1. Humidity Robustness of Plasma-Coated PCBs
- Author
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Feng Li, Samir Loulidi, Iris De Graeve, Aliakbar Khangholi, Rajan Ambat, Annick Hubin, Guy Van Assche, Kamila Piotrowska, Faculty of Engineering, Materials and Surface Science & Engineering, Faculty of Economic and Social Sciences and Solvay Business School, Materials and Chemistry, Physical Chemistry and Polymer Science, Earth System Sciences, Electrochemical and Surface Engineering, In-Situ Electrochemistry combined with nano & micro surface Characterization, and Architectural Engineering
- Subjects
Materials science ,02 engineering and technology ,engineering.material ,Plasma coatings ,01 natural sciences ,Capacitance ,climatic conditions ,Coating ,0103 physical sciences ,Materials Chemistry ,Electrical and Electronic Engineering ,Composite material ,Thermal analysis ,010302 applied physics ,Moisture ,food and beverages ,Humidity ,Biasing ,021001 nanoscience & nanotechnology ,Condensed Matter Physics ,Plasma polymerization ,Electronic, Optical and Magnetic Materials ,Dielectric spectroscopy ,Corrosion ,engineering ,0210 nano-technology ,water uptake - Abstract
The reliability of printed circuit boards (PCB) is at risk due to continuous miniaturization. As a result, PCBs are more susceptible to external factors such as humidity, temperature, contamination, etc., which affect their general performance, leading to failure of electronic devices. Therefore, protection of the devices against these factors is gaining greatly in importance. Plasma polymerization is used as a method to form a protective barrier by applying plasma polymer films on PCBs. However, the humidity robustness of such plasma coatings on the PCB surface is unknown. In this work, several methods were used to characterize two types of plasma-coated PCBs based on 1H,1H,2H-perfluorodecyl acrylate precursor (single-layer and stacked coatings) upon exposure to humidity, temperature, and bias voltage. Modulated-temperature differential scanning calorimetry enabled thermal analysis of the plasma coatings. Electrochemical impedance spectroscopy in combination with the gravimetric moisture vapor sorption technique were used to study the interaction of these coatings with moisture and quantify the water uptake. The results revealed an only 2% increase of the capacitance of the coatings due to water uptake. Direct-current (DC) leakage current measurements were used to study the influence of a bias voltage applied between the electrodes on the coated PCBs upon exposure to cyclic climatic conditions. Electrical DC testing revealed the protective character of the stacked coating, which did not fail under the given stress conditions, in contrast to the single-layer plasma coatings.
- Published
- 2019
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