Search

Current reports of thermal expansion coefficients (TEC) of two-dimensional (2D) materials show large discrepancies that span orders of magnitude. Determining the TEC of any 2D material remains difficult due to approaches involving indirect measurement of samples that are atomically thin and optically transparent. We demonstrate a methodology to address this discrepancy and directly measure TEC of nominally monolayer epitaxial WSe2 using four-dimensional scanning transmission electron microscopy (4D-STEM). Experimentally, WSe2 from metal-organic chemical vapor deposition (MOCVD) was heated through a temperature range of 18-564 °C using a barrel-style heating sample holder to observe temperature-induced structural changes without additional alterations or destruction of the sample. By combining 4D-STEM measurements with quantitative structural analysis, the thermal expansion coefficient of nominally monolayer polycrystalline epitaxial 2D WSe2 was determined to be (3.5 ± 0.9) × 10-6 K-1 and (5.7 ± 2) × 10-5 K-1 for the in- and out-of-plane TEC, respectively, and (3.6 ± 0.2) × 10-5 K-1 for the unit cell volume TEC, in good agreement with historically determined values for bulk crystals.

The influence of the etching method on the occurrence of defect levels in InAs/InAsSb type-II superlattice (T2SLs) and MCT photodiode is presented. For both analyzed detectors, the etching process was performed by two methods: wet chemical etching and dry etching using an ion beam (RIE—reactive ion etching). The deep-level transient spectroscopy (DLTS) method was used to determine the defect levels occurring in the analyzed structures. The obtained results indicate that the choice of etching method affects the occurrence of additional defect levels in the MCT material, but it has no significance for InAs/InAsSb T2SLs. [ABSTRACT FROM AUTHOR]

Beta-phase gallium oxide (β-Ga2O3) is a cutting-edge ultrawide bandgap (UWBG) semiconductor, featuring a bandgap energy of around 4.8 eV and a highly critical electric field strength of about 8 MV/cm. These properties make it highly suitable for next-generation power electronics and deep ultraviolet optoelectronics. Key advantages of β-Ga2O3 include the availability of large-size single-crystal bulk native substrates produced from melt and the precise control of n-type doping during both bulk growth and thin-film epitaxy. A comprehensive understanding of the fundamental growth processes, control parameters, and underlying mechanisms is essential to enable scalable manufacturing of high-performance epitaxial structures. This review highlights recent advancements in the epitaxial growth of β-Ga2O3 through various techniques, including Molecular Beam Epitaxy (MBE), Metal-Organic Chemical Vapor Deposition (MOCVD), Hydride Vapor Phase Epitaxy (HVPE), Mist Chemical Vapor Deposition (Mist CVD), Pulsed Laser Deposition (PLD), and Low-Pressure Chemical Vapor Deposition (LPCVD). This review concentrates on the progress of Ga2O3 growth in achieving high growth rates, low defect densities, excellent crystalline quality, and high carrier mobilities through different approaches. It aims to advance the development of device-grade epitaxial Ga2O3 thin films and serves as a crucial resource for researchers and engineers focused on UWBG semiconductors and the future of power electronics. [ABSTRACT FROM AUTHOR]

2D materials have received a lot of interest over the past decade. Especially van der Waals (vdW) 2D materials, such as transition metal dichalcogenides (TMDCs), and their heterostructures exhibit semiconducting properties that make them highly suitable for novel device applications. Controllable mixing and matching of the 2D materials with different properties and precise control of the in‐plane twist angle in these heterostructures are essential to achieve superior properties and need to be established through large‐scale device fabrication. To gain fundamental insight into the potential control of these twist angles, 2D heterostructures of tungsten disulfide (WS2) and graphene (Gr) grown by bottom‐up synthesis via metal‐organic chemical vapor deposition (MOCVD) are investigated using a scanning transmission electron microscope (STEM). Specifically, the combination of conventional high‐resolution imaging with scanning nanobeam diffraction (SNBD) using advanced 4D STEM techniques is used to analyze moiré structures. The latter technique is used to reveal the epitaxial alignment within the WS2/Gr heterostructure, showing a direct influence of the underlying Gr layers on the moiré structure in the subsequent WS2 layers. In particular, the importance of grain boundaries (GBs) within the underlying WS2 and Gr layers on the structure of moiré patterns with rotation angles below 2° is discussed. [ABSTRACT FROM AUTHOR]

Large-area epitaxial growth of III-V nanowires and thin films on van der Waals substrates is key to developing flexible optoelectronic devices. In our study, large-area InAs nanowires and planar structures are grown on hexagonal boron nitride templates using metal organic chemical vapor deposition method without any catalyst or pre-treatments. The effect of basic growth parameters on nanowire yield and thin film morphology is investigated. Under optimised growth conditions, a high nanowire density of 2.1×109cm-2is achieved. A novel growth strategy to achieve uniform InAs thin film on h-BN/SiO2/Si substrate is introduced. The approach involves controlling the growth process to suppress the nucleation and growth of InAs nanowires, while promoting the radial growth of nano-islands formed on the h-BN surface. A uniform polycrystalline InAs thin film is thus obtained over a large area with a dominant zinc-blende phase. The film exhibits near-band-edge emission at room temperature and a relatively high Hall mobility of 399 cm-2/(Vs). This work suggests a promising path for the direct growth of large-area, low-temperature III-V thin films on van der Waals substrates.

The rough morphology at the growth surface results in the non-uniform distribution of indium composition, intentionally or unintentionally doped impurity, and thus impacts the performance of GaN-based optoelectronic and vertical power electronic devices. We observed the morphologies of unintentionally doped GaN homo-epitaxially grown via MOCVD and identified the relations between rough surfaces and the miscut angle and direction of the substrate. The growth kinetics under the effect of the Ehrlich–Schwoebel barrier were studied, and it was found that asymmetric step motions in samples with a large miscut angle or those grown at high temperature were the causes of step-bunching. Meandering steps were believed to be caused by surface free energy minimization for steps with wide terraces or deviating from the [ 1 1 ¯ 00 ] m-direction. [ABSTRACT FROM AUTHOR]

Abstract 2D materials have received a lot of interest over the past decade. Especially van der Waals (vdW) 2D materials, such as transition metal dichalcogenides (TMDCs), and their heterostructures exhibit semiconducting properties that make them highly suitable for novel device applications. Controllable mixing and matching of the 2D materials with different properties and precise control of the in‐plane twist angle in these heterostructures are essential to achieve superior properties and need to be established through large‐scale device fabrication. To gain fundamental insight into the potential control of these twist angles, 2D heterostructures of tungsten disulfide (WS2) and graphene (Gr) grown by bottom‐up synthesis via metal‐organic chemical vapor deposition (MOCVD) are investigated using a scanning transmission electron microscope (STEM). Specifically, the combination of conventional high‐resolution imaging with scanning nanobeam diffraction (SNBD) using advanced 4D STEM techniques is used to analyze moiré structures. The latter technique is used to reveal the epitaxial alignment within the WS2/Gr heterostructure, showing a direct influence of the underlying Gr layers on the moiré structure in the subsequent WS2 layers. In particular, the importance of grain boundaries (GBs) within the underlying WS2 and Gr layers on the structure of moiré patterns with rotation angles below 2° is discussed.

