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Single-crystal Aluminum Nitride (AlN) crystals enable the epitaxial growth of ultrawide bandgap Al(Ga)N alloys with drastically lower extended defect densities. Here, we report the plasma-MBE growth conditions for high Al-composition AlGaN alloys on single-crystal AlN substrates. An AlGaN growth guideline map is developed, leading to pseudomorphic AlxGa1−xN epitaxial layers with x ∼0.6–1.0 Al contents at a growth rate of ∼0.3 μm/h. These epitaxial layers exhibit atomic steps, indicating step flow epitaxial growth, and room-temperature band edge emission from ∼4.5 to 5.9 eV. Growth conditions are identified in which the background impurity concentrations of O, C, Si, and H in the MBE layers are found to be very near or below detection limits. An interesting Si segregation and gettering behavior is observed at the epitaxial AlGaN/AlN heterojunction with significant implications for the formation and transport of 2D electron or hole gases. Well-controlled intentional Si doping ranging from ∼2 × 1017 to 3 × 1019 atoms/cm3 is obtained, with sharp dopant density transition profiles. In Si-doped Al0.6Ga0.4N epilayers, a room-temperature free electron concentration of ∼3 × 1019/cm3, an electron mobility of ∼27 cm2/V s, and an n-type resistivity of ∼7.5 m Ω cm are obtained. The implications of these findings on electronic and photonic devices on single-crystal AlN substrates are discussed.

Strong Broensted acid sites were generated on Al2O3 support by the chemical vapor deposition (CVD) of SiO2 using Si(OEt)4 under atmospheric pressure. The CVD silica-alumina had a maximum acid strength of Ho = −8.2 and exhibited high catalytic activities for both the dehydration of 2-butanol and the cracking of cumene.