1. Low-Temperature (260 °C) Solderless Cu–Cu Bonding for Fine-Pitch 3-D Packaging and Heterogeneous Integration
- Author
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Seungmin Park, Haesung Park, Sarah Eunkyung Kim, Hankyeol Seo, and Yoonho Kim
- Subjects
010302 applied physics ,Materials science ,Fine pitch ,02 engineering and technology ,Plasma ,Nitride ,021001 nanoscience & nanotechnology ,01 natural sciences ,Industrial and Manufacturing Engineering ,Electronic, Optical and Magnetic Materials ,Field emission microscopy ,Chemical state ,X-ray photoelectron spectroscopy ,0103 physical sciences ,Shear strength ,Response surface methodology ,Electrical and Electronic Engineering ,Composite material ,0210 nano-technology - Abstract
Low-temperature solderless Cu–Cu bonding is an important technology for advanced packaging, such as fine-pitch 3-D packaging and heterogeneous integration. In this study, we prepared an oxidation-free Cu surface using an optimized N2 plasma process in a two-step Ar/N2 plasma treatment based on the design of the experiment method, to improve direct Cu–Cu bonding quality at 260 °C. The N2 plasma treatment process was optimized using the Minitab optimizer with chemical state results obtained by X-ray photoelectron spectroscopy (XPS) analysis. The Cu surface treated under the two-step Ar/N2 plasma with optimized N2 plasma conditions not only formed Cu nitride well, but the surface remained without further oxidation for at least one week at room temperature. The Cu–Cu bonding was performed at the low bonding temperature of 260 °C and low bonding pressure of 0.9 MPa for 1 hour, and the bonded interface was evaluated using scanning acoustic tomography (SAT) and field emission scanning electron microscope (FE-SEM) images. We measured shear strength to estimate the bonding interface quality of the oxidation-free Cu–Cu bonding specimen. A maximum shear strength of 62.6 MPa was obtained. Our bonding results demonstrated remarkably improved Cu–Cu bonding quality compared with other previous Cu–Cu joint studies that used Sn, Cu/Ag nanoparticles, or Cu composites.
- Published
- 2021