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International audience; In this paper, a passive measurement system is used to explore the phase noise of high overtone bulk acoustic wave resonators. The chosen overtone is around 373 MHz and the temperature coefficient of frequency at room temperature is 4 ppm/K. The 1/f noise is clearly shown and a flicker floor of about σy_floor = 1.5×10-11 is demonstrated.

International audience; In this paper, passive measurement system is used to explore the phase noise of aluminum nitride contour mode resonators. Their resonant frequencies are around 220 MHz. The carrier suppression technique is used. The noise floor of the measurement system is around -135 dBc/Hz @ 1 Hz offset from the carrier. Then, measurements of several resonators are presented and discussed.

International audience; Micromanipulation is a key task to perform serial assembly of MEMS. The two-fingered microgrippers are usable but require specific studies to be able to work in the microworld. In this paper, we propose a new microgripping system where actuators and the end-effectors of the gripper are fabricated separately. End-effectors can thus be adapted to the manipulated micro-objects without new design and/or fabrication of the actuator. The assembly of the end-effectors on our piezoelectric actuators guarantee a great modularity for the system. This paper focuses on the original design, development and experimentation of new silicon end-effectors, compatible with our piezoelectric actuator. These innovative end-effectors are realized with the well known DRIE process and are able to perform micromanipulation tasks of objects whose typical size is between 5 μm and 1 mm.

Graphical abstractDisplay Omitted Cantilever thicknesses are achieved by etching at a low etching rate recipes.A small-scale thickness difference (

International audience; Getting Micro-Electro-Mechanical Systems (MEMS) out of a wafer after fabrication processes is of great interest in testing, packaging or simply using these devices. Actual solutions require special machines like wafer dicing machines, increasing time and cost of de-tethering MEMS. This article deals with a new solution for manufacturing mechanical de-tetherable silicon MEMS. The presented solution could be done with DRIE process, already used in silicon MEMS fabrication, without additional time or cost. We are proposing a new way to create a notch on tethers linking both wafer and millimetric MEMS, especially designed to break with a specified mechanical force. A theoretical silicon fracture study, the experimental results and dimensional rules to design the tethers are presented in this article. This new technique is particularly useful for microscopic MEMS parts, and will find applications in the field of the MEMS components micro-assembly.