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Demands for mobile phones with smaller form factor and lower cost have driven enhanced integration of electronics components. However, surface acoustic wave (SAW) filters must be fabricated on piezoelectric substrates, and so they are difficult to monolithically integrate on semiconductor chips. This paper reports on a compact wafer-scale packaged SAW filter stacked over a transceiver chip in a quad flat-pack no-lead (QFN) package. An integrated passive device (IPD) provided redistribution and matching between the SAW filter output and the transceiver input. Both extended global system for mobile communications (EGSM) and DCS filters were evaluated. Results demonstrated that conventional packaging techniques could be used to successfully assemble stacked SAW on transceiver modules without damage. SAW compact models based on the coupling of modes model were developed to facilitate system design. Electromagnetic simulations of coupling between SAW filters and inductors integrated on the transceiver suggested that design care is needed to avoid interactions, especially if an IPD is not used as a spacer. With appropriate design, stacked SAW filter on transceiver offers viable module integration.

A new experimental technique based on a network analyzer was developed for characterizing the full inductance matrices (both self and mutual inductance) of package/interconnect structures. This frequency-domain based measurement technique, including its formulation and procedure, is discussed in this paper. A total of four packages, an 120QFP, a 400TAB, a 313PBGA, and an Alloy 42 132CQFP were selected for the self/mutual L characterization. The measurement results are compared to those obtained by using a time domain reflectometer (TDR)-based technique as well as with the modeling data calculated by 3-D EM tools.

This paper describes a package inductance measurement technique based on network analysis and lumped element package model. Advantages of this technique include: 1. Measuring inductance over the same high operating frequencies of today's high-speed CMOS and ECL chips. 2. Providing information on a package's resonance frequencies and determining the limit of the lumped element model and 3. Utilizing a simple one-port measurement method, procedure and fixture design. Different packages and interconnects including a 120QFP, a 296TAB tape, a multilayer 224PGA and bonding wires of different length were characterized using this technique. Where possible, the inductance results obtained by this technique were compared with both modeling data and measurement data obtained by the conventional LCZ technique. In addition, the experiments were extended to compare the effective inductance of the ground path of one-metal and two-metal 360TAB tapes. The results provide important guidelines in determining design tradeoffs between one-metal and two-metal TAB tapes. >

A moment method for calculating the internal field distributions of arbitrarily shaped, inhomogeneous dielectric bodies is presented. A free-space Green's function integral equation is used with 3-D linear basis functions to describe the field variation within cells. Polyhedral volume elements are used to model the scatterer's curvature realistically without an excessive number of unknowns. A new testing procednre, called the modified Galerkin's method, is developed and used to obtain the matrix equations with less CPU time but greater accuracy. Calculated internal field distributions of dielectric spheres, spheroids, and a composite model of a rat are compared with other calculations and experimental data. The agreement is generally good.