1. Fatigue-induced interface damage in Cu/V nanoscale metallic multilayers
- Author
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Hua Wei, Siyuan Wei, Jiangwei Wang, Shijian Zheng, and Zhiyu Zhao
- Subjects
010302 applied physics ,Materials science ,Mechanical Engineering ,Lüders band ,Metals and Alloys ,Heterojunction ,02 engineering and technology ,021001 nanoscience & nanotechnology ,Condensed Matter Physics ,01 natural sciences ,Bimetal ,Metal ,Mechanics of Materials ,visual_art ,0103 physical sciences ,visual_art.visual_art_medium ,General Materials Science ,Deformation (engineering) ,Composite material ,0210 nano-technology ,Nanoscopic scale ,Damage tolerance ,Nanopillar - Abstract
The mechanism of fatigue-induced interface damage in Cu/V nanoscale metallic multilayers was systematically investigated using the state-of-the-art in situ transmission electron microscopy. Upon cyclic compression, Cu/V nanoscale metallic multilayers show an interface-controlled fatigue deformation, and the interface morphology of Cu/V nanopillars changes significantly after 200 cyclic loadings. Cyclic deformation induced nanoscale intrusions/extrusions on the bimetal interface, while no sign of persistent slip bands or crack was observed. Formation of the nano-intrusions/extrusions can be attributed to the reciprocating defect motion and severe defect-interface interactions during the fatigue testing. This study provides a unique mechanistic understanding on the fatigue damage in metallic multilayers at nanoscale and sheds light on tailoring the damage tolerance of heterostructures via interface engineering.
- Published
- 2021
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