1. Self Aligning Growth of Nanoparticle-Based Interconnects
- Author
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Jacobs Heiko, Nahrstedt Helene, Pezoldt Jorg, Isaac Nishchay, Reiprich Johannes Thomas, and Schlag Leslie
- Subjects
Wire bonding ,Yield (engineering) ,Materials science ,business.industry ,Nanowire ,Process (computing) ,Nanoparticle ,02 engineering and technology ,Substrate (printing) ,010402 general chemistry ,021001 nanoscience & nanotechnology ,01 natural sciences ,0104 chemical sciences ,Resist ,Optoelectronics ,0210 nano-technology ,business ,Throughput (business) - Abstract
This paper presents a self-adjusting nanowire bonding process to produce free-standing point-to-point electrical connections. Wire diameters up to 200 nm and contact pads up to 1 μrm are shown. In addition, the process is a parallel process to achieve higher throughput compared to the new serial direct write or established serial wire bonding methods. Generated nanoparticles are captured directly on the substrate, resulting in a high material yield. The method presented is based on what is best described as “gas-phase electrodeposition”.
- Published
- 2018