Aluminum nitride (AlN) grown on vertical surfaces can be utilized for the fabrication of advanced piezoelectric microelectromechanical systems (MEMS). The in‐plane motion of the parts of a MEMS element is possible when AlN is deposited on the vertical surfaces of the moving structure. For the best device performance, AlN must have high crystal quality, uniform coverage of the vertical sidewalls, and c‐axis crystalline orientation perpendicular to the plane of a vertical surface. The impact of the surface roughness (Rq) of the vertical sidewalls formed in Si using wet and dry etching methods on the crystal quality, crystallographic orientation, and uniformity of the metalorganic chemical vapor deposited (MOCVD) AlN thin films is studied in this paper. In both cases, AlN films demonstrated full sidewall coverage and grew crystalline in the c‐axis direction. AlN films grown on vertical Si surfaces achieved using anisotropic wet etching are highly crystalline and oriented in [0001] direction, while the films grown on vertical surfaces achieved using dry etching displayed a lower level of alignment with the Si sidewalls. [ABSTRACT FROM AUTHOR]

A dense and smooth aluminium nitride thin film grown on a silicon (111) substrates using pulsed metal–organic chemical vapor deposition is presented. The influence of the pulsed cycle numbers on the surface morphology and crystalline quality of the aluminium nitride films are discussed in detail. It was found that 70 cycle numbers produced the most optimized aluminium nitride films. Field emission scanning electron microscopy and atomic force microscopy images show a dense and smooth morphology with a root-mean-square-roughness of 2.13 nm. The narrowest FWHM of the X-ray rocking curve for the AlN 0002 and 10–12 reflections are 2756 arcsec and 3450 arcsec, respectively. Furthermore, reciprocal space mapping reveals an in-plane tensile strain of 0.28%, which was induced by the heteroepitaxial growth on the silicon (111) substrate. This work provides an alternative approach to grow aluminium nitride for possible application in optoelectronic and power devices. [ABSTRACT FROM AUTHOR]

High-power quantum cascade lasers (QCLs) have a wide application prospect. In this paper, a high-power high-beam-quality device with a large ridge width is demonstrated. The effect of different ridge widths on mode loss was studied, and the results showed that the mode loss decreased as the ridge width increased. Furthermore, as the width of the ridge increased, the temperature of the active region rose. In the experiment, the wafers were grown by metal–organic chemical vapor deposition (MOCVD), and the ridge width of the device was controlled by wet etching. A laser with a ridge width of 15 µm and a length of 5 mm achieved an output of 2.2 W under 288 K continuous wave (CW) operation, with a maximum slow-axis divergence angle of 27.2° and a device wavelength of 5 μm. The research results of this article promote the industrial production of base transverse mode QCL. [ABSTRACT FROM AUTHOR]

Quantum well infrared photodetectors (QWIPs) have been demonstrated to be a suitable candidate for IR detection applications. These detectors attracted increasing interest due to their design flexibility and broad spectral absorption from short wave (SWIR) to long wave infrared (LWIR) and high uniformity. In this paper, we demonstrate device design, growth, and characterization of a p-type AlxGa1-xN/GaN quantum well infrared photodetector (QWIP) for near IR absorption with 1.55 μm peak grown by metal organic chemical vapor deposition (MOCVD). Utilizing a p-QWIP allows for normal incidence light absorption due to the strong band mixing between heavy and light holes at k ≠ 0 which eliminates the need for light couplers such as grating and facilitates the fabrication of large focal plane arrays (FPAs). We developed MOCVD growth conditions to achieve nm-thick and smooth interfaces in QWIP. Sample characterizations including atomic force microscopy (AFM) show uniform surface morphology with RMS roughness ∼0.5 nm. Scanning transmission electron microscopy (STEM) was used to characterize layer thicknesses and interface roughness. We demonstrate energy band diagram simulation of an AlxGa1-xN/GaN p-QWIP by considering polarization chargers to determine the accurate band offset and adjust the absorption wavelength (ISBT energies). Our results show the feasibility of MOCVD-grown p-type AlxGa1-xN/GaN QWIP for IR absorption and open a pathway for further research and growth development on III-Nitride p-QWIPs, allowing growth and fabrication of large focal plane arrays.

The influence of the etching method on the occurrence of defect levels in InAs/InAsSb type-II superlattice (T2SLs) and MCT photodiode is presented. For both analyzed detectors, the etching process was performed by two methods: wet chemical etching and dry etching using an ion beam (RIE—reactive ion etching). The deep-level transient spectroscopy (DLTS) method was used to determine the defect levels occurring in the analyzed structures. The obtained results indicate that the choice of etching method affects the occurrence of additional defect levels in the MCT material, but it has no significance for InAs/InAsSb T2SLs.

Beta-phase gallium oxide (β-Ga2O3) is a cutting-edge ultrawide bandgap (UWBG) semiconductor, featuring a bandgap energy of around 4.8 eV and a highly critical electric field strength of about 8 MV/cm. These properties make it highly suitable for next-generation power electronics and deep ultraviolet optoelectronics. Key advantages of β-Ga2O3 include the availability of large-size single-crystal bulk native substrates produced from melt and the precise control of n-type doping during both bulk growth and thin-film epitaxy. A comprehensive understanding of the fundamental growth processes, control parameters, and underlying mechanisms is essential to enable scalable manufacturing of high-performance epitaxial structures. This review highlights recent advancements in the epitaxial growth of β-Ga2O3 through various techniques, including Molecular Beam Epitaxy (MBE), Metal-Organic Chemical Vapor Deposition (MOCVD), Hydride Vapor Phase Epitaxy (HVPE), Mist Chemical Vapor Deposition (Mist CVD), Pulsed Laser Deposition (PLD), and Low-Pressure Chemical Vapor Deposition (LPCVD). This review concentrates on the progress of Ga2O3 growth in achieving high growth rates, low defect densities, excellent crystalline quality, and high carrier mobilities through different approaches. It aims to advance the development of device-grade epitaxial Ga2O3 thin films and serves as a crucial resource for researchers and engineers focused on UWBG semiconductors and the future of power electronics.

