1. Reduced Thermal Conductivity of Mg2(Si, Sn) Solid Solutions by a Gradient Composition Layered Microstructure
- Author
-
Zhifang Zhou, Yuanhua Lin, Yoshisato Kimura, Yu Ikuta, Yaw Wang Chai, and Yonghoon Lee
- Subjects
010302 applied physics ,Materials science ,Phonon scattering ,Non-equilibrium thermodynamics ,02 engineering and technology ,021001 nanoscience & nanotechnology ,Thermoelectric materials ,Microstructure ,01 natural sciences ,Thermal conductivity ,0103 physical sciences ,Thermoelectric effect ,General Materials Science ,Composite material ,0210 nano-technology ,Layer (electronics) ,Solid solution - Abstract
Solid solutioning of Mg2(Si, Sn) has been a promising approach in reducing thermal conductivity and leads to improvement of thermoelectric performance. In addition to the Mg2(Si, Sn) solid solutions, we have noticed a layered structure with a gradient composition, which is formed by nonequilibrium solidification and peritectic reaction process and can provide further reduction of thermal conductivity of the Mg2(Si, Sn) solid solutions. All layers of the layered structure have the same face-centered cubic-based structure but varying Sn/Si concentration ratios in each layer. The interfaces between the layers are semi-coherent, reticulating with different numbers of misfit dislocations. Such an interfacial structure brings large numbers of phonon-scattering sources, resulting in further reduction of thermal conductivity in the Mg2(Si, Sn) solid solutions. Consequently, the undoped Mg2Si0.75Sn0.25 containing a higher density of the layered structure has relatively lower thermal conductivity, 1.9 W m-1 K-1 at 523 K, than Mg2Si0.25Sn0.75 with a much lower density of the layered structure, 2.3 W m-1 K-1 at 523 K.
- Published
- 2020
- Full Text
- View/download PDF