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A molecular dynamics simulation is performed to investigate the icosahedron in Mg 70 Zn 30 metallic glass during solidification at the cooling rate of 1 × 10 13  K/s. It is found that the 1551, 1541 and 1431 bond-types are closely related to 13-atom icosahedron-like clusters. Two kinds of clusters are very similar to full icosahedron in geometry. The three clusters can transform into each other by changing one bond between a pair of outer atoms. One distorted icosahedron act as the intermediate between the two others. This work provides an insight into the glass formation in alloy from the cluster-level structural viewpoint and will shed light on developing more metallic glasses. [ABSTRACT FROM AUTHOR]

Two-phase Îł -TiAl/ α 2-Ti3Al lamellar intermetallics have attracted considerable attention because of their excellent strength and plasticity. However, the exact deformation mechanisms remain to be investigated. In this paper, a solidified lamellar Tiâ€"Al alloy with lamellar orientation at 0°, 17°, and 73° with respect to the loading direction was stretched by utilizing molecular dynamics (MD) simulations. The results show that the mechanical properties of the sample are considerably influenced by solidified defects and tensile directions. The structure deformation and fracture were primarily attributed to an intrinsic stacking fault (ISF) accompanied by the nucleated Shockley dislocation, and the adjacent extrinsic stacking fault (ESF) and ISF formed by solidification tend to form large HCP structures during the tensile process loading at 73°. Moreover, cleavage cracking easily occurs on the Îł / α 2 interface under tensile deformation. The fracture loading mechanism at 17° is grain boundary slide whereas, at 73° and 0°, the dislocation piles up to form a dislocation junction. [ABSTRACT FROM AUTHOR]

• The void defects significantly affect the deformation and plasticity in FeNiCrCoCu HEAs. • The deformation behavior reveals that the void is the main cause of initial strain. • The effects of different temperatures and strain rates on FeNiCrCoCu HEAs voids were explored. • The tensile strength significantly increases at a strain rate of 1010 s−1 compared to 109 and 108 s−1. While preparing and using high entropy alloys (HEAs), many defects such as voids are inevitably formed. The effects of voids on the mechanical properties of FeNiCrCoCu HEAs are investigated using molecular dynamics simulations. The evolution of voids is examined by using models with one or two voids considering different void sizes, applied strain rates, and temperatures. The results demonstrate that the existence of the voids does influence the mechanical properties of HEAs. The tensile strength of the single-void model is higher than that of double-void model. The stress–strain curves demonstrate that a larger initial void size could reduce the tensile strength. During the tensile deformation, all dislocation emission occurs initially from the surface of the void. However, it occurs between the two voids in double-void models, which causes the deformation of the voids. With temperature increases, the tensile strength decreases. Under various strain rates, the tensile strength slightly rises at strain rates ranging from 108to 109 s−1. However, it significantly increases at a strain rate of 109 to 1010 s−1. [Display omitted] The development of void defect in FeNiCrCoCu HEAs under the tensile process at 300 K and a strain rate of 109 s−1. (a) single-void model; (b) double-void model. [ABSTRACT FROM AUTHOR]