In this work, we investigated the MOCVD conditions to synthesize thin films with the hexagonal P63cm h-LuMnO3 phase as a potential low-band gap ferroelectric material. The main parameters investigated were the ratio of organometallic starting materials, substrate temperature, and annealing effect. Two different substrates were used in the study: fused silica (SiO2) glass and platinized silicon (Pt\Ti\SiO2\Si(100)). In order to investigate the thermodynamic stability and quality of the developed phases, a detailed analysis of the crystal structure, microstructure, morphology, and roughness of the films was performed by X-ray diffractometer, scanning electron microscopy (SEM), energy dispersive spectrometry (EDS), Raman spectroscopy, and piezoelectric force microscopy (PFM). Molar compositions in the film within 0.93 < |Lu|/|Mn| < 1.33 were found to be suitable for obtaining a single-phase h-LuMnO3. The best films were obtained by depositions at 700 °C, followed by thermal treatments at 800 °C for long periods of up to 12 h. These films exhibited a highly crystalline hexagonal single phase with a relatively narrow direct band gap, around 1.5 eV, which is within the expected values for the h-LuMnO3 system. [ABSTRACT FROM AUTHOR]

Two-dimensional (2D) materials have emerged as a promising class of materials with unique physical and chemical properties that offer exciting prospects for various applications. Among all the synthesis methods, chemical vapor deposition (CVD) techniques have demonstrated great advantages in the large-scale production of 2D materials with a controlled thickness. One of the main challenges in the growth of 2D materials is the need for high temperatures and crystalline substrates, which restrict the scalability and compatibility of 2D materials with existing manufacturing processes, due to the high thermal budget and the necessity to transfer the 2D films to secondary substrates. Low-temperature growth methods for 2D materials have the potential to overcome this challenge and enable the integration of 2D materials into a wide range of devices and applications. In recent years, there have been substantial efforts to develop low-temperature growth techniques for different 2D materials, including graphene, hexagonal boron nitride and transition metal dichalcogenides. These methods include thermal CVD, plasma-enhanced CVD, atomic layer deposition and metal-organic chemical vapor deposition. This review not only discusses the progress in the growth but also highlights the applications of low-temperature-grown 2D materials in various fields, such as field effect transistors, sensors, photodetectors, catalysts, batteries and supercapacitors. [ABSTRACT FROM AUTHOR]

In this study, the impact of organometallic chemical vapor deposition (MOCVD) deposition temperature on the growth mechanism of SiOC coatings was studied in detail. For this purpose, four different SiOC coatings were prepared at deposition temperatures of 1050, 1100, 1150, and 1200 °C. The surface morphology and surface roughness of the prepared coatings were examined by field-emission scanning electron microscope (FESEM) and atomic force microscope (AFM), respectively. X-ray photoelectron spectroscopy (XPS) was employed to analyze the composition and structural units in the prepared coatings. The phase structure of SiOC coatings was analyzed by grazing incident diffraction of x-rays (GIXRD) and high resolution transmission electron microscope (HRTEM). Results revealed that, the starting temperature of homogeneous reaction in the cavity is 1100 °C, while the degree of heterogeneous reaction in the cavity reaches its maximum value at 1200 °C. With the increase in deposition temperature, more surface protrusions, a greater degree of homogeneous reaction and the evolution of graphite and 3C-SiC crystalline phases are resulted, which lead to the reduction of deposition rate of SiOC coatings. Furthermore, for SiOC coatings, flat surface morphology and less content of Si-O-Si bonds improve the HF acid etching resistance of SiOC coatings. [ABSTRACT FROM AUTHOR]

The surface morphology of a buffer template is an important factor in the heteroepitaxial integration of optoelectronic devices with a significant lattice mismatch. In this work, InP-based long-wave infrared (~8 µm) emitting quantum cascade lasers with active region designs lattice-matched to InP were grown on GaAs and Si substrates employing InAlGaAs step-graded metamorphic buffer layers, as a means to assess the impact of surface roughness on device performance. A room-temperature pulsed-operation lasing with a relatively good device performance was obtained on a Si template, even with a large RMS roughness of 17.1 nm over 100 µm2. Such results demonstrate that intersubband-operating devices are highly tolerant to large RMS surface roughness, even in the presence of a high residual dislocation density. [ABSTRACT FROM AUTHOR]

High-temperature annealing has been regarded as an effective technology to improve the performance of Ga2O3-based solar-blind photodetectors (SBPDs). However, as a metastable phase, ε-Ga2O3 thin film may undergo phase transformation during post-annealing. Therefore, it is necessary to investigate the effect of the phase transition and the defect formation or desorption on the performance of photodetectors during post-annealing. In this work, the ε-Ga2O3 thin films were grown on c-plane sapphire with a two-step method, carried out in a metal-organic chemical vapor deposition (MOCVD) system, and the ε-Ga2O3 metal-semiconductor-metal (MSM)-type SBPDs were fabricated. The effects of post-annealing on ε-Ga2O3 MSM SBPDs were investigated. As a metastable phase, ε-Ga2O3 thin film undergoes phase transition when the annealing temperature is higher than 700 °C. As result, the decreased crystal quality makes an SBPD with high dark current and long response time. In contrast, low-temperature annealing at 640 °C, which is the same as the growth temperature, reduces the oxygen-related defects, as confirmed by X-ray photoelectron spectroscopy (XPS) measurement, while the good crystal quality is maintained. The performance of the SBPD with the post-annealing temperature of 640 °C is overall improved greatly compared with the ones fabricated on the other films. It shows the low dark current of 0.069 pA at 10 V, a rejection ratio (Rpeak/R400) of 2.4 × 104 (Rpeak = 230 nm), a higher photo-to-dark current ratio (PDCR) of 3 × 105, and a better time-dependent photoresponse. These results indicate that, while maintaining no phase transition, post-annealing is an effective method to eliminate point defects such as oxygen vacancies in ε-Ga2O3 thin films and improve the performance of SBPDs. [ABSTRACT FROM AUTHOR]

