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Condition monitoring is a cost-effective means to reduce the unscheduled maintenance cost of insulated gate bipolar transistor (IGBT) modules. The junction to case thermal resistance $R_{\mathrm {thjc}}$ is considered as a critical health indicator of IGBT module solder layer. However, thermal interface materials’ (TIMs) deterioration will not only reduce the heat dissipation performance but also affects the accuracy of $R_{\mathrm {thjc}}$ monitoring of IGBT modules. This article investigates the effect of thermal grease deterioration on $R_{\mathrm {thjc}}$ monitoring of IGBT module. First, it is found that the thermal grease deterioration will lead to the decrease of monitored $R_{\mathrm {thjc}}$ of IGBT module under the same health status of IGBT solder layer, despite that the thermal resistance of TIM increasing as deterioration of the TIM takes place. That is, the same monitored increment ratio of $R_{\mathrm {thjc}}$ caused by the solder fatigue may correspond to different health status of the IGBT module, which cannot accurately reflect its actual health status. Then, a compensation strategy for thermal resistance monitoring based on the TIM aging rate is proposed, which uses the established mapping relationship to decouple the negative coupling part of TIM degradation. The compensated thermal resistance can better reflect the actual health status of the IGBT module and approximately eliminate the negative impact. Finally, the feasibility of the proposed compensation strategy is verified by finite element model (FEM) analysis and experiments. [ABSTRACT FROM AUTHOR]

Monitoring the defective multichip insulated gate bipolar transistor (IGBT) module is a cost-effective approach to improve the quality of customer service. A method using time duration of the gate charge is proposed to monitor bond wires fatigue of the multichip IGBT modules when the modules are in the off-state. It is based on the fact that failure of the chip branch due to bond wires fatigue changes the gate input capacitance of the multichip IGBT module. The health state of bond wires can be converted into the change of time duration of gate charge under the constant gate current. A driver containing the constant current source is proposed. The study results indicate that the time duration of the gate charge decreases significantly when the failure of the chip branch occurs, and the effect of junction temperature can be ignored within the special range of gate voltage. Condition monitoring can be implemented during the off-state of the multichip module and without considering the effects of junction temperature. The confirmatory experiment is carried out to verify the correctness of the proposed method. [ABSTRACT FROM AUTHOR]