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This study investigated the impact of the post-deposition annealing (PDA) process on the material and electrical properties of copper oxide (Cu2O) and nickel oxide (NiO) thin films deposited on a silicon carbide (SiC) substrate. Through radiofrequency (RF) sputtering, these films were subjected to PDA in a nitrogen (N2) and oxygen (O2) gas environment. Remarkably, the Cu2O films resisted phase transition following the N2 PDA process but exhibited a transition to cupric oxide (CuO) after undergoing the O2 PDA process. The symmetry of Cu 2p in the as-deposited Cu2O film was excellent; however, the phase-transformed CuO films exhibited an increase in binding energy and the emergence of satellite peaks. The Ni 2p exhibited various defects, such as nickel vacancies (VNi) and interstitial oxygen (Oi), in response to the different PDA atmospheres. The rectification ratios of the N2-annealed Cu2O and NiO devices were determined as 1.50 × 107 and 4.01 × 106, respectively, signifying a substantial enhancement by a factor of approximately 789 for the Cu2O/SiC device and 124 for the NiO/SiC device relative to their non-annealed counterparts. The findings of this study indicate that meticulous control of deposition for potential p-type materials such as Cu2O and NiO can significantly improve the performance in applications involving high-throughput and low-cost electronics. [ABSTRACT FROM AUTHOR]

The simulations and experiments for two 400 W low‐speed direct‐drive permanent magnet synchronous generators (PMSGs) installed in a Floating Kuroshio Turbine (FKT) were implemented. The towing tank experiments were carried out at National Taiwan University. A generator can start to harvest current energy at the rotation speed of 30 rpm (corresponding to the current flow rate of 0.36 m/s), and produce the rated power of 400 W at 150 rpm. The speed is very low compared with the published reports. The energy conversion efficiency of the FKT is up to 0.85. The results show that the generated direct current (DC) power is more than 800 W at a flow rate of 1.5 m/s. The power coefficient for the FKT is about 0.4. The energy loss at each stage and the power difference between the testing platform and the towing tank experiment were also analyzed. Moreover, the shape of the FKT is a new design. Compared with other structures, the proposed FKT can easily follow the direction of the ocean current and the depth of the FKT can be adjustable; when it doesn't operate, it will float on the surface so that it is easy for maintenance. [ABSTRACT FROM AUTHOR]

The objective of this paper is to propose a new method to detect the rise of equivalent series resistor in order to realize the online failure prediction of the electrolytic capacitor for LC filter of switching-mode power converter. Characteristics of electrolytic capacitors are introduced in this paper. Different experimental measurements are conducted and shown to illustrate the properties of electrolytic capacitors. The proposed online failure prediction method has the merits of low cost and circuit simplicity. It can be integrated within the package of the electrolytic capacitor to improve its reliability. Hardware experimental results are shown to verify the performance of the proposed method. Index Terms--Electrolytic capacitor, equivalent series resistor, failure prediction, switching-mode power converter.

This work demonstrates a trench isolated lateral double-implanted MOSFET (LDMOS) on Si-face in 4H-silicon carbide (SiC). A device $\vphantom {_{\int _{}}}$ where ${L}_{\textit {ch}} = 0.8\,\,\mu \text{m}$ and ${L}_{d} = 12\,\,\mu \text{m}$ shows an ${R}_{ \mathrm{\scriptscriptstyle ON},\text {sp}}$ of 22.9 $\text{m}\Omega $ cm2 at a ${V}_{\text {GS}}$ of 20 V and a breakdown voltage (BV) of 1100 V, corresponding to a high BV2/ ${R}_{ \mathrm{\scriptscriptstyle ON},\text {sp}}$ of 55.5 MW/cm2. Devices that have different ${L}_{\text {ch}}$ , ${L}_{\text {JFET}}$ , ${L}_{d}$ , and P-top dose values are measured in order to investigate the effects of geometry on the static performance. Operations at 150 °C are measured to evaluate the temperature performance. Gate charge waveforms are also measured in order to include the switching performance in the evaluation. The ${R}_{ \mathrm{\scriptscriptstyle ON}} \times {Q}_{G}$ and ${R}_{ \mathrm{\scriptscriptstyle ON}} \times {Q}_{\text {GD}}$ values are calculated as 17.7 and $9.0~\Omega $ nC, respectively, which are promising for power-integrated circuit applications. [ABSTRACT FROM AUTHOR]

Herein, solution‐processed indium gallium zinc oxide (IGZO) thin‐film transistor (TFT) is fabricated utilizing metal nitrates as precursors, and the impact of nitrate ions in different solvents on the performances of IGZO TFT is demonstrated. During IGZO film fabrication, the nitrogen in nitrate species actually dopes into the film in the fashion of different chemical states depending on different solvents. When IGZO precursors dissolve in deionized water (DIW), due to the high polarity of the solvent, metal nitrates are completely dissociated, leading to the conversion of nitrates to nitrides in IGZO film. This nitrogen decreases the density of the interface trap states, thus improving the characteristics of the IGZO TFT. In contrast, when using 2‐methoxyethanol (2‐ME) as the solvent, nitrogen mainly forms nitrogen oxide and acts as a trap density that leads to the degradation of the device performances. By increasing the annealing temperature of IGZO film, nitrogen oxide can convert to metal nitride, resulting in enhanced device performance. The IGZO TFT fabricated using DIW as a solvent with 300 °C annealing temperature exhibits the saturation mobility of 2.5 cm2 V−1 s−1 and Ion/off ratio of >106.5. Herein, a step is made toward the solvent effect on the performance of solution‐processed oxide TFT. [ABSTRACT FROM AUTHOR]