Acquiring homogeneous and reproducible wafer-scale transition metal dichalcogenide (TMDC) films is crucial for modern electronics. Metal–organic chemical vapor deposition (MOCVD) offers a promising approach for scalable production and large-area integration. However, during MOCVD synthesis, extraneous carbon incorporation due to organosulfur precursor pyrolysis is a persistent concern, and the role of unintentional carbon incorporation remains elusive. Here, we report the large-scale synthesis of molybdenum disulfide (MoS2) thin films, accompanied by the formation of amorphous carbon layers. Using Raman, photoluminescence (PL) spectroscopy, and transmission electron microscopy (TEM), we confirm how polycrystalline MoS2 combines with extraneous amorphous carbon layers. Furthermore, by fabricating field-effect transistors (FETs) using the carbon-incorporated MoS2 films, we find that traditional n-type MoS2 can transform into p-type semiconductors owing to the incorporation of carbon, a rare occurrence among TMDC materials. This unexpected behavior expands our understanding of TMDC properties and opens up new avenues for exploring novel device applications. [ABSTRACT FROM AUTHOR]

Deep-level transient spectroscopy (DLTS) measurements were performed on HgCdTe heterostructure photodiode grown by metal-organic chemical vapor deposition (MOCVD) on GaAs substrate. In order to extract defects from individual layers of the heterostructure, three consecutive etchings were performed. In the first experiment, the N+/T/p/T/P+/n+ structure was chemically etched to the N+ bottom contact to obtain a mesa-type detector. Six localized defects were extracted across the entire photodiode. In the second experiment, the bottom contact was made to the p-type absorber. Two localized defects were found in the p/T/P+/n+ structure. In the third experiment, the top layers were removed and N+/T/p type detector was made—the cap contact was made to the p-type absorber, the bottom to the N+ layer. Five defect levels were identified, three of which overlap with the first experiment. A deep-trap level located at 183 meV above the top of the valence band was identified within the absorber bandgap. This energy coincides with the activation energy determined from the Arrhenius plot for the dark currents. A defect at the level of ∼0.5Eg suggests that the dark current at low reverse bias voltage is dominated by the Shockley–Read–Hall (SRH) mechanism. [ABSTRACT FROM AUTHOR]

Experimental results are reported for a medium-wavelength infrared (MWIR) HgCdTe photodetector designed in a joint laboratory run by VIGO Photonics S.A. and the Military University of Technology. The parameters of the MWIR detectors fabricated with HgCdTe heterostructures were studied. Advances in the metal–organic chemical vapor deposition (MOCVD) technique enable the growth of HgCdTe epilayers with a wide range of composition and doping, used for uncooled infrared detectors. Device-quality HgCdTe heterostructures were deposited on 2-inch-diameter, low-cost (100) GaAs substrates. The heterostructures obtained were examined measuring the spectral response and current–voltage characteristics in different temperatures. Our intention here was to determine the relationship between electrical and optical results, using thermal analysis of dark current properties and photocurrent and spectral characteristics. The appearance of an additional signal source in certain ranges of reverse voltages was examined. Comparative analysis of the electrical and electro-optical characterization enabled us to isolate the photocurrent originating from different layers of the detector structure. Automated measurement techniques make it possible to correlate current responsivity with current–voltage curves measured as a function of temperature in a range from 10 K to 300 K with ±0.05 K resolution without human exertion. LabVIEW-aided data acquisition enables the averaging of each characteristic several hundred times, eliminates random and human errors, and decreases measurement uncertainty. [ABSTRACT FROM AUTHOR]

Abstract Aluminum nitride (AlN) grown on vertical surfaces can be utilized for the fabrication of advanced piezoelectric microelectromechanical systems (MEMS). The in‐plane motion of the parts of a MEMS element is possible when AlN is deposited on the vertical surfaces of the moving structure. For the best device performance, AlN must have high crystal quality, uniform coverage of the vertical sidewalls, and c‐axis crystalline orientation perpendicular to the plane of a vertical surface. The impact of the surface roughness (Rq) of the vertical sidewalls formed in Si using wet and dry etching methods on the crystal quality, crystallographic orientation, and uniformity of the metalorganic chemical vapor deposited (MOCVD) AlN thin films is studied in this paper. In both cases, AlN films demonstrated full sidewall coverage and grew crystalline in the c‐axis direction. AlN films grown on vertical Si surfaces achieved using anisotropic wet etching are highly crystalline and oriented in [0001] direction, while the films grown on vertical surfaces achieved using dry etching displayed a lower level of alignment with the Si sidewalls.

Using four-dimensional scanning transmission electron microscopy, we demonstrate a method to visualize grains and grain boundaries in WSe2 grown by metal organic chemical vapor deposition (MOCVD) directly onto silicon dioxide. Despite the chemical purity and uniform thickness and texture of the MOCVD-grown WSe2, we observe a high density of small grains that corresponds with the overall selenium deficiency we measure through ion beam analysis. Moreover, reconstruction of grain information permits the creation of orientation maps that demonstrate the nucleation mechanism for new layers-triangular domains with the same orientation as the layer underneath induces a tensile strain increasing the lattice parameter at these sites.

Volatile, reactive, and thermally stable organometallic copper and silver complexes are of significant interest as precursors for the metalorganic chemical vapor deposition (MOCVD) and atomic layer deposition (ALD) of ultra-thin metallic films. Well-established CuI and AgI precursors are commonly stabilized by halogens, phosphorous, silicon, and oxygen, potentially leading to the incorporation of these elements as impurities in the thin films. These precursors are typically stabilized by a neutral and anionic ligand. Recent advancements were established by the stabilization of these complexes using N-heterocyclic carbenes (NHCs) as neutral ligands. To further enhance the reactivity, in this study the anionic ligand is sequentially changed from β-diketonates to β-ketoiminates and β-diketiminates, yielding two new CuI and two new AgI NHC-stabilized complexes in the general form of [M(NHC) (R)] (M = Cu, Ag; R = β-ketoiminate, β-diketiminate). The synthesized complexes were comparatively analyzed in solid, dissolved, and gaseous states. Furthermore, the thermal properties were investigated to assess their potential application in MOCVD or ALD. Among the newly synthesized complexes, the β-diketiminate-based [Cu(tBuNHC) (NacNacMe)] was identified to be the most suitable candidate as a precursor for Cu thin film deposition. The resulting halogen-, oxygen-, and silicon-free CuI and AgI precursors for MOCVD and ALD applications are established for the first time and set a new baseline for coinage metal precursors.

