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Your search keyword '"Kuroda, Tadahiro"' showing total 19 results
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19 results on '"Kuroda, Tadahiro"'

9. A 6800-μm2 Resistor-Based Temperature Sensor in 180-nm CMOS

Author

Angevare, J., Makinwa, K.A.A., and Kuroda, Tadahiro

Subjects
Materials science, business.industry, Temperature sensor, Track (disk drive), 020208 electrical & electronic engineering, Resolution (electron density), Thermal Sensing, Hardware_PERFORMANCEANDRELIABILITY, 02 engineering and technology, Atmospheric temperature range, Wien-Bridge, Temperature measurement, Trim, law.invention, Voltage-controlled oscillator, CMOS, law, Hardware_INTEGRATEDCIRCUITS, 0202 electrical engineering, electronic engineering, information engineering, Optoelectronics, Resistor, business
Abstract

A resistor-based temperature sensor has been realized in 180 nm CMOS for SoC thermal management applications. Occupying only 6800 μm2, it is the smallest resistor-based temperature sensor ever reported. This is achieved by employing a compact highly-digital VCO-based ADC. After a 2-point trim, the sensor achieves an inaccuracy of ±0.35 °C (3σ) in a temperature range from-35 °C to 125 °C. By achieving a resolution of 0.12 °C (rms) at 2.8kSa/s, it can track the fast thermal-transients in SoCs.

Published
2018

18. 3D NoC with Inductive-Coupling Links for Building-Block SiPs.

Author

Take, Yasuhiro, Matsutani, Hiroki, Sasaki, Daisuke, Koibuchi, Michihiro, Kuroda, Tadahiro, and Amano, Hideharu

Subjects
NETWORKS on a chip, COMPUTER input-output equipment, COMPUTER architecture, NETWORK routing protocols, BIDIRECTIONAL associative memories (Computer science), ELECTRIC inductors
Abstract

A wireless 3D NoC architecture is described for building-block SiPs, in which the number of hardware components (or chips) in a package can be changed after chips have been fabricated. The architecture uses inductive-coupling links that can connect more than two examined dies without wire connections. Each chip has data transceivers for the uplink and downlink in order to communicate with its neighboring chips in the package. These chips form a vertical unidirectional ring network so as to fully exploit the flexibility of the wireless approach that enables us to add, remove, and swap the chips in the ring. To avoid protocol and structural deadlocks in the ring, we use bubble flow control, which does not rely on the conventional VC-based deadlock avoidance mechanism. In addition, we propose a bidirectional communication scheme to form a bidirectional ring network by using the inductive-coupling transceivers that can dynamically change the communication modes, such as TX, RX, and Idle modes. This paper illustrates the inductive-coupling transceiver circuits, which can carry high data transfer rates of up to 8 Gbps per channel, for the wireless 3D NoC. It also illustrates an implementation of a wireless 3D NoC that has on-chip routers and transceivers implemented with a 65 nm process in order to show the feasibility of our proposal. The vertical bubble flow control and conventional VC-based approach on the uni- and bidirectional ring networks are compared with the vertical broadcast bus in terms of throughput, hardware amount, and application performance using a full system multiprocessor simulator. The results show that the proposed bidirectional communication scheme efficiently improves application performance without adding any inductive-coupling transceivers. In addition, the proposed vertical bubble flow network outperforms the conventional VC-based approach by 7.9-12.5 percent with a 33.5 percent smaller router area for building-block SiPs connecting up to eight chips. [ABSTRACT FROM PUBLISHER]

Published
2014
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19. A 107-pJ/bit 100-kb/s 0.18-μm Capacitive-Coupling Transceiver With Data Edge Signaling and DC Power-Free Pulse Detector for Printable Communication Sheet.

Author

Lechang Liu, Takamiya, Makoto, Sekitani, Tsuyoshi, Noguchi, Yoshiaki, Nakano, Shintaro, Zaitsu, Koichiro, Kuroda, Tadahiro, Someya, Takao, and Sakurai, Takayasu

Subjects
WIRELESS communications, RADIO frequency modulation, RADIO transmitter-receivers, COMPLEMENTARY metal oxide semiconductors, DIGITAL electronics
Abstract

A novel communication system which simultaneously achieves the mobility of wireless communication and the low-power performance of wireline communication is developed with a printable sheet. By combining meter-scale wireline communication and micrometer-scale wireless capacitive-coupling communication, the proposed communication system enables multiple electronic objects scattered over tables, walls, and ceilings to communicate contactlessly with each other by establishing communication paths without cumbersome physical connections. The transceiver developed for the 20 cm × 20 cm communication sheet features a data-edge-signaling transmitter and a dc power-free pulse detector, thereby achieving the lowest energy of 107 pJ/bit at 100 kb/s in wireless communications at a distance of 60 cm in 0.18-μm CMOS. [ABSTRACT FROM AUTHOR]

Published
2009
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