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Your search keyword '"Khaoula Ait-Belaid"' showing total 3 results
Start Over Author "Khaoula Ait-Belaid" Topic 0202 electrical engineering, electronic engineering, information engineering
3 results on '"Khaoula Ait-Belaid"'

1. Genetic Algorithms and Particle Swarm Optimization Mechanisms for Through-Silicon Via (TSV) Noise Coupling

Author

Hassan Belahrach, Hassan Ayad, and Khaoula Ait Belaid

Subjects
Article Subject, Computer Networks and Communications, Computer science, Computational Mechanics, 02 engineering and technology, Integrated circuit, 01 natural sciences, Transfer function, law.invention, Artificial Intelligence, law, 0103 physical sciences, 0202 electrical engineering, electronic engineering, information engineering, Time domain, Civil and Structural Engineering, Electronic circuit, 010302 applied physics, Through-silicon via, Analytical technique, Particle swarm optimization, 020206 networking & telecommunications, QA75.5-76.95, Computer Science Applications, Noise, Electronic computers. Computer science, Algorithm
Abstract

In this paper, two intelligent methods which are GAs and PSO are used to model noise coupling in a Three-Dimensional Integrated Circuit (3D-IC) based on TSVs. These techniques are rarely used in this type of structure. They allow computing all the elements of the noise model, which helps to estimate the noise transfer function in the frequency and time domain in 3D complicated systems. Noise models include TSVs, active circuits, and substrate, which make them difficult to model and to estimate. Indeed, the proposed approaches based on GA and PSO are robust and powerful. To validate the method, comparisons among the results found by GA, PSO, measurements, and the 3D-TLM method, which presents an analytical technique, are made. According to the obtained simulation and experimental results, it is found that the proposed methods are valid, efficient, precise, and robust. more...

Published
2021

2. Numerical Laplace Inversion Method for Through-Silicon Via (TSV) Noise Coupling in 3D-IC Design

Author

Hassan Belahrach, Hassan Ayad, and Khaoula Ait Belaid

Subjects
Laplace inversion, Computer Networks and Communications, Computer science, lcsh:TK7800-8360, 02 engineering and technology, Hardware_PERFORMANCEANDRELIABILITY, 3d ic design, Topology, 3d integrated circuit, RDL, 0202 electrical engineering, electronic engineering, information engineering, Hardware_INTEGRATEDCIRCUITS, TSV noise coupling, Electrical and Electronic Engineering, MATLAB, computer.programming_language, chain matrix, Through-silicon via, Laplace transform, lcsh:Electronics, 020206 networking & telecommunications, Coupling noise, Inversion (meteorology), 3D-IC design, Hardware and Architecture, Control and Systems Engineering, interconnect line, Signal Processing, 020201 artificial intelligence & image processing, NILT, computer
Abstract

Typical 3D integrated circuit structures based on through-silicon vias (TSVs) are complicated to study and analyze. Therefore, it seems important to find some methods to investigate them. In this paper, a method is proposed to model and compute the time-domain coupling noise in 3D Integrated Circuit (3D-IC) based on TSVs. It is based on the numerical inversion Laplace transform (NILT) method and the chain matrices. The method is validated using some experimental results and the Pspice and Matlab tools. The results confirm the effectiveness of the proposed technique and the noise is analyzed in several cases. It is found that TSV noise coupling is affected by different factors such as source characteristics, horizontal interconnections, and the type of Inputs and Outputs (I/O) drivers. more...

Published
2019
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3. Investigation and Analysis of the Simultaneous Switching Noise in Power Distribution Network with Multi-Power Supplies of High Speed CMOS Circuits

Author

Hassan Ayad, Hassan Belahrach, and Khaoula Ait Belaid

Subjects
Engineering, Article Subject, business.industry, 020209 energy, Electrical engineering, 020206 networking & telecommunications, 02 engineering and technology, Noise (electronics), Electronic, Optical and Magnetic Materials, Admittance parameters, Power (physics), CMOS, Frequency domain, 0202 electrical engineering, electronic engineering, information engineering, Electronic engineering, lcsh:Electrical engineering. Electronics. Nuclear engineering, Electrical and Electronic Engineering, business, Electrical impedance, lcsh:TK1-9971, Electronic circuit, Voltage
Abstract

The paper studies a simultaneous switching noise (SSN) in a power distribution network (PDN) with dual supply voltages and two cores. This is achieved by reducing the admittance matrix Y of the PDN then calculating frequency domain impedance with rational function approximation using vector fitting. This paper presents a method of computing the simultaneous switching noise through a switching current, whose properties and details are described. Thus, the results are discussed and performed using MATLAB and PSpice tools. It demonstrated that the presence of many cores in the same PCB influences the SSN due to electromagnetic coupling. more...

Published
2017