Metal-Organic CVD method (MOCVD) allows for deposition of ultrathin 2D transition metal dichalcogenides (TMD) films of electronic quality onto wafer-scale substrates. In this work, the effect of temperature on structure, chemical states, and electronic qualities of the MOCVD MoS2 films were investigated. The results demonstrate that the temperature increase in the range of 650 °C to 950 °C results in non-monotonic average crystallite size variation. Atomic force microscopy (AFM), transmission electron microscopy (TEM), and Raman spectroscopy investigation has established the film crystal structure improvement with temperature increase in this range. At the same time, X-Ray photoelectron spectroscopy (XPS) method allowed to reveal non-stoichiometric phase fraction increase, corresponding to increased sulfur vacancies (VS) concentration from approximately 0.9 at.% to 3.6 at.%. Established dependency between the crystallite domains size and VS concentration suggests that these vacancies are form predominantly at the grain boundaries. The results suggest that an increased Vs concentration and enhanced charge carriers scattering at the grains' boundaries should be the primary reasons of films' resistivity increase from 4 kΩ·cm to 39 kΩ·cm. [ABSTRACT FROM AUTHOR]

Among semiconductor metal oxides, that are an important class of sensing materials, titanium dioxide (TiO2) thin films are widely employed as sensors because of their high chemical and mechanical stability in harsh environments, non-toxicity, eco-compatibility, and photocatalytic properties. TiO2-based chemical oxygen demand (COD) sensors exploit the photocatalytic properties of TiO2 in inducing the oxidation of organic compounds to CO2. In this work, we discuss nanostructured TiO2 thin films grown via low-pressure metal organic chemical vapor deposition (MOCVD) on metallic AISI 316 mesh. To increase the surface sensing area, different inorganic acid-based chemical etching protocols have been developed, determining the optimal experimental conditions for adequate substrate roughness. Both chemically etched pristine meshes and the MOCVD-coated ones have been studied by scanning electron microscopy (SEM), X-ray diffraction (XRD), energy dispersive X-ray (EDX) microanalysis, and X-ray photoelectron spectroscopy (XPS). We demonstrate that etching by HCl/H2SO4 at 55 °C provides the most suitable surface morphology. To investigate the behavior of the developed high surface area TiO2 thin films as COD sensors, photocatalytic degradation of functional model pollutants based on ISO 10678:2010 has been tested, showing for the best performing acid-etched mesh coated with polycrystalline TiO2 an increase of 60% in activity, and degrading 66 µmol of MB per square meter per hour. [ABSTRACT FROM AUTHOR]

In this article, a high-composition (>35%) thick-barrier (>30 nm) AlGaN/AlN/GaN high-electron-mobility transistor (HEMT) structure grown on a sapphire substrate with ultra-low sheet resistivity (<250 Ω/□) is reported. The optimization of growth conditions, such as reduced deposition rate, and the thickness optimization of different epitaxial layers allowed us to deposit a crack-free high-composition and thick AlGaN barrier layer HEMT structure. A significantly high two-dimensional electron gas (2DEG) density of 1.46 × 1013 cm−2 with a room-temperature mobility of 1710 cm2/V·s was obtained via Hall measurement using the Van der Pauw method. These state-of-the-art results show great potential for high-power Ga-polar HEMT design on sapphire substrates. [ABSTRACT FROM AUTHOR]

We employed the selective-area-epitaxy technique using metalorganic chemical vapor deposition to fabricate and study samples of semiconductor heterostructures that incorporate highly strained InGaAs quantum wells (980–990 nm emission wavelength). Selective area epitaxy of InGaAs quantum wells was performed on templates that had a patterned periodic structure consisting of a window (where epitaxial growth occurred) and a passive mask (where epitaxial growth was suppressed), each with a width of 100 µm for every element. Additionally, a selectively grown potential barrier layer was included, which was characterized by an almost parabolic curvature profile of the surface. We conducted a study on the influence of the curvature profile of the growth surface on the optical properties of InGaAs quantum wells and the spatial distribution of composition in an ultrawide window. Our results showed that, under fixed selective-area-epitaxy conditions, the composition of the InxGa1−xAs and the wavelength of the quantum-well emission changed across the width of the window. Our study demonstrates that increasing the curvature profile of the growth surface of highly strained quantum wells leads to a transition in the photoluminescence wavelength distribution profile across the window, from quasi-parabolic to inverted parabolic. [ABSTRACT FROM AUTHOR]

Volatile, reactive, and thermally stable organometallic copper and silver complexes are of significant interest as precursors for the metalorganic chemical vapor deposition (MOCVD) and atomic layer deposition (ALD) of ultra-thin metallic films. Well-established CuI and AgI precursors are commonly stabilized by halogens, phosphorous, silicon, and oxygen, potentially leading to the incorporation of these elements as impurities in the thin films. These precursors are typically stabilized by a neutral and anionic ligand. Recent advancements were established by the stabilization of these complexes using N-heterocyclic carbenes (NHCs) as neutral ligands. To further enhance the reactivity, in this study the anionic ligand is sequentially changed from β-diketonates to β-ketoiminates and β-diketiminates, yielding two new CuI and two new AgI NHC-stabilized complexes in the general form of [M(NHC) (R)] (M = Cu, Ag; R = β-ketoiminate, β-diketiminate). The synthesized complexes were comparatively analyzed in solid, dissolved, and gaseous states. Furthermore, the thermal properties were investigated to assess their potential application in MOCVD or ALD. Among the newly synthesized complexes, the β-diketiminate-based [Cu(tBuNHC) (NacNacMe)] was identified to be the most suitable candidate as a precursor for Cu thin film deposition. The resulting halogen-, oxygen-, and silicon-free CuI and AgI precursors for MOCVD and ALD applications are established for the first time and set a new baseline for coinage metal precursors. [ABSTRACT FROM AUTHOR]

Quantum dots (QDs) play an important role in fabricating electronic, photonic, and optoelectronic devices with enhanced functions and performance. There are two typical epitaxial methods for growing semiconductor QDs, one is stress-driven self-assembly, i.e., Stranski–Krastanov (S–K), and the other is droplet epitaxy (DE). The former was developed faster in earlier years and usually referred to as conventional method while the latter has attracted increasing interest in recent years driven by increasing requirement for high quality QDs towards quantum computing applications. Physically, the nucleation of QDs in both methods are self-assembly surface reactions, which have limited site-control for nucleation on flattened substrate. Pre-patterning of substrate was developed to regularly locate the nucleation sites but may also cause undesired contaminations. Laser-interference-assisted growth has emerged in the past few years, which provides a non-contact in-situ patterning for the nucleation of QDs arrays. This overview provides a glimpse of recent advances in epitaxial growth of QDs towards their advanced photonic and optoelectronic applications. [ABSTRACT FROM AUTHOR]

