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A highly thermally conductive heat spreader for applications in electronic devices is becoming increasingly demanding, and therefore the removal of excess heat requires an efficient heat dissipating device. Boron nitride nanosheets (BNNSs) were prepared as thermally conductive fillers using hexagonal boron nitride (h-BN) powder as raw material by a water exfoliation method. A composite film was prepared by vacuum filtration using cellulose nanofibers (CNFs) as the substrate with an in-plane thermal conductivity (TC) of 82.4 W m−1 K−1, thermal conductivity enhancement increasing by 9,486% compared to pure cellulose film. Thus, CNF/BNNS composite films are promising as effective thermal interface materials (TIMs) in electronic devices and electronic component applications.

The rapid development of chip technology has all put forward higher requirements for highly thermally conductive materials. In this work, a new type of material of Fishbone-like silicon carbide (SiC) material was used as the filler in a polyvinylidene fluoride (PVDF) matrix. The silicon carbide/polyvinylidene fluoride (SiC/PVDF) composites were successfully prepared with different loading by a simple mixing method. The thermal conductivity of SiC/PVDF composite reached 0.92 W m−1 K−1, which is 470% higher than that of pure polymer. The results show that using the filler with a new structure to construct thermal conductivity networks is an effective way to improve the thermal conductivity of PVDF. This work provides a new idea for the further application in the field of electronic packaging.