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Polymeric coatings such as polyurethanes, acrylic, epoxies and silicones have been used for over 40 years to protect printed wiring boards (PWB) from moisture, handling and environmental influences. Special semiconductor grade polymers have been developed for chip passivation layers. Polyimide became the standard passivation layer for memory chips and other devices needing surface protection for handling and testing procedures. Photosensitive resins have been developed to reduce processing costs. Thin film polymers are used widely in the area of electronic packaging and as an interlayer dielectric (ILD) in nearly every electronic device. Typical layer thickness ranges from 5 μm up to 15 μm. These polymers films should be temperature stable up to range of 150°C (permanent), and for a short time up to 250°C and higher, depending on the soldering process of the components. This is the reason to use thermoset polymers in most cases. The coating process is the spin-coating technology. Spray coating and other techniques are only niche processes. The polymer supplied by the chemical company is a so-called pre-cursor consisting of a partially polymerized polymer in an organic solvent. Nearly all of the thin film polymers need a polymerization step, which is done in most cases by a thermal process after the deposition on the wafer. Polymerization changes the pre-polymer into a long-term stable and much more inherent polymerized dielectric layer. The polymerization process is generally called the cure or cure step of the process. But the definition “cure” does not mean in every case a fully finished polymerization reaction. Also partly cured polymer films are possible and becoming important if multiple layers have to be deposited. Partly polymerized layers have better adhesion to the following layer compared to fully cured ones. To get something more precise the following definitions have been used: partly cured or soft cured polymers for a 60 – 80 degree of polymerization, and full cured or hard cured for a complete polymerized layer.