensor Based on Porous Silicon (PSi) Extended Gate Field-Effect Transistor
36. Effect of Geometric Parameters on the Performance of P-Type Junctionless Lateral Gate Transistors
37. Characterization of Oxide Growth on Surface of Al-Mg-Si Welded Joint
38. Shock Wave Effect on Micromechanics Properties of Sn-Ag-Cu solder (SAC 387) via Nanoindentation
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