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A Silicon-On-Insulator (SOI) Technology is suitable for vertex detectors for high energy physics experiments since complex functions can be fabricated on the SOI wafer with a small amount of material thanks to the monolithic structure. We developed a new sensor processing scheme “PIXOR(PIXel OR)” for pixel detectors using a LAPIS 0.20 μ m SOI process. An analog signal from each pixelated sensor is divided into two dimensional directions, and 2 n signal channels from a small n by n pixel matrix are ORed as n column and n row channels, then the signals are processed by a readout circuit in each small matrix. This PIXOR scheme reduces the number of readout channels and avoids a deterioration of intrinsic position resolution due to large circuit area, that was a common issue for monolithic detectors. This feature allows high resolution, low occupancy and on-sensor signal processing at the same time. We present the successful results of the PIXOR readout scheme using a first prototype.

We have been developing active pixel sensors based on silicon-on-insulator technology for future X-ray astronomy missions. Recently we fabricated the new prototype named “XRPIX2”, and investigated its spectroscopic performance. For comparison and evaluation of different chip designs, XRPIX2 consists of 3 pixel types: Small Pixel, Large Pixel 1, and Large Pixel 2. In Small Pixel, we found that the gains of the 68% pixels are within 1.4% of the mean value, and the energy resolution is 656 eV (FWHM) for 8 keV X-rays, which is the best spectroscopic performance in our development. The pixel pitch of Large Pixel 1 and Large Pixel 2 is twice as large as that of Small Pixel. Charge sharing events are successfully reduced for Large Pixel 1. Moreover Large Pixel 2 has multiple nodes for charge collection in a pixel. We confirmed that the multi-nodes structure is effective to increase charge collection efficiency.

We have been developing a monolithic active pixel sensor with the silicon-on-insulator (SOI) CMOS technology for use in future X-ray astronomical satellite missions. This sensor is called XRPIX. Our objective is to replace the X-ray CCD, which is currently the standard detector in the field, with the developed XRPIX, which offers high coincidence time resolution (~ 50 ns), superior hit-position readout time (~ 10 μs), and wide bandpass (0.5-40 keV), in addition to having comparable performance in terms of imaging spectroscopy. In our previous study, we built a prototype sensor called XRPIX1 and confirmed its basic X-ray imaging spectroscopy performance in a mode that read out the entire area (all pixels). The next step is to realize a high-speed, intelligent readout for X-ray detection. XRPIX1 comprises a trigger circuit for each pixel, so as to detect an X-ray photon injection; this system is capable of direct access to selected pixels to read out the signal amplitude. We describe the design of the trigger circuitry system and report on the first resolved X-ray spectra obtained in the trigger-driven readout mode.

We have been developing monolithic active pixel sensors with 0.2 μm Silicon-On-Insulator (SOI) CMOS technology, called SOIPIX, for high-speed wide-band X-ray imaging spectroscopy on future astronomical satellites. In this work, we investigate a revised chip (XRPIX1b) for soft X-rays used in frontside illumination. The Al Kα line at 1.5 keV is successfully detected and energy resolution of 188 eV (FWHM) is achieved from a single pixel at this energy. The responsivity is improved to 6 μV/electron and the readout noise is 18 electrons rms. Data from 3 ×3 pixels irradiated with 6.4 keV (Fe Kα) X-rays demonstrates that the circuitry crosstalk between adjacent pixels is less than 0.5%.

We have been developing an active pixel sensor for X-ray astronomy. In this paper, we report on the design and the characterizationof the recently-developed device named XRPIX1-FZ.We applied the high-resistivitySiwafer(∼7 kΩ cm) to the sensor layer for a thick depletion layer. The chemical-mechanical polishing, which we applied to smooth the rough backside of the Si wafer, successfully reduced the dark current. We used the single-pixel readout mode and achievedthe energy resolution of 260eVinFWHMat8keV.Moreover, we developed the 3 × 3pixel readout mode for the evaluation of split events and confirmed the full depletion of 250 μm thick at thereverse-biasvoltageof30 V

We have been developing a monolithic active pixel sensor with the 0.2 μm Silicon-On-Insulator (SOI) CMOS technology, called SOIPIX, for the wide-band X-ray imaging spectroscopy on future astronomical satellites. SOIPIX includes a thin CMOS-readout-array layer and a thick high-resistivity Si-sensor layer stacked vertically on a single chip. This arrangement allows for fast and intelligent readout circuitries on-chip, providing advantages over the charge-coupled device (CCD). We have designed and built a new SOIPIX prototype XRPIX1 for X-ray detection. XRPIX1 implements a correlated double sampling (CDS) readout circuit in each pixel to suppress the reset noise. We obtained an energy resolution of full width at half maximum of 1.2 keV (5.4%) at 22 keV with a chip having a 147 μm sensor depletion at a back bias of 100 V cooled to -50°C. Moreover, XRPIX1 offers intra-pixel hit trigger (timing) and two-dimensional hit-pattern (position) outputs. We also confirmed the trigger capability by irradiating a single pixel with laser light.

In order to investigate the p-side strip isolation, position sensitivity and charge collection of type-inverted double-sided silicon microstrip detectors, signal amplitude and charge sharing of adjacent strips were measured by using a laser test stand, following the irradiation with a flux of 3.8×1013 /cm2 of 12 GeV protons. The irradiated detectors indicated high bulk resistivity, which results in maintaining a position sensitivity of the ohmic contact side even below the full depletion voltage. This fact suggests a possibility of operation of a double-sided detector whose full depletion voltage becomes higher than its breakdown limit because of a radiation damage.

A large area (63.6 mm/spl times/64 mm) n-on-n silicon strip detector was fabricated, implementing various p-stop structures in the n-side. The detectors were characterized in laboratory and in beam tests. The inter-strip capacitance showed features in which the individual p-stop structure had the longest tail toward saturation. The beam tests showed other p-stop structures collected more charge in the mid-strip region than the individual p-stop structure. In addition, there was a source which lost or spread charge and induced noise where the over-depletion was insufficient.

We report the results of a beam test at KEK using double-sided AC-coupled silicon microstrip detectors with binary readout, i.e., a readout where the signals are discriminated in the front-end electronics and only the hit location as kept. For strip pitch between 50/spl mu/ and 200/spl mu/, we determine the efficiency and the noise background as function of threshold setting. This allows us to reconstruct the Landau pulse height spectrum and determine the signal/noise ratio. In addition, the threshold/noise ratio necessary for operation with low occupancy is determined. >