Heavily Si-doped GaN epitaxial layers (n+GaN) have been grown on semi-insulating 6H-SiC substrate by metal–organic chemical vapor deposition at 1030°C using H2 and N2 as carrier gases. Thin film characterization results demonstrated that n+GaN grown in N2 carrier gas has superior morphological and crystalline quality to that grown in H2. The surface morphology of n+GaN grown with N2 carrier gas is insensitive to the growth rate and SiH4 flow with Si doping concentration up to 1.1 × 1020/cm3. Secondary ion mass spectrometry analysis confirmed that C and O impurity levels in n+GaN are one order of magnitude lower with N2 carrier gas than with H2. The results thus indicate that 100% N2 could be a better carrier gas candidate to enable a broader process window for future HEMT S/D n+GaN selective area epitaxial process applications. [ABSTRACT FROM AUTHOR]

AlzGa1−zAs layers of various compositions were grown using metalorganic chemical vapor deposition on a GaAs substrate with a pattern of alternating SiO2 mask/window stripes, each 100 µm wide. Microphotoluminescence maps and thickness profiles of AlzGa1−zAs layers that demonstrated the distribution of the growth rate and z in the window were experimentally studied. It was shown that the layer growth rate and the AlAs mole fraction increased continuously from the center to the edge of the window. It was experimentally shown that for a fixed growth time of 10 min, as z increased from 0 to 0.3, the layer thickness difference between the center of the window and the edge increased from 700 Å to 1100 Å, and the maximum change in z between the center of the window and the edge reached Δz 0.016, respectively. Within the framework of the vapor -phase diffusion model, simulations of the spatial distribution of the layer thickness and z across the window were carried out. It was shown that the simulation results were in good agreement with the experimental results for the effective diffusion length D/k: Ga—85 µm, Al—50 µm. [ABSTRACT FROM AUTHOR]

Abstract Remote epitaxy, which was discovered and reported in 2017, has seen a surge of interest in recent years. Although the technology seemed to be difficult to reproduce by other labs at first, remote epitaxy has come a long way and many groups are able to consistently reproduce the results with a wide range of material systems including III-V, III-N, wide band-gap semiconductors, complex-oxides, and even elementary semiconductors such as Ge. As with any nascent technology, there are critical parameters which must be carefully studied and understood to allow wide-spread adoption of the new technology. For remote epitaxy, the critical parameters are the (1) quality of two-dimensional (2D) materials, (2) transfer or growth of 2D materials on the substrate, (3) epitaxial growth method and condition. In this review, we will give an in-depth overview of the different types of 2D materials used for remote epitaxy reported thus far, and the importance of the growth and transfer method used for the 2D materials. Then, we will introduce the various growth methods for remote epitaxy and highlight the important points in growth condition for each growth method that enables successful epitaxial growth on 2D-coated single-crystalline substrates. We hope this review will give a focused overview of the 2D-material and substrate interaction at the sample preparation stage for remote epitaxy and during growth, which have not been covered in any other review to date. Graphical Abstract

The rough morphology at the growth surface results in the non-uniform distribution of indium composition, intentionally or unintentionally doped impurity, and thus impacts the performance of GaN-based optoelectronic and vertical power electronic devices. We observed the morphologies of unintentionally doped GaN homo-epitaxially grown via MOCVD and identified the relations between rough surfaces and the miscut angle and direction of the substrate. The growth kinetics under the effect of the Ehrlich–Schwoebel barrier were studied, and it was found that asymmetric step motions in samples with a large miscut angle or those grown at high temperature were the causes of step-bunching. Meandering steps were believed to be caused by surface free energy minimization for steps with wide terraces or deviating from the [11¯00] m-direction.

A dense and smooth aluminium nitride thin film grown on a silicon (111) substrates using pulsed metal–organic chemical vapor deposition is presented. The influence of the pulsed cycle numbers on the surface morphology and crystalline quality of the aluminium nitride films are discussed in detail. It was found that 70 cycle numbers produced the most optimized aluminium nitride films. Field emission scanning electron microscopy and atomic force microscopy images show a dense and smooth morphology with a root-mean-square-roughness of 2.13 nm. The narrowest FWHM of the X-ray rocking curve for the AlN 0002 and 10–12 reflections are 2756 arcsec and 3450 arcsec, respectively. Furthermore, reciprocal space mapping reveals an in-plane tensile strain of 0.28%, which was induced by the heteroepitaxial growth on the silicon (111) substrate. This work provides an alternative approach to grow aluminium nitride for possible application in optoelectronic and power devices.

High-power quantum cascade lasers (QCLs) have a wide application prospect. In this paper, a high-power high-beam-quality device with a large ridge width is demonstrated. The effect of different ridge widths on mode loss was studied, and the results showed that the mode loss decreased as the ridge width increased. Furthermore, as the width of the ridge increased, the temperature of the active region rose. In the experiment, the wafers were grown by metal–organic chemical vapor deposition (MOCVD), and the ridge width of the device was controlled by wet etching. A laser with a ridge width of 15 µm and a length of 5 mm achieved an output of 2.2 W under 288 K continuous wave (CW) operation, with a maximum slow-axis divergence angle of 27.2° and a device wavelength of 5 μm. The research results of this article promote the industrial production of base transverse mode QCL.

Abstract In this work, the authors report the first demonstration of an ultraviolet light‐emitting diode (LED) with boron‐containing quantum wells (QWs). Secondary ion mass spectrometry measurements revealed a B concentration of 1% in the first QW with an increase in subsequent QWs and lingering decay into the p‐region, likely attributable to boron's surfactant nature. Electroluminescence emission from the BAlGaN LED was observed at 350 nm, with higher intensity compared to the AlGaN reference LED at low currents. A higher operating voltage compared to the reference LED was also observed which may be attributable to a nanomasking behaviour of boron in (Al)GaN alloys.

AlGaN grown on a GaN template usually suffers tensile stress, and the accumulated tensile stress may cause formation of cracks. In this paper, a method to reduce the tensile stress during AlGaN growth by inserting an InGaN interlayer is proposed. Although InGaN has a larger in-plane lattice constant, it will not cause the subsequent growth of AlGaN to be subject to greater tensile stress if InGaN is coherently grown on AlGaN. On the contrary, due to the low thermal expansion coefficient of InGaN, the subsequent growth of AlGaN will suffer less tensile stress through an asymmetric temperature varying process. The validity of this method was verified by in-situ curvature monitor, reciprocal space mapping and temperature-dependent Raman spectral observation. In addition, it is found by atomic force microscopy and scanning electron microscopy that the insertion of InGaN interlayer introduces V-shaped pits into the AlGaN structure which can be refilled by later AlGaN growth. It is inferred that they may play additional role in stress release similar to what the patterned substrate usually does.

In the paper, non-porous and smooth gadolinium oxide layers were synthesized on the inner surfaces of quartz glass tubes using MOCVD (Metalorganic Chemical Vapour Deposition) in the temperature range of 580–800 °C. Commercial Gd(tmhd) 3 (Tris(2,2,6,6-tetramethyl-3,5-heptanedionato)gadolinium(III), 99% (99.9%-Gd)) was a basic reactant. Pure argon (99.999%) was used as a carrier gas. Air was applied to eliminate the carbon. It also was a carrier gas. The magnitude of the extended Gr x /Re x 2 criterion did not exceed the value of 0.01. Other synthesis conditions were established in such a way that this condition was maintained. The evaporation temperature of Gd(tmhd) 3 varied in the range of 170–270 °C.The influence of the synthesis conditions on microstructure, structure and transparency of the deposited layers was investigated. Oval-shaped Gd 2 O 3 aggregates and fine crystallites were formed regardless of the synthesis conditions. The conducted research also shows that the lower deposition temperature and the higher evaporation temperature of reactant, causes smaller crystallite sizes and smaller their number. [ABSTRACT FROM AUTHOR]

A comparative study of figure-of-merit fiber sensors of the mass concentration of NaCl solutions based on single-mode and multi-mode fibers was carried out. Lossy mode resonance is realized on chemically thinned sections of optical fibers to various diameters (from 26 to 100 μm) coated with ZnTe. Thin-film coatings were applied using the method of metalorganic chemical vapor deposition (MOCVD). Samples of single-mode and multi-mode fiber sensors were created in such a way that the depth and spectral position of resonances in aqueous NaCl solutions coincided. Sensors implemented on a single-mode fiber have a higher sensitivity (5930 nm/refractive index unit (RIU)) compared to those on a multi-mode fiber (4860 nm/RIU) and a smaller half-width of the resonance in the transmission spectrum. According to the results of experiments, figure-of-merit sensors are in the range of refractive indices of 1.33–1.35 for: multi-mode fiber—25 RIU−1, single-mode fiber—75 RIU−1. The sensitivity of the resulting sensors depends on the surface roughness of the ZnTe coating. The roughness of films synthesized on a single-mode fiber is four times higher than this parameter for a coating on a multi-mode fiber. For the first time, in the transmission spectrum during the synthesis of a thin-film coating on a multi-mode fiber, the possibility of separating the first nine orders of resonances into electric and magnetic transverse components has been demonstrated. The characteristics of sensors with the operating wavelength range in the visible (500–750 nm) and infrared (1350–1550 nm) regions of the spectrum are compared. The characteristics of multi-mode lossy mode resonance sensors are demonstrated, which make them more promising for use in applied devices than for laboratory research. [ABSTRACT FROM AUTHOR]

β-Ga 2 O 3 nanowire films were prepared on Si(111) substrate by selective area growth (SAG) using metal-organic chemical vapor deposition (MOCVD). A large-area periodic nano-hole array TiN mask was fabricated. The effects of MOCVD process parameters on SAG were discussed by calculating Ga supersaturation. It was found that the SAG is closely related to the selective area nucleation and inhibition of lateral growth. Transmission electron microscopy confirmed that β-Ga 2 O 3 nanowires have a preferential orientation of the (002) crystal plane. The sample after in-situ O 2 annealing showed an x-ray diffraction intensity increase of (400), (002), and (-111) crystal planes. On this basis, P–Si/β‐Ga 2 O 3 nanowire heterojunctions were fabricated and presented high resistance of the films. At a bias voltage of 20 V, the current decreased from 6.14 × 10−6 to 2.25 × 10−6 A. The MOCVD-based SAG paves a novel way to fabricate β-Ga 2 O 3 nanowire films with high surface-to-volume ratio and homogeneity. [ABSTRACT FROM AUTHOR]

β-Ga2O3 thin films with both a 45 nm Si-doped conductive epilayer and unintentionally doped epilayer were grown on c-plane sapphire substrate by metalorganic chemical vapor deposition. β-Ga2O3 based metal–oxide–semiconductor field-effect transistors (MOSFETs) were fabricated with gate recess depths of 20 nm and 40 nm (it indicated gate depth with 70 nm and 50 nm, respective), respectively, and without said recessing process. The conductivity of β-Ga2O3 epilayers was improved through low in situ doping using a tetraethoxysilane precursor to increase MOSFET forward current density. After recessing, MOSFET operation was transferred from depletion to enhanced mode. In this study, the maximum breakdown voltage of the recessed 40 nm transistor was 770 V. The etching depth of a recessed-gate device demonstrates its influence on device electrical performance. [ABSTRACT FROM AUTHOR]

This paper investigates the mechanical properties and creep behavior of undoped and Mg-doped GaN thin films grown on sapphire substrates using metal–organic chemical vapor deposition (MOCVD) with trimethylgallium (TMG) and bis(cyclopentadienyl)magnesium (Cp2Mg) as the precursors for Ga and Mg, respectively. The Mg-doped GaN layer, with a [Mg]/[TMG] ratio of 0.33, was systematically analyzed to compare its mechanical properties and creep behavior to those of the undoped GaN thin film, marking the first investigation into the creep behavior of both GaN and Mg-doped GaN thin films. The results show that the incorporated [Mg]/[TMG] ratio was sufficient for the transition from n-type to p-type conductivity with higher hole concentration around 4.6 × 10 17 cm−3. Additionally, it was observed that Mg doping impacted the hardness and Young's modulus, leading to an approximately 20% increase in these mechanical properties. The creep exponent is also affected due to the introduction of Mg atoms. This, in turn, contributes to an increase in pre-existing dislocation density from 2 × 108 cm−2 for undoped GaN to 5 × 109 cm−2 for the Mg-doped GaN layer. The assessment of the creep behavior of GaN and Mg-doped GaN thin films reveals an inherent creep mechanism governed by dislocation glides and climbs, highlighting the significance of Mg doping concentration in GaN thin films and its potential impact on various technological applications. [ABSTRACT FROM AUTHOR]

This paper reports on improved AlGaN/GaN metal oxide semiconductor high-electron mobility transistors (MOS-HEMTs). TiO2 is used to form the dielectric and passivation layers. The TiO2 film is characterized using X-ray photoemission spectroscopy (XPS), Raman spectroscopy, and transmission electron microscopy (TEM). The quality of the gate oxide is improved by annealing at 300 °C in N2. Experimental results indicate that the annealed MOS structure effectively reduces the gate leakage current. The high performance of the annealed MOS-HEMTs and their stable operation at elevated temperatures up to 450 K is demonstrated. Furthermore, annealing improves their output power characteristics. [ABSTRACT FROM AUTHOR]

In this work, we demonstrated Ga2O3-based power MOSFETs grown on c-plane sapphire substrates using in-situ TEOS doping for the first time. The β-Ga2O3:Si epitaxial layers were formed by the metalorganic chemical vapor deposition (MOCVD) with a TEOS as a dopant source. The depletion-mode Ga2O3 power MOSFETs are fabricated and characterized, showing the increase of the current, transconductance, and breakdown voltage at 150 °C. In addition, the sample with the TEOS flow rate of 20 sccm exhibited a breakdown voltage of more than 400 V at RT and 150 °C, indicating that the in-situ Si doping by TEOS in MOCVD is a promising method for Ga2O3 power MOSFETs. [ABSTRACT FROM AUTHOR]

The compliant behavior of densely packed 10 × 10 µm2 square patterned InGaN layers on top of porous GaN is demonstrated. The elastic relaxation of the InGaN layers is enabled by the low stiffness of the porous GaN under layer. High resolution X-ray diffraction measurements show that upon InGaN re-growths on these InGaN-on-porous GaN pseudo-substrates, not only was the regrown layer partially relaxed, but the degree of relaxation of the InGaN pseudo-substrate layer on top of the porous GaN also showed an increase in the a-lattice constant. Furthermore, methods to improve the surface morphology of the InGaN layers grown by metal-organic chemical vapor deposition (MOCVD) were explored in order to fabricate InGaN pseudo-substrates for future optoelectronic and electronic devices. The largest a-lattice constant demonstrated in this study using this improved method was 3.209 Å, corresponding to a fully relaxed InGaN film with an indium composition of 0.056.

Abstract GaAs-on-Si templates with two different dislocation filter layers (DFLs) were grown at 550 °C low-temperature (LT)-DFL and 660 °C high-temperature (HT)-DFL using metal organic vapor-phase epitaxy and the effects of the growth temperature were studied. The threading dislocation density (TDD) values of LT-DFL and HT-DFL were 5.2 × 107 cm−2 and 1.5 × 107 cm−2, respectively. The 1.5 × 107 cm−2 of TDD in HT-DFL is reduced by almost one order compared to the 1.2 × 108 cm−2 of that in the control sample without DFLs. The annihilation process was mainly observed in the HT-DFL by a transmission electron microscope, resulting in a lower TDD. The 500-nm-thick GaAs bulk layer and InAs QDs were regrown on GaAs-on-Si templates and the optical properties were also evaluated by photoluminescence (PL). The highest PL peak intensity of the HT-DFL indicates that less non-radiative recombination in both the GaAs bulk and QDs occurred due to the reduced TDD. The GaAs p–i–n diodes were also fabricated to analyze the bulk leakage (J B) and the surface leakage current. The J B of HT-DFL shows the lowest value of 3.625 × 10–7 A/cm−2 at applied bias voltage of 1 V, which is 20 times lower than the J B of the control sample without DFLs. This supports that the high-temperature growth of DFL can make a good performance GaAs device on Si.

Remote epitaxy, which was discovered and reported in 2017, has seen a surge of interest in recent years. Although the technology seemed to be difficult to reproduce by other labs at first, remote epitaxy has come a long way and many groups are able to consistently reproduce the results with a wide range of material systems including III-V, III-N, wide band-gap semiconductors, complex-oxides, and even elementary semiconductors such as Ge. As with any nascent technology, there are critical parameters which must be carefully studied and understood to allow wide-spread adoption of the new technology. For remote epitaxy, the critical parameters are the (1) quality of two-dimensional (2D) materials, (2) transfer or growth of 2D materials on the substrate, (3) epitaxial growth method and condition. In this review, we will give an in-depth overview of the different types of 2D materials used for remote epitaxy reported thus far, and the importance of the growth and transfer method used for the 2D materials. Then, we will introduce the various growth methods for remote epitaxy and highlight the important points in growth condition for each growth method that enables successful epitaxial growth on 2D-coated single-crystalline substrates. We hope this review will give a focused overview of the 2D-material and substrate interaction at the sample preparation stage for remote epitaxy and during growth, which have not been covered in any other review to date. [ABSTRACT FROM AUTHOR]

We report that, for the first time, a low-temperature GaN (LT-GaN) layer prepared by metal–organic chemical vapor deposition (MOCVD) regrowth was used as a Mg stopping layer (MSL) for a GaN trench current–aperture vertical electron transistor (CAVET) with p-GaN as a carrier blocking layer (CBL). Inserting LT-GaN on top of the p-GaN effectively suppresses Mg out-diffusion into the regrown AlGaN/GaN channel, contributing to the high current capability of GaN vertical devices with a p-GaN CBL. With different MOCVD growth conditions, MSLs inserted in trench CAVETs were comprehensively investigated for the influence of MSL regrowth temperature and thickness on device performance. With the best on-state current performance obtained in this study, the trench CAVET with a 100 nm thick MSL regrown at 750 °C shows a high drain current of 3.2 kA/cm2 and a low on-state resistance of 1.2 mΩ∙cm2. The secondary ion mass spectrometry (SIMS) depth profiles show that the trench CAVET with the 100 nm thick MSL regrown at 750 °C has a dramatically decreased Mg diffusion decay rate (~39 nm/decade) in AlGaN/GaN channel, compared to that of the CAVET without a MSL (~104 nm/decade). In developing GaN vertical devices embedded with a Mg-doped p-type layer, the LT-GaN as the MSL demonstrates a promising approach to effectively isolate Mg from the subsequently grown layers. [ABSTRACT FROM AUTHOR]